10AX090N3F40I2LG - Arria 10 GX 900K LE FPGA, 1517-FCBGA | Intel
N.º de pieza: 10AX090N3F40I2LG ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $12500 | $12.500,00 |
| 10 | $11800 | $118.000,00 |
| 100 | $11200 | $1.120.000,00 |
| 500 | $10500 | $5.250.000,00 |
| 1.000 | $9800 | $9.800.000,00 |
10AX090N3F40I2LG Descripción general
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than at the factory. In the broader taxonomy, FPGAs sit alongside CPUs, GPUs, DSPs, and ASICs as programmable compute devices, distinguished by their massive parallelism, reconfigurability, and deterministic latency. Modern high-end FPGAs like the Arria 10 GX integrate hard IP blocks for transceivers, memory controllers, and DSP slices, bridging the gap between pure programmable logic and structured ASIC platforms.
Key features include integrated 14.1 Gbps transceivers, hardened floating-point DSP blocks optimized for high-precision signal processing, variable-precision digital signal processing support, partial reconfiguration capability, and a 20 nm process technology that balances performance-per-watt against logic density. The device supports DDR4 external memory interfaces with hardened PHY blocks and offers up to 24 embedded transceiver channels.
The Arria 10 GX architecture combines a fabric of adaptive logic modules (ALMs), embedded SRAM blocks (M20K), DSP blocks, and hard IP for PCIe Gen3 x8 and 10/25/40/100 Gigabit Ethernet. This heterogeneous integration enables designers to implement high-throughput data pipelines, protocol bridges, and signal-processing algorithms on a single device, reducing board area and BOM cost.
Typical applications include high-performance computing accelerators, radar and electronic warfare signal processing, 5G wireless baseband, medical imaging, broadcast video processing, and test and measurement instrumentation where parallel DSP throughput and flexible I/O are decisive factors.
When designing with this device, ensure the PCB has matched-length routing for high-speed transceivers, adequate power decoupling near every VRM phase, and proper thermal management — a 1517-FCBGA at full utilization can dissipate well over 25 W.
This page synthesizes distributor pricing, package-level drop-in alternatives, and practical design considerations that are not aggregated on any single manufacturer or distributor page.
Alternativas directas para 10AX090N3F40I2LG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10AX090N3F40I2LG (mismo factor de forma y huella) — difiere en Package, DSP Blocks, Hard Memory Controllers, Process Technology, PCIe Hard IP.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10AX090N3F40E2LG
✅ Sustitución directa✓ En stock
$2280 / unidad
Ver hoja de datos →10AX090N2F40I2LG
✅ Sustitución directa✓ En stock
$6903.28 / unidad
Ver hoja de datos →10AX090N2F40I2SG
✅ Sustitución directa✓ En stock
$6185 / unidad
Ver hoja de datos →10AX090N2F40I1SG
✅ Sustitución directa✓ En stock
$2985 / unidad
Ver hoja de datos →10AX090N2F45I2LG
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
Consulte el precio
Ver hoja de datos →10AX090N3F40I2LG Valores máximos y características eléctricas
| Series | Arria 10 GX |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LE) | 900,000 |
| Embedded Memory Bits | 59,234,304 |
| User I/O Count | 600 |
| Encapsulado | 1517-BBGA, FCBGA |
| Tipo de montaje | Surface Mount |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Process Technology | 20 nm |
| Transceiver Data Rate (max) | 14.1 Gbps |
| Hard Memory Controllers | DDR4 with hardened PHY |
| PCIe Hard IP | PCIe Gen3 x8 |
| Estado RoHS | Compliant |
Guía de configuración de pines de 10AX090N3F40I2LG 1517-bbga, fcbga
Configuración de pines para 10AX090N3F40I2LG (encapsulado 1517-bbga, fcbga). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10AX090N3F40I2LG.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10AX090N3F40I2LG es adecuado para 6 aplicacións: 5G Wireless Baseband Processing, Radar and Electronic Warfare Signal Processing, Medical Imaging and Diagnostics, Broadcast and Professional Video Processing, Test and Measurement Instrumentation, High-Performance Computing Accelerator Card.
5G Wireless Baseband Processing
The 10AX090N3F40I2LG's 900,000 logic elements and 14.1 Gbps transceivers make it well suited to 5G baseband and fronthaul CPRI/eCPRI processing. Its hardened floating-point DSP blocks accelerate FFT, channel estimation, and MIMO detection pipelines at line rate, while the 600 user I/Os and DDR4 hardened PHY enable wide parallel radio interfaces. Industrial temperature rating supports outdoor radio units and base-station deployments.
Recomendado
Radar and Electronic Warfare Signal Processing
Defense and aerospace radar systems benefit from the 10AX090N3F40I2LG's high DSP throughput, 14.1 Gbps transceivers for digital-RF data conversion, and 900K LE capacity for adaptive beamforming algorithms. The industrial temperature grade suits outdoor phased-array installations, while partial reconfiguration enables runtime mode switching between search, track, and electronic-countermeasure profiles. Hard PCIe Gen3 x8 supports direct host-coupled processing.
Recomendado
Medical Imaging and Diagnostics
The 10AX090N3F40I2LG supports real-time processing in CT, MRI, and ultrasound imaging systems, where its 900K logic elements, embedded DSP, and DDR4 controllers handle parallel image-reconstruction pipelines. The 14.1 Gbps transceivers enable high-speed links to detector arrays and host servers, while the industrial temperature rating supports integration into imaging carts and stationary equipment. Low-latency parallel compute is decisive for image-quality and patient-throughput gains.
Recomendado
Broadcast and Professional Video Processing
The 10AX090N3F40I2LG is a strong fit for 4K/8K broadcast video routers, format converters, and live-production switchers. Its 600 user I/Os and high-density fabric handle multi-stream SDI/HDMI aggregation, while the 14.1 Gbps transceivers support SMPTE 2022/2110 IP-based video transport over 10/25 GbE. Industrial temperature rating suits outside-broadcast vans and 24/7 studio operation.
Recomendado
Test and Measurement Instrumentation
High-end oscilloscopes, protocol analyzers, and arbitrary waveform generators rely on the 10AX090N3F40I2LG's combination of DSP horsepower, fast transceivers, and parallel I/O for real-time DSP, trigger correlation, and waveform synthesis. The 900K LE budget accommodates deep acquisition-memory address generators and FFT engines, while DDR4 interfaces sustain multi-gigasample capture rates. Industrial temperature rating supports lab and field-deployed instrument chassis.
Recomendado
High-Performance Computing Accelerator Card
The 10AX090N3F40I2LG operates as a host-coupled accelerator in compute-dense PCIe cards for financial analytics, genomics, or scientific workloads. Its hardened PCIe Gen3 x8 block provides low-latency host connectivity, while 900K logic elements support custom datapath accelerators that outperform CPUs on parallel kernels. The 14.1 Gbps transceivers also enable direct GPU-to-FPGA or FPGA-to-FPGA fabric links for multi-card scaling.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10AX090N3F40I2LG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10AX090N3F40E2LG | 10AX090N2F40I2LG | 10AX090N2F40I2SG | 10AX090N2F40I1SG | 10AX090N2F45I2LG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-FCBGA | 1517-FCBGA - same | 1517-FCBGA - same | 1517-FCBGA - same | 1517-FCBGA - same | 1517-FCBGA - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Transceiver Max Data Rate | 14.1 Gbps | 14.1 Gbps | 12.5 Gbps | 12.5 Gbps | 10 Gbps | 12.5 Gbps |
| Temperature Grade | Industrial (-40C to +100C) | Extended | Industrial | Industrial | Industrial | Industrial |
| Speed Grade | 3 (fastest) | 3 | 2 | 2 | 1 | 2 |
| User I/O | 600 | 600 | 600 | 600 | 600 | 600 |
| Embedded SRAM | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits |
Diferenciadores clave
- Highest transceiver speed grade in the 10AX090N family (frente a 10AX090N2F40I2LG)
- Industrial temperature grade for harsh environments (frente a 10AX090N3F40E2LG)
- Highest logic density in the Arria 10 GX family at 900K LE (frente a 10AX066N2F40E1SG)
Notas de diseño
Estimated: the 10AX090N3F40I2LG in a 1517-FCBGA can dissipate 25 W to 40 W at full utilization, per typical Arria 10 GX power-characterization reports. Apply a heatsink with thermal interface material and ensure at least 150 LFM of airflow; without forced cooling, junction temperature may exceed the +100C industrial limit. Designers should run the Intel Quartus Prime Early Power Estimator before layout commitment.
The FCBGA-1517 substrate requires a high-layer-count PCB (often 14 to 18 layers) with stacked micro-vias and via-in-pad construction to break out the 1.0 mm pitch BGA. All transceiver lanes must have impedance-controlled differential routing (typically 85/100 ohm) with length matching to within 5 mil. Power distribution requires multiple voltage rails with bulk, ceramic, and decoupling capacitors placed adjacent to each ball pair.
Do not assume the 10AX090N3F40I2LG can be replaced by a different speed-grade Arria 10 part without re-running Quartus Prime timing analysis - the speed suffix (1/2/3) changes timing closure margins. Confirm the package code (F40 vs F45) matches the pin-out file before board assembly, since some F-suffix variants differ in ball mapping despite identical package bodies. Always load the latest device pin-out file from intel.com before schematic capture.
Información de cumplimiento
RoHS and REACH compliant per Intel product environmental disclosures. AEC-Q100 not applicable - this is a high-density FPGA, not an automotive-qualified IC.
