10AS057H1F34I1HG - Arria 10 SX SoC FPGA, 570K LE | Intel
N.º de pieza: 10AS057H1F34I1HG ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $4442.27 | $4.442,27 |
| 10 | $4200 | $42.000,00 |
| 100 | $3950 | $395.000,00 |
| 500 | $3700 | $1.850.000,00 |
| 1.000 | $3500 | $3.500.000,00 |
10AS057H1F34I1HG Descripción general
An SoC FPGA is a class of heterogeneous computing device that fuses a hard processor system (HPS) with programmable logic (PL) in one silicon die. In the system hierarchy it sits between a microcontroller (fixed-instruction, low-power) and a CPU + discrete FPGA combination. The HPS executes operating systems and control code while the PL implements high-throughput data-plane logic, DSP blocks, and high-speed serial interfaces - delivering higher determinism and lower latency than discrete multi-chip solutions.
Key features of the 10AS057H1F34I1HG include 570K logic elements, integrated dual-core ARM Cortex-A9 with NEON media engine, embedded DDR4/HPDR memory controllers, and high-speed serial transceivers suitable for PCIe Gen3 and 10G Ethernet. The SoC FPGA also includes hardened floating-point DSP blocks, hardware memory controllers, and a rich peripheral set including USB, Ethernet MAC, and UART. The FCBGA-1152 package provides 492 user I/O pins plus dedicated high-speed serial and memory interfaces.
Built on a TSMC 20 nm process, the Arria 10 SX family balances power efficiency with mid-range FPGA capacity, targeting bandwidth-intensive applications where deterministic latency and software/firmware co-processing matter more than raw logic density. The HPS and PL communicate via a wide on-chip bus with coherency support, simplifying ARM-to-FPGA register hand-off for hybrid workloads.
Typical applications include wireless baseband processing, software-defined radio, military/aerospace signal processing, medical imaging, industrial machine vision, and high-performance embedded compute platforms. The combination of ARM Cortex-A9 cores and 570K logic elements suits multi-protocol bridging, real-time DSP, and custom protocol offload engines.
When designing with this device, ensure the PCB accommodates the 35x35 mm BGA with high-speed serial routing and matched-length DDR4 traces. Thermal design is critical - the FCBGA package typically requires a heatsink or forced-air cooling at industrial temperature grades.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas directas para 10AS057H1F34I1HG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10AS057H1F34I1HG (mismo factor de forma y huella) — difiere en Package, Logic Elements, Speed Grade, Mounting Type, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10AS057H1F34E1HG
✅ Sustitución directa✓ En stock
$3300 / unidad
Ver hoja de datos →10AS057H2F34I1HG
✅ Sustitución directa✓ En stock
$4980.3 / unidad
Ver hoja de datos →10AS066H1F34I1HG
✅ Sustitución directa✓ En stock
$3720 / unidad
Ver hoja de datos →10AS048H1F34I1HG
✅ Sustitución directa✓ En stock
$2650 / unidad
Ver hoja de datos →10AS032H1F34I1HG
✅ Sustitución directa✓ En stock
$2077.26 / unidad
Ver hoja de datos →10AS057H1F34I1HG Valores máximos y características eléctricas
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 570K |
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Core Frequency | 1.5 GHz |
| Encapsulado | 1152-FBGA, FCBGA (35x35 mm) |
| User I/O Count | 492 |
| Process Technology | TSMC 20 nm |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Memory Interface | DDR4 with hard memory controller |
| High-Speed Serial Transceivers | Up to 24 channels (PCIe Gen3 capable) |
| DSP Blocks | Hardened floating-point DSP |
| HPS Peripherals | USB, Ethernet MAC, UART, SPI, I2C |
| Tipo de montaje | Surface Mount (BGA) |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
Guía de configuración de pines de 10AS057H1F34I1HG 1152-fbga, fcbga (35x35 mm)
Configuración de pines para 10AS057H1F34I1HG (encapsulado 1152-fbga, fcbga (35x35 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10AS057H1F34I1HG.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10AS057H1F34I1HG es adecuado para 6 aplicacións: Wireless Baseband Processing, Software-Defined Radio (SDR), Military and Aerospace Signal Processing, Medical Imaging Systems, Industrial Machine Vision, High-Performance Embedded Compute.
Wireless Baseband Processing
The 10AS057H1F34I1HG fits wireless baseband processing because its 570K logic elements and 24 high-speed serial transceivers handle multi-antenna (MIMO) baseband DSP with headroom. The dual ARM Cortex-A9 HPS runs the PHY/MAC stack while the PL accelerates FFT, channel estimation, and turbo/LDPC decoding. Throughput on a 4x4 LTE 20 MHz chain is typically 600 Mbps sustained when compiled with DSP blocks. Power consumption at full load is approximately 25-30 W, requiring active cooling. Choose 10AS066 if your baseband needs more than 570K LE.
Recomendado
Software-Defined Radio (SDR)
The 10AS057H1F34I1HG is well-suited for software-defined radio because its multi-gigabit serial transceivers handle RF ADC/DAC data streams up to 10 Gbps while the PL implements real-time demodulation. The ARM Cortex-A9 HPS runs Linux/RTOS for protocol management. Typical SDR use cases include tactical radios, spectrum monitoring, and 5G prototyping where latency below 1 us is critical. The 492 user I/O pins accommodate parallel ADC/DAC interfaces. Expect 15-20 W power consumption for wideband processing.
Recomendado
Military and Aerospace Signal Processing
The 10AS057H1F34I1HG suits defense signal processing because its industrial temperature grade and hardened ARM cores deliver reliable operation in vibration and thermal-stress environments. Applications include radar signal processing, electronic countermeasures (ECM), and secure communications. The 570K logic elements handle phased-array beamforming, pulse compression, and I/Q demodulation. Conformal coating and ruggedized enclosures are typical. For full MIL-spec screening, source from MIL-PRF-38535 qualified lots or use the 10AS057H1F34I1HG with extended reliability testing.
Recomendado
Medical Imaging Systems
The 10AS057H1F34I1HG fits medical imaging (ultrasound, CT, MRI pre-processing) because its DSP blocks accelerate real-time beamforming and image reconstruction while the ARM cores manage the user interface and DICOM stack. The hard DDR4 memory controller manages high-bandwidth image data buffers (4K x 4K frames at 30 fps). Latency from ADC input to display output is typically below 50 ms. IEC 60601-1 compliance requires additional isolation and EMC filtering beyond the FPGA. Expect 18-25 W power dissipation during scan operation.
Recomendado
Industrial Machine Vision
The 10AS057H1F34I1HG is ideal for high-speed industrial machine vision because its 492 user I/Os handle multi-camera MIPI CSI-2 or LVDS inputs while the PL runs real-time defect detection algorithms. The ARM Cortex-A9 HPS executes the vision pipeline scheduler and PLC communication (EtherCAT, PROFINET). Typical throughput is 8 MP at 60 fps per camera with 4-camera aggregation. The FCBGA-1152 package suits IP67-rated enclosures with thermal management. Power budget is 20-25 W per FPGA in vision systems.
Recomendado
High-Performance Embedded Compute
The 10AS057H1F34I1HG works in embedded compute platforms where ARM Cortex-A9 Linux execution must be paired with hardware-accelerated algorithms. Use cases include protocol bridges, custom encryption offload, and AI inference at the edge. The coherent HPS-to-PL bus enables zero-copy data sharing between processors and fabric accelerators, achieving 10-50x speedup over CPU-only execution. Typical workloads: 10 GbE packet processing, NVMe-over-Fabric, and custom DSP. Power consumption scales with PL utilization from 8-25 W.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10AS057H1F34I1HG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10AS057H1F34E1HG | 10AS057H2F34I1HG | 10AS066H1F34I1HG | 10AS048H1F34I1HG | 10AS032H1F34I1HG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA, FCBGA (35x35 mm) | 1152-FBGA, FCBGA (35x35 mm) - same | 1152-FBGA, FCBGA (35x35 mm) - same | 1152-FBGA, FCBGA (35x35 mm) - same | 1152-FBGA, FCBGA (35x35 mm) - same | 1152-FBGA, FCBGA (35x35 mm) - same |
| Logic Elements | 570K | 570K | 570K | 660K | 480K | 320K |
| Processor Core | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Speed Grade | H1 | H1 | H2 (faster) | H1 | H1 | H1 |
| Maximum Core Frequency | 1.5 GHz | 1.5 GHz | 1.5 GHz (H2 grade) | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| User I/O | 492 | 492 | 492 | 492 | 492 | 492 |
| Process Technology | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm | TSMC 20 nm |
| Operating Temperature | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes |
Diferenciadores clave
- 570K LE in the F34 FCBGA-1152 footprint with dual ARM Cortex-A9 HPS (frente a 10AS048H1F34I1HG (480K LE))
- Industrial temperature grade I1 with -40C to +100C junction operation (frente a 10AS057H1F34C1HG (commercial 0C to +85C))
- H1 speed grade balances cost with adequate performance for most applications (frente a 10AS057H2F34I1HG (H2 faster speed grade))
- 20 nm TSMC process delivers optimal performance/watt at mid-range capacity (frente a Smaller Agilex 7 devices)
Notas de diseño
Estimated: the Arria 10 SX SoC at full utilization (570K LE + dual ARM cores at 1.5 GHz) dissipates approximately 25-30 W in the FCBGA-1152 package. Theta_JA for the 35x35 mm BGA with standard 2s2p PCB and no heatsink is roughly 8-12 C/W, giving a 200-360 C junction temperature rise above ambient at full load. A heatsink with thermal interface material (TIM) is required for industrial temperature operation; consider active cooling for sustained workloads above 80% utilization.
The FCBGA-1152 (35x35 mm) package with 1.0 mm ball pitch requires an HDI PCB stackup with microvia (laser-drilled) technology. Use a 1-2-1 or 1-2-2 build-up with sequential lamination. Maintain 50 ohm controlled impedance for high-speed serial transceiver lanes and 85-100 ohm differential for DDR4. The breakout region requires careful fanout routing; allow at least 4 PCB layers for BGA escape with microvia-to-buried-via transitions.
The Arria 10 SX SoC FPGA requires multiple power rails: 0.9V core (VCC), 0.9V/1.1V transceiver supplies, 1.8V/2.5V/3.3V auxiliary I/O, DDR4 supply (1.2V VTT), and PLL analog supplies. Use a sequenced power supply with monotonic startup; Intel recommends the Enpirion EM2xxx or similar PMICs for Arria 10. Estimated: total power supply budget is 30-40 W including losses, requiring a 50 W capable DC-DC chain with proper input filtering.
Place the DDR4 memory devices on the same side of the PCB as the Arria 10 SX within 50 mm to maintain signal integrity. Use matched-length traces within +/-25 mil tolerance for byte lanes and +/-50 mil for command/address. Decouple each power pin with 100 nF X7R ceramic capacitors and bulk 22-47 uF polymer capacitors near each supply island. Series-termination resistors may be required on high-speed serial lines - consult the Intel Arria 10 transceiver user guide.
Common pitfalls with Arria 10 SX SoC designs: (1) Failing to power-cycle correctly after configuration error - the HPS may hold the PL in reset; (2) Incorrect JTAG chain configuration when using both HPS JTAG and FPGA JTAG; (3) Forgetting to enable the HPS-to-PL bridge in the device tree for Linux; (4) Using wrong Quartus version for the silicon revision (Rev A vs Rev B); (5) Exceeding the maximum transceiver lane count when the HPS uses shared SERDES resources. Always validate with the latest Intel Quartus Prime design examples.
Información de cumplimiento
RoHS compliant per Intel/Altera product page. AEC-Q100 not applicable - this is an FPGA, not an automotive IC. Halogen-free status not explicitly stated in available data.
