10CL016YU256A7G - Cyclone 10 LP FPGA 16K LE | Intel | 256-LFBGA
N.º de pieza: 10CL016YU256A7G ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $39.5 | $39,50 |
| 10 | $35.2 | $352,00 |
| 100 | $30.85 | $3.085,00 |
| 250 | $28.4 | $7.100,00 |
| 500 | $26.75 | $13.375,00 |
| 1.000 | $24.9 | $24.900,00 |
10CL016YU256A7G Descripción general
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks (logic elements/ALMs), programmable interconnect, and configurable I/O that can be reconfigured after manufacturing to implement custom digital circuits. FPGAs sit in the programmable-logic hierarchy between fixed-function ASICs and microcontrollers, offering hardware-level parallelism for signal processing, glue logic, and protocol bridging. The Cyclone 10 LP family specifically targets the low-power segment, simplifying the FPGA taxonomy into: logic element -> logic array block (LAB) -> FPGA -> programmable logic -> semiconductor.
Key features include 56 (18x18) hardware multipliers, 4 PLLs, 56 Kbit distributed RAM, 504 Kbit embedded SRAM, and 162 maximum user I/Os. Core logic operates at 1.2 V (with multi-voltage I/O support including 1.2/1.5/1.8/2.5/3.3 V), and the part supports DDR2/DDR3/LPDDR2 memory interfaces. The industrial temperature grade (-40C to +125C, suffix 'A') makes the 'A7G' speed grade variant suitable for harsh-environment deployments.
Typical applications include industrial motor control, video processing bridges (parallel RGB to MIPI CSI-2), low-cost protocol bridging (I2C/SPI to UART), LED video walls, and machine-vision interfaces. The integrated transceivers are absent (Cyclone 10 LP does not include multi-gigabit transceivers), so it suits parallel-I/O-heavy designs rather than serial-link applications.
Designers should note the 'A7G' suffix denotes speed grade 7 (commercial speed bin) with industrial temperature range. The package is lead-free and RoHS compliant; the 'G' suffix confirms halogen-free construction. Pin-compatible Cyclone 10 LP variants exist with different speed grades (C8G, I7G) and packages (M164, E144, F484) sharing the same silicon die.
Alternativas directas para 10CL016YU256A7G — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10CL016YU256A7G (mismo factor de forma y huella) — difiere en Package, Operating Temperature, Process Technology, Logic Elements (LE), Speed Grade.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10CL016YU256C8G
✅ Sustitución directa✓ En stock
$10.87 / unidad
Ver hoja de datos →10CL016YU256I7G
✅ Sustitución directa✓ En stock
$17.2 / unidad
Ver hoja de datos →10CL016YU256C6G
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$23.75 / unidad
Ver hoja de datos →10CL010YU256A7G
✅ Sustitución directa✓ En stock
$20.85 / unidad
Ver hoja de datos →10CL010YU256C8G
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$13.95 / unidad
Ver hoja de datos →10CL006YU256A7G
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$28.92 / unidad
Ver hoja de datos →10CL016YU256A7G Valores máximos y características eléctricas
| Series | Cyclone 10 LP |
| Family | Cyclone 10 LP |
| Logic Elements (LE) | 15,408 LE |
| Adaptive Logic Modules (ALMs) | 963 |
| Embedded Memory (bits) | 516,096 bits |
| Embedded SRAM (Kbits) | 504 Kbit |
| Distributed RAM (Kbits) | 56 Kbit |
| Maximum User I/Os | 162 |
| Hardware Multipliers (18x18) | 56 |
| PLLs | 4 |
| Core Voltage | 1.2 V |
| Tensión de alimentación de funcionamiento | 1.2 V |
| Memory Interface Support | DDR2, DDR3, LPDDR2 |
| Encapsulado | 256-LFBGA (UBGA-256, 14x14 mm) |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40C to +125C (Industrial) |
| Speed Grade | 7 (A7G - commercial speed bin, industrial temp) |
| Estado RoHS | Compliant |
| Sin halógenos | Yes (G suffix) |
| Lead-Free | Yes |
| Multi-Voltage I/O Support | 1.2V / 1.5V / 1.8V / 2.5V / 3.3V |
Configuración de pines de 10CL016YU256A7G
| Pin A1 | IO — General purpose user I/O (bank 1A) |
| Pin B2 | IO — General purpose user I/O (bank 1A) |
| Pin C3 | VCCIO1A — I/O bank 1A supply voltage |
| Pin D4 | GND — Ground reference |
| Pin E5 | IO — General purpose user I/O (bank 2) |
| Pin F6 | CLKIN1 — Clock input 1 |
| Pin G7 | IO — General purpose user I/O (bank 3) |
| Pin H8 | VCCINT — Core voltage 1.2 V |
| Pin J9 | PLL1_CLKOUTp — PLL 1 differential clock output positive |
| Pin K10 | IO — General purpose user I/O (bank 4) |
| Pin L11 | VCCIO4 — I/O bank 4 supply voltage |
| Pin M12 | IO — General purpose user I/O (bank 5) |
| Pin N13 | GND — Ground reference |
| Pin P14 | IO — General purpose user I/O (bank 6) |
| Pin T1 | nCONFIG — Configuration control (active-low) |
| Pin T16 | MSEL0 — Configuration mode select 0 |
| Pin AE1 | DIFFIO_RX_p — Differential receiver positive |
| Pin AE16 | DIFFIO_TX_n — Differential transmitter negative |
Aplicaciones típicas
10CL016YU256A7G es adecuado para 7 aplicacións: Industrial Motor Control, Video Interface Bridging, I2C/SPI/UART Protocol Bridging, LED Video Wall Controllers, Machine Vision Pre-Processing, Low-Cost I/O Expansion and Glue Logic, Automotive Infotainment HMI.
Industrial Motor Control
The 10CL016YU256A7G's 15,408 logic elements and 56 18x18 hardware multipliers are well-matched to industrial motor-control loops running field-oriented control (FOC) and PWM generation at 50-100 kHz. Its 162 user I/Os provide sufficient headroom for encoder inputs (QEP), Hall sensors, gate-driver interfaces, and analog-front-end monitoring, while the 4 PLLs deliver the deterministic clock synthesis required for closed-loop servo control. Industrial temperature range (-40C to +125C) ensures reliable operation in factory-floor cabinets and outdoor machinery. Designers can pair the FPGA with companion ADCs for current sensing.
Recomendado
Video Interface Bridging
The 10CL016YU256A7G's 162 user I/Os make it ideal for video format bridging (parallel RGB/TTL to MIPI CSI-2, BT.656 to LVDS, etc.) in machine-vision and display-controller applications. Its 504 Kbit embedded memory buffers pixel-line data efficiently, and DDR2/DDR3/LPDDR2 memory interface support enables external frame-buffer designs at 60 fps and beyond. The low-power Cyclone 10 LP architecture reduces thermal dissipation in embedded display products. Designers commonly pair it with image sensors or TFT drivers via companion ADCs and serializers.
Recomendado
I2C/SPI/UART Protocol Bridging
The 10CL016YU256A7G handles multi-protocol bridging (I2C to SPI, SPI to UART, CAN to UART, parallel-to-serial conversion) with abundant 162 user I/Os and 56 18x18 multipliers available for data-encoding/decoding. In industrial gateways, it can implement custom serial multiplexing, isolation, and protocol translation between legacy microcontrollers and modern SoCs. The integrated 4 PLLs allow baud-rate synthesis across many simultaneous channels. Common pairings include companion transceivers like the MAX485 and LTC2875.
Recomendado
LED Video Wall Controllers
The 10CL016YU256A7G drives large LED video walls by buffering and re-clocking pixel data across dozens of high-speed parallel outputs. Its 162 user I/Os allow direct connection to multiple LED-driver shift registers without external muxes. With 504 Kbit embedded memory, it supports row/column-level buffering at 30+ Hz refresh rates, and the industrial temperature range accommodates outdoor cabinet conditions. Designers often pair it with companion LED-driver chips like the TLC5940 and MBI5024.
Recomendado
Machine Vision Pre-Processing
The 10CL016YU256A7G performs real-time image pre-processing (Sobel edge detection, thresholding, blob analysis) on raw sensor data before forwarding to an SoC host. Its 56 18x18 multipliers and 504 Kbit embedded SRAM allow line-buffer implementations and convolution kernels up to 5x5. The LFBGA-256 package suits high-density PCB integration with image sensors. Common pairings include companion sensors (ON Semi MT9V032) and host SoCs.
Recomendado
Low-Cost I/O Expansion and Glue Logic
The 10CL016YU256A7G replaces discrete CPLDs and logic-IC arrays in systems needing flexible I/O mapping, level shifting, and timing-constraint management. Its 162 user I/Os can implement multi-bank level translation (1.2V to 3.3V), complex reset sequencing, and custom interrupts for processor subsystems. The low power consumption and small LFBGA-256 footprint suit space-constrained embedded designs. Designers often pair it with companion microcontrollers like the STM32F4 or NXP LPC546xx.
Recomendado
Automotive Infotainment HMI
The 10CL016YU256A7G handles HMI graphics composition, touchscreen de-bouncing, and CAN-to-display bridging in cost-sensitive automotive infotainment head units. Its industrial temperature range and long-lifecycle support make it suitable for automotive cabin environments. Designers can integrate companion touch controllers like the FT5406 and display drivers to deliver responsive HMI experiences.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10CL016YU256A7G — comparación, orientación de diseño e información de cumplimiento.
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Comparación con alternativas
| Parámetro | Este producto | 10CL016YU256C8G | 10CL016YU256I7G | 10CL016YU256C6G | 10CL010YU256A7G | 10CL006YU256A7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-LFBGA (UBGA-256, 14x14 mm) | 256-LFBGA (UBGA-256) - same | 256-LFBGA (UBGA-256) - same | 256-LFBGA (UBGA-256) - same | 256-LFBGA (UBGA-256) - same | 256-LFBGA (UBGA-256) - same |
| Logic Elements | 15,408 LE | 15,408 LE | 15,408 LE | 15,408 LE | 10,320 LE (-33%) | 6,272 LE (-59%) |
| Embedded Memory (Kbits) | 504 Kbit | 504 Kbit | 504 Kbit | 504 Kbit | 414 Kbit | 270 Kbit |
| Maximum User I/Os | 162 | 162 | 162 | 162 | 162 | 162 |
| Speed Grade | 7 (A7G) | 8 (faster) | 7 (I7G) | 6 (slower) | 7 (A7G) | 7 (A7G) |
| Operating Temperature | -40C to +125C (Industrial) | 0C to +85C (Commercial) | -40C to +125C (Industrial) | 0C to +85C (Commercial) | -40C to +125C (Industrial) | -40C to +125C (Industrial) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Hardware Multipliers (18x18) | 56 | 56 | 56 | 56 | 36 | 18 |
| PLLs | 4 | 4 | 4 | 4 | 2 | 2 |
Diferenciadores clave
- Industrial temperature range at speed grade 7 (frente a 10CL016YU256C8G)
- Same die as 10CL016 family variants - verified drop-in compatibility (frente a 10CL016YU256I7G)
- Higher logic density with same UBGA-256 footprint (frente a 10CL010YU256A7G)
Notas de diseño
The 256-ball UBGA package at 14x14 mm with 1.0 mm ball pitch requires a 4-layer PCB with microvia (HDI) stack-up for escape routing. Per Intel Cyclone 10 LP hardware design guidelines, fan-out vias should be placed between balls with appropriate anti-pad sizing. Use full ground stitching vias on a 1 mm pitch grid beneath the package thermal pad to maintain signal-integrity and reduce supply bounce on the 1.2 V core rail.
The 10CL016YU256A7G requires three separate supply rails: VCCINT (1.2 V core), VCCIO (per-bank: 1.2/1.5/1.8/2.5/3.3 V), and VCCPD (3.0-3.3 V for configuration). Estimated: at full 15K-LE utilization with 100% toggle rate, core current draw is approximately 0.5-1.0 A; designers should budget 4 x 47 uF X7R ceramic decoupling caps distributed around the package plus 0.1 uF bypass on every VCCIO bank. Power sequencing should follow Intel's recommended order (VCCINT first, then VCCPD, then VCCIO).
At full utilization with 1.2 V VCCINT and 1.0 A core current, the 10CL016YU256A7G dissipates approximately 1.2 W. With theta_JA in the range of 25-35 C/W for the 14x14 mm LFBGA package, junction temperature rise is approximately 30-40 C above ambient at room temperature. Industrial-grade (A7G) parts rated to +125C junction provide adequate margin; however, designers should still include a thermal via array under the package center pad to spread heat into inner ground planes.
DDR2/DDR3/LPDDR2 memory interfaces require matched-length routing on the byte lanes, with length-matching tolerance of +/-25 mil per Intel Cyclone 10 LP external memory interface guidelines. Use differential clock routing (CLK/CKN) with 100 ohm differential impedance. For high-speed LVDS interfaces (>500 Mbps), maintain 50 ohm single-ended and 100 ohm differential impedance on inner stripline layers and avoid routing over power-plane splits.
Common pitfalls include: (1) failing to drive nCONFIG low during power-up sequencing which can leave the FPGA in undefined state; (2) incorrect MSEL pin strapping for the desired configuration mode (AS/PS/Fast Passive); (3) using single-ended clock inputs without the required termination when the PLL is in LVDS mode; (4) attempting to bit-bang JTAG pins (TCK/TMS/TDO/TDI) as GPIO - they are configuration-dedicated. Refer to the Cyclone 10 LP pin connection guidelines for full details.
Información de cumplimiento
RoHS and REACH compliant per Intel product page. Halogen-free confirmed by 'G' suffix in MPN. Not AEC-Q100 qualified - this is an industrial-grade (not automotive-grade) part; designers needing AEC-Q100 should evaluate the Cyclone 10 LP automotive variants.
