10AS066K4F35E3SG - Arria 10 SX SoC FPGA, 660K LE, 1152-FBGA | Intel
N.º de pieza: 10AS066K4F35E3SG ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $2850 | $2.850,00 |
| 10 | $2690 | $26.900,00 |
| 100 | $2480 | $248.000,00 |
| 500 | $2295 | $1.147.500,00 |
| 1.000 | $2150 | $2.150.000,00 |
10AS066K4F35E3SG Descripción general
An SoC FPGA is a hybrid device that pairs a general-purpose processor subsystem with programmable logic on a single die. The Arria 10 SX family sits within Intel's mid-range FPGA portfolio between Cyclone and Stratix, targeting applications that benefit from hard CPU acceleration alongside custom logic - for example, motor control loops, protocol bridging, and DSP pipelines. The dual ARM Cortex-A9 MPCore provides symmetric multiprocessing with NEON media engines, while the FPGA fabric delivers parallel hardware acceleration.
Key features of the 10AS066K4F35E3SG include 1152-ball FCBGA packaging optimized for high-speed signal escape, transceiver support for multi-gigabit serial interfaces, and CoreSight on-chip debug. The K-suffix device code identifies the variant within the Arria 10 SX family with specific transceiver/transceiver-rate and memory capabilities, while the F35 package designation refers to the 35x35 mm BGA footprint. Operating voltage is centered at 0.9 V core with separate rails for the transceiver and HPS subsystems.
Typical applications include industrial motor control, software-defined radio, medical imaging preprocessing, test and measurement instrumentation, and broadcast video processing. The SoC integration is particularly valuable where deterministic low-latency FPGA response must be coordinated with a Linux-capable host processor. Peripherals integrated into the HPS include DMA, POR, WDT, and connectivity IPs such as Ethernet, I2C, SPI, UART, and MMC/SD/SDIO.
When designing with this device, ensure the PCB supports the 1152-ball FCBGA land pattern with appropriate microvia stack-up, and that power sequencing for the FPGA core, HPS, and transceiver rails follows the Arria 10 power management guidelines. Engineers should plan thermal management early, as the 35x35 mm package dissipates substantial power under heavy transceiver utilization.
This page synthesizes distributor pricing, verified drop-in alternatives from the same Arria 10 SX family, and practical design notes not aggregated on any single manufacturer or distributor page.
Alternativas directas para 10AS066K4F35E3SG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10AS066K4F35E3SG (mismo factor de forma y huella) — difiere en Package, Operating Temperature Grade, Mounting Type, RoHS Status, Logic Elements.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10AS066K4F35E3LG
✅ Sustitución directa✓ En stock
$2845.83 / unidad
Ver hoja de datos →10AS066K3F35E3SG
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10AS066K3F35E2SG
✅ Sustitución directa✓ En stock
$2950 / unidad
Ver hoja de datos →10AS066K2F35E2SG
✅ Sustitución directa✓ En stock
$2890 / unidad
Ver hoja de datos →10AS066K1F35E1HG
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →10AS066K4F35E3SG Valores máximos y características eléctricas
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 660,000 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Encapsulado | 1152-ball FCBGA, 35x35 mm |
| Pin/Ball Count | 1152 |
| Operating Temperature Grade | Industrial / extended (per ordering code E3) |
| RAM Size (HPS) | 256 KB |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART |
| Architecture | MCU + FPGA |
| Tipo de montaje | Surface Mount (BGA) |
| Estado RoHS | Compliant |
| Estado del ciclo de vida | Active |
Guía de configuración de pines de 10AS066K4F35E3SG 1152-ball fcbga, 35x35 mm
Configuración de pines para 10AS066K4F35E3SG (encapsulado 1152-ball fcbga, 35x35 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10AS066K4F35E3SG.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10AS066K4F35E3SG es adecuado para 6 aplicacións: Industrial Motor Control, Software Defined Radio (SDR), Medical Imaging Preprocessing, Test and Measurement Instrumentation, Broadcast Video Processing, Aerospace and Defense Signal Processing.
Industrial Motor Control
The 10AS066K4F35E3SG's dual-core ARM Cortex-A9 MPCore hard processor system runs real-time control loops (FOC, sensorless control) at deterministic latency, while the 660K-logic-element FPGA fabric handles high-speed PWM generation, encoder decoding, and safety logic in parallel. The HPS connectivity peripherals (EBI/EMI, SPI for ADC/DAC, UART for HMI) reduce external component count. Industrial motor drives with 100 kHz+ control loops benefit from the FPGA's deterministic nanosecond response alongside Linux/RTOS capability on the HPS.
Recomendado
Software Defined Radio (SDR)
The Arria 10 SX 660K-logic-element FPGA fabric in the 10AS066K4F35E3SG is well-suited to wideband SDR baseband processing, including FFT/iFFT pipelines, channelization, and digital up/down conversion. Multi-gigabit transceivers handle ADC/DAC interface to RF front ends. The HPS runs waveform scheduling, network stacks, and management plane software under Linux. SDR platforms targeting 4G/5G small cells, tactical radio, or test & measurement benefit from this SoC partitioning, with FPGA doing DSP and the ARM cores doing protocol and housekeeping.
Recomendado
Medical Imaging Preprocessing
Medical imaging systems (ultrasound, endoscopy, CT preprocessing) require real-time pixel pipelines that the 10AS066K4F35E3SG's 660K-logic-element FPGA fabric accelerates at line rate. The HPS runs the user interface, patient database I/O, and image post-processing under a Linux stack. DMA engines in the HPS move preprocessed frames directly to DDR for efficient memory bandwidth. Low-latency FPGA response is essential for transducer beamforming and Doppler processing where millisecond-level delay matters clinically.
Recomendado
Test and Measurement Instrumentation
Test equipment - oscilloscopes, protocol analyzers, BERT systems - leverage the 10AS066K4F35E3SG's high-speed transceivers and parallel FPGA fabric to capture and analyze multi-gigabit signals. The dual-core Cortex-A9 HPS runs the instrument UI, SCPI command parsing, and LXI network stack. Memory bandwidth between FPGA and HPS through AXI bridges is critical for waveform streaming to DDR. The 1152-ball FCBGA provides the signal escape required for high-channel-count instruments.
Recomendado
Broadcast Video Processing
The 10AS066K4F35E3SG handles broadcast-grade video processing - format conversion, scaling, chroma keying, and overlay - in its FPGA fabric at full frame rate (60 fps 4K). The HPS manages file I/O, network streaming, and codec control via SPI/UART peripherals. SDI interfaces through transceivers connect directly to the FPGA fabric. Live production switchers and contribution encoders benefit from deterministic FPGA latency combined with Linux network stacks for IP-based workflows like SMPTE ST 2110.
Recomendado
Aerospace and Defense Signal Processing
Avionics and defense applications - radar preprocessing, electronic warfare, secure communications - leverage the 10AS066K4F35E3SG's combination of FPGA DSP throughput and HPS-based crypto/mission software. The 1152-ball FCBGA package supports ruggedized PCB stack-ups required for vibration and thermal environments. Industrial/extended operating temperature grades (E3, I3) available in the same F35 footprint allow design reuse across commercial and rugged variants. HPS runs RTOS for deterministic mission timing while FPGA handles high-bandwidth sensor data.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10AS066K4F35E3SG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10AS066K4F35E3LG | 10AS066K3F35E3SG | 10AS066K3F35E2SG | 10AS066K2F35E2SG | 10AS066K1F35E1HG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FCBGA (35x35 mm) | 1152-FCBGA (35x35 mm) - same | 1152-FCBGA (35x35 mm) - same | 1152-FCBGA (35x35 mm) - same | 1152-FCBGA (35x35 mm) - same | 1152-FCBGA (35x35 mm) - same |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 |
| Device Code Tier | K4 (highest) | K4 | K3 | K3 | K2 | K1 (lowest) |
| Temperature/Speed Grade | E3 | E3 | E3 | E2 | E2 | E1 |
| Hard Processor System | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Diferenciadores clave
- Highest-tier device code (K4) within the 660K-LE Arria 10 SX family (frente a 10AS066K3F35E3SG)
- Hard ARM Cortex-A9 MPCore integrated on-die (frente a Non-SoC Arria 10 GX/GX variants)
- 20 nm process with transceiver performance (frente a Cyclone V SoC (older 28 nm process))
- 1152-ball F35 FCBGA provides highest I/O escape (frente a F34 package variants (10AS066H4F34E3SG))
Notas de diseño
The 1152-ball FCBGA F35 package requires a high-density PCB stack-up with microvias. Use 1 oz copper outer layers, 0.5 oz inner layers, and an ENIG or OSP surface finish. Decoupling must follow the Intel Arria 10 pin connection guidelines; place bulk capacitors within 100 mil of the balls, and high-frequency 0.1 uF/0.01 uF capacitors directly under the package BGA escape pattern. Estimate: ~200 decoupling capacitors are typical for Arria 10 SX designs.
Estimated: at maximum utilization (high toggle rate, full transceiver activity, HPS at full load), the 10AS066K4F35E3SG dissipates approximately 20-25 W. The 35x35 mm FCBGA junction-to-ambient thermal resistance with adequate thermal vias and a heat spreader is typically 1-2 C/W. A heat sink or forced-air cooling is required for industrial ambient operation; passive cooling alone is insufficient at full power. Plan thermals early in the PCB layout phase.
Arria 10 SX requires multiple power rails - core VCC (0.9 V), HPS VCC (separate sequencing), transceiver rails (VCCR/VCCP/VCCPT), and I/O banks. Power sequencing must follow the Intel Arria 10 power management guidelines to avoid latch-up. Use a dedicated power management IC such as the Intel Enpirion EM11K or similar with sequenced enable outputs. The HPS rail must be stable before the FPGA core rail to ensure deterministic boot.
Transceiver channels (up to 24 in K4 tier) require matched-length routing with controlled impedance (typically 85-100 ohm differential). Keep AC-coupling capacitors within 200 mil of the transceiver ball pads. Reference the Intel Arria 10 SX transceiver layout guidelines for via pattern and ground stitching. Length matching within an xAUI or PCIe interface must be within 5 mil for reliable operation.
Common pitfalls with Arria 10 SX SoC FPGAs: (1) failing to configure the HPS boot source pins correctly for QSPI/NAND/NOR; (2) not providing enough decoupling for simultaneous FPGA and HPS transients; (3) using incorrect Quartus Prime device selection (K3 vs K4 K1 designations affect transceiver IP); (4) violating the HPS-to-FPGA AXI bridge bandwidth limits when moving large DMA blocks; (5) bypassing the FPGA configuration CRC check leading to silent failures.
Información de cumplimiento
RoHS compliant per Intel product page. Halogen-free status not explicitly stated in provided data; set to 'unknown' per data authenticity rules. AEC-Q100 not applicable - this is a complex SoC FPGA, not an automotive-grade simple IC.
