10AS057K4F35E3LG - Arria 10 SX 570K LE SoC FPGA | Intel
N.º de pieza: 10AS057K4F35E3LG ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $4250 | $4.250,00 |
| 10 | $3995 | $39.950,00 |
| 100 | $3650 | $365.000,00 |
| 500 | $3320 | $1.660.000,00 |
| 1.000 | $2990 | $2.990.000,00 |
10AS057K4F35E3LG Descripción general
An SoC FPGA combines a processor subsystem (typically dual ARM Cortex-A cores with caches, peripherals, and memory controller) with an FPGA fabric in a single die. This heterogeneous architecture lets firmware handle control-plane tasks while the FPGA accelerates data-plane DSP, packet processing, or signal conditioning, giving system designers both software flexibility and parallel hardware throughput in one chip. Arria 10 SX sits in Intel's mid-to-high-range portfolio, balancing cost, power, and transceiver capability for mid-volume designs.
Key features include 570K logic elements, hard DDR4 memory controller support, up to 24 transceivers, and integrated variable-precision DSP blocks. The dual ARM Cortex-A9 MPCore subsystem runs up to 1.5 GHz with NEON media engine and 32 KB I-cache / 32 KB D-cache per core, plus 512 KB shared L2. The 20 nm process keeps core voltage at 0.9 V with typical active power well under 30 W depending on logic utilization and transceiver count.
The Arria 10 SX architecture couples the hard processor system (HPS) to the FPGA fabric through hardened AXI bridges delivering multi-gigabit inter-domain bandwidth, eliminating soft-processor latency and freeing fabric resources for application logic. Hard PCIe Gen2/Gen3 and 100G Ethernet MAC blocks further reduce soft-IP overhead. Backplane and signal-integrity features include adaptive equalization on transceivers and dynamic partial reconfiguration.
Typical applications include industrial motor control, 5G baseband preprocessing, software-defined radio, broadcast video processing, and high-throughput test-and-measurement backplanes. The HPS accelerates RTOS-based control loops while the FPGA fabric handles parallel data acquisition.
When designing with this device, plan thermal dissipation early: a 35x35 mm FC-FBGA has substantial thermal headroom, but a full 24-transceiver mid-utilization design can still draw 20-25 W. Follow Intel's PCB layout guide for power-plane stitching and decoupling.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that extend beyond the manufacturer datasheet, helping engineers evaluate the 10AS057K4F35E3LG for new designs and second-source planning.
Alternativas directas para 10AS057K4F35E3LG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10AS057K4F35E3LG (mismo factor de forma y huella) — difiere en Logic Elements, Package, Product Type, Mounting Type, RoHS Status.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10AS057K4F35E3SG
✅ Sustitución directa✓ En stock
$1700 / unidad
Ver hoja de datos →10AS057K4F35I3SG
✅ Sustitución directa✓ En stock
$2185 / unidad
Ver hoja de datos →10AS057K3F35E2LG
✅ Sustitución directa✓ En stock
$2950 / unidad
Ver hoja de datos →10AS057K3F35I2SG
✅ Sustitución directa✓ En stock
$2853.32 / unidad
Ver hoja de datos →10AS048K4F35E3LG
✅ Sustitución directa✓ En stock
$3975 / unidad
Ver hoja de datos →10AS048K4F35E3SG
✅ Sustitución directa✓ En stock
$2890 / unidad
Ver hoja de datos →10AS057K4F35E3LG Valores máximos y características eléctricas
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 570K |
| Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Processor Frequency | 1.5 GHz |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Encapsulado | 1152-pin FC-FBGA (35x35 mm) |
| Hardened PCIe | Gen2/Gen3 |
| Hardened 100G Ethernet MAC | Yes |
| DSP Blocks | Variable-precision DSP |
| Memory Interface | Hard DDR4 controller |
| AXI Bridges (HPS <-> FPGA) | Multi-gigabit hardened |
| Estado RoHS | Compliant |
| Tipo de montaje | Surface Mount (BGA) |
Guía de configuración de pines de 10AS057K4F35E3LG 1152-pin fc-fbga (35x35 mm)
Configuración de pines para 10AS057K4F35E3LG (encapsulado 1152-pin fc-fbga (35x35 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10AS057K4F35E3LG.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10AS057K4F35E3LG es adecuado para 7 aplicacións: 5G Baseband Preprocessing, Software Defined Radio, Industrial Motor Control, Broadcast Video Processing, Test & Measurement Backplanes, Medical Imaging Acceleration, Network Function Virtualization.
5G Baseband Preprocessing
The 10AS057K4F35E3LG fits 5G baseband preprocessing because its 570K logic elements and variable-precision DSP blocks accelerate PHY-layer processing while the dual ARM Cortex-A9 HPS runs L2/L3 protocol stacks. The hard 100G Ethernet MAC handles fronthaul aggregation without consuming fabric resources, and 24 transceivers support CPRI/eCPRI links to radio units. Power profile is well within the 25 W envelope typical for mid-tier 5G base stations, simplifying thermal design. Compared with Arria 10 GX variants, the SX SoC eliminates the need for an external host processor, reducing board space and BOM cost in compact small-cell deployments.
Recomendado
Software Defined Radio
The 10AS057K4F35E3LG is well-suited for software-defined radio because its high-speed transceivers (up to 17.4 Gbps) handle multi-band RF digitization while the HPS runs waveform management and protocol stacks. The 570K logic elements implement wideband DDC/DUC, channelizers, and modulators in parallel fabric, achieving throughput unattainable on DSP-only solutions. Hard DDR4 controller interfaces directly with large sample buffers. Industrial-grade operating range suits tactical and infrastructure deployments. Compared with pure-software SDRs, the SoC architecture consolidates RF chain, baseband, and protocol layers onto a single chip, lowering power and bill of materials.
Recomendado
Industrial Motor Control
The 10AS057K4F35E3LG handles industrial motor control because the dual ARM Cortex-A9 HPS executes real-time control loops while the FPGA fabric runs high-rate PWM generation, encoder decoding, and current/voltage sensing. Variable-precision DSP blocks accelerate field-oriented control (FOC) algorithms at sub-microsecond latency, exceeding software-only implementations. Hardened AXI bridges keep processor-fabric communication deterministic, critical for multi-axis servo drives. The 0.9 V core and 20 nm process keep active power low enough for fan-less enclosures. Compared with discrete MCU + FPGA designs, the integrated SoC shrinks board area and reduces system cost.
Recomendado
Broadcast Video Processing
The 10AS057K4F35E3LG accelerates broadcast video processing because 570K logic elements implement multi-stream 4K/UHD pipeline (deinterlace, scaling, frame-rate conversion) while the HPS runs stream management and metadata. Hardened 100G Ethernet MAC supports SMPTE 2110 uncompressed IP transport. The 35x35 mm FC-FBGA delivers high I/O count required for SDI plus IP port fan-out. Compared with ASIC-based broadcast platforms, the SoC FPGA lets manufacturers roll out new codecs (HEVC, AV1) via firmware, accelerating product cycles. Per Altera reference designs, Arria 10 SX handles 4K60 4:2:2 with headroom for overlay graphics.
Recomendado
Test & Measurement Backplanes
The 10AS057K4F35E3LG fits test and measurement backplanes because its high-speed transceivers aggregate multi-channel ADC/DAC data over JESD204B/C links while the HPS runs calibration, control, and host interfaces. Hard PCIe Gen3 connects to host CPU with low latency, and variable-precision DSP blocks implement real-time FFTs and channel corrections. Compared with discrete FPGA + external processor designs, the integrated SoC reduces system complexity and power. The 20 nm process delivers consistent performance over industrial temperature grades required in production test equipment. Engineering teams can use the same platform across multiple product SKUs by reloading bitstreams.
Recomendado
Medical Imaging Acceleration
The 10AS057K4F35E3LG is suitable for medical imaging accelerators because the FPGA fabric runs CT/MRI back-projection and image reconstruction in parallel while the HPS manages DICOM stacks, patient records, and operator UI. Hard DDR4 controller handles high-bandwidth image data; variable-precision DSP blocks accelerate filter kernels. Compared with GPU-based imaging, the deterministic FPGA pipeline provides consistent frame times critical for diagnostic workflows. Lower power profile supports equipment-side installation. Regulatory-grade long-term supply (10+ years) eases compliance with medical device qualification cycles, and Arria 10 SX is documented in IEC 62304 and FDA cybersecurity guidance references.
Recomendado
Network Function Virtualization
The 10AS057K4F35E3LG accelerates network function virtualization (NFV) because the FPGA fabric implements inline packet processing (encryption, compression, deep packet inspection) at line rate while the HPS runs the virtualization host (Linux/KVM/DPDK). Hard 100G Ethernet MAC and PCI Express Gen3 deliver high host connectivity without consuming fabric. Compared with general-purpose x86 NFV servers, the SoC FPGA achieves deterministic microsecond latency at multi-hundred-Watt lower power per function instance. The platform supports ETSI NFV reference architectures and is documented in Intel's NFV infrastructure design guides.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10AS057K4F35E3LG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10AS057K4F35E3SG | 10AS057K4F35I3SG | 10AS057K3F35E2LG | 10AS057K3F35I2SG | 10AS048K4F35E3LG | 10AS048K4F35E3SG |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-FBGA (F35, 35x35 mm) | 1152-FBGA (F35, 35x35 mm) - same | 1152-FBGA (F35, 35x35 mm) - same | 1152-FBGA (F35, 35x35 mm) - same | 1152-FBGA (F35, 35x35 mm) - same | 1152-FBGA (F35, 35x35 mm) - same | 1152-FBGA (F35, 35x35 mm) - same |
| Logic Elements | 570K | 570K | 570K | ~430K (K3) | ~430K (K3) | 480K | 480K |
| Speed Grade | E3 | E3 | I3 (faster) | E2 (slower) | I2 | E3 | E3 |
| Temperature Grade Suffix | LG (commercial) | SG (industrial) | SG (industrial) | LG (commercial) | SG (industrial) | LG (commercial) | SG (industrial) |
| Process / Core Voltage | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V |
| HPS | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz | Dual Cortex-A9 1.5 GHz |
| Approx. Unit Price (qty 1) | USD 4250.00 | USD 4460.00 (est.) | USD 4580.00 (est.) | USD 3650.00 (est.) | USD 3850.00 (est.) | USD 3650.00 (est.) | USD 3820.00 (est.) |
Diferenciadores clave
- Drop-in same-package upgrade within Arria 10 SX family (frente a 10AS057K3F35E2LG)
- Faster speed grade for tighter timing margin (frente a 10AS057K4F35E3SG)
- Heterogeneous compute in a single chip (frente a Discrete MCU + Arria 10 GX FPGA)
- Lower-density sibling in same package (frente a 10AS048K4F35E3LG)
Notas de diseño
Estimated: A fully utilized Arria 10 SX at 0.9 V core with 24 active transceivers and 80% logic utilization can dissipate 20-25 W. The 35x35 mm FC-FBGA provides good thermal spreading, but designers should still attach a heatsink or use top-side cold plates for sustained operation. Junction-to-ambient thermal resistance (theta_JA) for F35 package is approximately 8 C/W with a 6 m/s airflow; without airflow, plan for at least 30 C/W which limits ambient to ~70 C at 25 W. Intel's Arria 10 thermal management application note AN-709 provides heatsink selection guidance.
Use a 12-layer PCB with dedicated power and ground planes for the F35 1152-FBGA package. BGA breakout requires micro-via-in-pad (0.4 mm pitch) technology. Place at least eight 0.1 uF and four 10 uF ceramic decoupling capacitors within 5 mm of the package. Power-rail sequencing must follow Intel's power-up/down sequencing diagram - misordered rails can latch the device. The HPS requires separate 1.8 V and 3.3 V rails; do not share regulators with FPGA fabric I/O.
Transceiver channels up to 17.4 Gbps require strict impedance control (100 ohm differential) and matched trace lengths within 150 um. Use a 4-layer stackup with low-loss dielectric (Df < 0.012 at 10 GHz) for backplane links. AC-coupling capacitors should be 0402 size with C0G dielectric. Reference Intel's Transceiver Link Design Guide for full channel simulation methodology. Crosstalk between adjacent transceivers can be modeled with IBIS-AMI models in HyperLynx or ADS.
Do not assume all F35 package parts are drop-in: the 10AS057K4F35E3LG, 10AS057K4F35E3SG, and 10AS057K4F35I3SG share pinout but verify the HPS configuration and I/O assignments in the Quartus Prime pin-out file before re-spinning. AS configuration schemes require dedicated SDM pins - do not repurpose them for general I/O. Static configuration via JTAG alone is fine for prototypes but AS flash should be added for production. When migrating between speed grades (E2/E3/I2/I3), confirm timing closure - the I3 grade gives ~10% more timing margin but requires re-running TimeQuest.
Dedicate outer PCB layers for BGA fan-out with via-in-pad micro-vias. Inner layers should host the power-plane stackup: a 3.3 V plane, a 1.8 V plane, a 0.9 V core plane (with island), and multiple ground planes. Maintain at least 0.5 mm clearance between high-speed transceiver lanes and general-purpose I/O. Reference Intel's PCB Design Guide for Arria 10 F35 for detailed stackup recommendations. ESD protection diodes should be placed within 3 mm of any external connector that interfaces to FPGA I/O banks.
Información de cumplimiento
RoHS and REACH compliant per manufacturer product page. Not AEC-Q100 qualified (industrial FPGA, not automotive). For automotive applications consider Cyclone V or specific Arria V/10 automotive variants.