10AS066H1F34I1HG - Arria 10 SX SoC FPGA, 660K LE | Intel
N.º de pieza: 10AS066H1F34I1HG ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $4850 | $4.850,00 |
| 10 | $4650 | $46.500,00 |
| 100 | $4310 | $431.000,00 |
| 500 | $3990 | $1.995.000,00 |
| 1.000 | $3720 | $3.720.000,00 |
10AS066H1F34I1HG Descripción general
An SoC FPGA is an integrated circuit that combines a programmable logic fabric (the FPGA side) with one or more hard processor cores (the HPS side) on the same die. Compared with a discrete FPGA + external MCU/MPU architecture, this integration eliminates inter-chip PCB traces between processor and fabric, reducing latency, board area, bill-of-materials cost, and power while enabling tight co-design of hardware accelerators with software. The Arria 10 SX family sits in Intel's mid-range, transceiver-rich segment, positioned between lower-cost Cyclone/MAX families and the high-end Stratix 10 family.
Key features include approximately 660K logic elements, embedded hardened memory and DSP blocks, high-speed transceivers, and a 32-bit DDR3/DDR4 capable HPS memory controller. The 1152-ball FCBGA package exposes all transceiver, HPS, and general-purpose I/O signals and is suitable for high-channel-count designs. Industrial temperature grade (I) is indicated by the part number suffix. According to the Altera/Intel Arria 10 device overview, the SX variant pairs the HPS with the FPGA fabric optimized for DSP and transceiver-heavy workloads.
Typical applications include high-performance digital signal processing for wireless baseband, radar and electronic warfare, professional video broadcast and image processing, industrial machine vision and motor control, and high-throughput data acquisition. The integrated ARM Cortex-A9 cores allow Linux/RTOS deployment alongside custom hardware accelerators in the FPGA fabric, removing the need for an external application processor.
When designing with this device, plan power-rail sequencing between the HPS and FPGA domains and provide adequate thermal relief: the FCBGA package requires a heatsink or thermal interface material for sustained high-performance operation. Quartus Prime software (Standard or Pro edition, depending on device support) is required for synthesis, place-and-route, and HPS configuration.
Alternativas directas para 10AS066H1F34I1HG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10AS066H1F34I1HG (mismo factor de forma y huella) — difiere en Package, Logic Elements, Operating Temperature, Speed Grade, Temperature Grade.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10AS066H1F34E1HG
✅ Sustitución directa✓ En stock
$3900 / unidad
Ver hoja de datos →10AS066H1F34I1SG
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
10AS057H1F34I1HG
✅ Sustitución directa✓ En stock
$3500 / unidad
Ver hoja de datos →10AS048H1F34I1HG
✅ Sustitución directa✓ En stock
$2650 / unidad
Ver hoja de datos →10AS032H1F34I1HG
✅ Sustitución directa✓ En stock
$2077.26 / unidad
Ver hoja de datos →10AS066H1F34I1HG Valores máximos y características eléctricas
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 660000 (approx.) |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Core Frequency | 1.5 GHz (max) |
| Process Technology | 20 nm |
| Encapsulado | 1152-ball FC-FBGA (35 x 35 mm) |
| Operating Temperature Grade | Industrial (-40C to +100C, suffix I) |
| Estado RoHS | Compliant |
| Tipo de montaje | Surface Mount (BGA) |
| Maximum Seated Height | 3.35 mm |
| Terminal Form | BALL |
| Number of Terminals | 1152 |
| Package Code | BGA |
| Package Shape | SQUARE |
| Lead Free | Yes (per Altera product page) |
| Configuration Memory | SRAM-based (volatile) |
Guía de configuración de pines de 10AS066H1F34I1HG square
Configuración de pines para 10AS066H1F34I1HG (encapsulado square). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10AS066H1F34I1HG.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10AS066H1F34I1HG es adecuado para 7 aplicacións: Wireless Baseband Processing, Radar and Electronic Warfare, Professional Video Broadcast and Image Processing, Industrial Machine Vision and Motor Control, High-Throughput Data Acquisition, 5G Fronthaul and PHY Acceleration, Medical Imaging Equipment.
Wireless Baseband Processing
The 10AS066H1F34I1HG suits wireless baseband designs where the 660K logic elements and hardened DSP blocks implement high-throughput channel cards, while the dual 1.5 GHz ARM Cortex-A9 cores run the MAC scheduler and protocol stack. Its industrial temperature grade supports outdoor small-cell and pico-cell deployments. Compared with a discrete FPGA + MCU design, the integrated HPS removes inter-chip latency and board area.
Recomendado
Radar and Electronic Warfare
In radar and EW systems, the 10AS066H1F34I1HG's hardened floating-point DSP blocks and high-speed transceivers process wideband I/Q streams directly, while the HPS runs tracker and classification algorithms. The 1152-ball F34 package exposes the full transceiver count needed for multi-channel phased-array receivers. The industrial temperature grade enables platform deployments in unconditioned enclosures.
Recomendado
Professional Video Broadcast and Image Processing
Broadcast video routers, multi-viewers, and 4K/8K image-processing pipelines benefit from the 10AS066H1F34I1HG's combination of 660K logic elements, on-chip memory, and the integrated HPS for control-plane networking. The SoC runs Linux for IP-based control while the FPGA fabric handles pixel-rate processing. Industrial temperature grade supports studio and outdoor-broadcast equipment racks.
Recomendado
Industrial Machine Vision and Motor Control
Factory automation cameras and high-precision motor drives use the 10AS066H1F34I1HG to run multi-axis control loops and image-pipeline preprocessing simultaneously. The HPS executes motion-control software under a real-time OS while the FPGA fabric handles encoder decoding and image preprocessing. The industrial temperature grade and -40C to +100C range suit factory-floor conditions.
Recomendado
High-Throughput Data Acquisition
Test and measurement instruments and high-channel-count DAQ systems pair the 10AS066H1F34I1HG's transceivers and parallel I/O with the HPS for data forwarding over 10 Gigabit Ethernet or PCIe. The SoC enables real-time DSP in fabric and Linux-side storage simultaneously, eliminating a separate processor card. Industrial temperature grade supports lab and field-instrument deployments.
Recomendado
5G Fronthaul and PHY Acceleration
The 10AS066H1F34I1HG accelerates 5G PHY-layer functions such as LDPC decoding, FFT/iFFT, and digital pre-distortion in the FPGA fabric, while the dual 1.5 GHz ARM Cortex-A9 HPS handles fronthaul networking under Linux. Its hardened DSP and transceiver count suit mid-band radio units. Industrial temperature grade supports outdoor radio-unit enclosures.
Recomendado
Medical Imaging Equipment
Ultrasound and CT imaging systems use the 10AS066H1F34I1HG to perform beamforming and image reconstruction in the FPGA fabric, while the HPS runs the user interface and DICOM networking stack. The SoC reduces board count compared with discrete designs and the industrial temperature grade supports hospital and mobile-clinic environments.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10AS066H1F34I1HG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10AS066H1F34E1HG | 10AS057H1F34I1HG | 10AS048H1F34I1HG | 10AS032H1F34I1HG |
|---|---|---|---|---|---|
| Package | 1152-ball FC-FBGA (F34, 35x35 mm) | 1152-ball FC-FBGA (F34, 35x35 mm) | 1152-ball FC-FBGA (F34, 35x35 mm) | 1152-ball FC-FBGA (F34, 35x35 mm) | 1152-ball FC-FBGA (F34, 35x35 mm) |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 660000 | 660000 | 570000 | 480000 | 320000 |
| Hard Processor System | Dual ARM Cortex-A9, 1.5 GHz | Dual ARM Cortex-A9, 1.5 GHz | Dual ARM Cortex-A9, 1.5 GHz | Dual ARM Cortex-A9, 1.5 GHz | Dual ARM Cortex-A9, 1.5 GHz |
| Temperature Grade | Industrial (-40C to +100C) | Extended | Industrial | Industrial | Industrial |
| Speed Grade | -1 | -1 | -1 | -1 | -1 |
| Process Node | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Pin/Package Compatibility | Reference | Drop-in (same F34 BGA) | Drop-in (same F34 BGA, lower LE) | Drop-in (same F34 BGA, lower LE) | Drop-in (same F34 BGA, lower LE) |
Diferenciadores clave
- Integrated ARM Cortex-A9 HPS at 1.5 GHz alongside 660K LE fabric (frente a 10AS057H1F34I1HG (570K LE))
- Industrial temperature grade on a 660K-LE SX die (frente a 10AS066H1F34E1HG (extended temperature))
- Pin-compatible density scaling within the F34 footprint (frente a 10AS032H1F34I1HG (320K LE))
- 20 nm process with hardened floating-point DSP (frente a 10AS048H1F34I1HG (480K LE))
Notas de diseño
Estimated: The 1152-ball FC-FBGA 35 x 35 mm Arria 10 SX package dissipates 15-30 W under sustained workload depending on toggle rate and transceiver utilisation. With a typical theta_JA of around 8 C/W, junction temperature can rise 120-240 C above ambient without thermal relief. A heatsink with thermal interface material and adequate airflow is required for industrial-temperature operation. Confirm exact theta values against the latest Intel Arria 10 Device Datasheet.
Arria 10 SX SoCs require multiple power rails (core VCC, VCCPT, VCCAUX, VCCR, transceiver supplies, HPS supplies). Sequence rails according to the Intel Arria 10 Power Management User Guide to avoid latch-up. Use the Altera/Intel PowerPlay early power estimator to size regulators before final schematic. Estimated: budget 25 W of regulator capacity for a typical 660K-LE SX design with 4 transceiver channels at full utilisation.
The 1152-ball F34 BGA has a 1.0 mm ball pitch. Use at least 8 PCB layers with HDI micro-via stack-ups (any-layer via preferred). Match trace lengths within each transceiver bank to within the limits in the Intel Arria 10 Transceiver User Guide; length matching within 150 mils is typical for 10 Gbps channels. Decouple every VCC pin individually with 0402 or 0201 ceramic capacitors.
Do not omit the configuration device. Arria 10 SRAM-based FPGAs lose configuration on power-down and require a serial flash (EPCQ-L) plus the appropriate MSEL pin strapping for fast/standard/remote configuration. For HPS boot, populate the QSPI flash and SD card boot interface; ensure the boot mode pins are correctly strapped on reset.
Transceiver channels on Arria 10 SX require controlled-impedance 100-ohm differential routing with AC coupling capacitors at the device pins. Reference the Intel Arria 10 Transceiver User Guide for the recommended AC-coupling capacitor value, typically 100 nF for data rates up to 10 Gbps and 10 nF for 25 Gbps channels. Estimated: budget 4-8 transceiver channels per fabric-side interface card for typical mid-band radio units.
Información de cumplimiento
RoHS and lead-free per Altera/Intel product page. AEC-Q100 not applicable for SoC FPGA. Halogen-free status marked as unknown - not stated explicitly in retrieved distributor data.
