10CL025YU256C8G - Cyclone 10 LP FPGA, 25K LE, 256-BGA | Intel
N.º de pieza: 10CL025YU256C8G ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $50.89 | $50,89 |
| 10 | $45.8 | $458,00 |
| 100 | $40.71 | $4.071,00 |
| 500 | $36.62 | $18.310,00 |
| 1.000 | $32.54 | $32.540,00 |
10CL025YU256C8G Descripción general
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware resources such as block RAM, DSP blocks, and high-speed transceivers. Within the broader taxonomy of digital logic devices, an FPGA sits between fixed-function Application Specific Integrated Circuits (ASICs) and microcontrollers, offering hardware-level parallelism with software-style reconfigurability. FPGAs belong to the broader category of programmable logic devices (PLDs) and are widely used for I/O expansion, chip-to-chip bridging, and acceleration of parallel compute tasks.
Key features of the 10CL025YU256C8G include 24,624 logic elements, 594 Kbits of embedded memory (M9K blocks), 66 embedded 18x18 multipliers, and 4 general-purpose PLLs per device. The Cyclone 10 LP family is built on a low-power process that delivers static power as low as 25 mW, making it suitable for thermally constrained designs without active cooling. Configuration is supported via an industry-standard serial or parallel configuration scheme.
The Cyclone 10 LP architecture combines an efficient logic fabric with hard IP blocks for memory interfaces (DDR3/LPDDR2 controllers), PCIe Gen2, and high-speed LVDS I/O. Designers can implement custom peripherals, state machines, and signal processing pipelines in parallel hardware, achieving deterministic latency that microcontrollers cannot match. The U256 package variant provides a 14x14 mm footprint with 0.8 mm ball pitch, supporting PCB designs that balance routing density with assembly yield.
Typical applications include industrial I/O expansion modules, motor control front-ends, sensor fusion hubs, video bridging and format adaptation, low-cost PCIe endpoint cards, and general-purpose logic replacement for discrete glue logic. The low static and dynamic power also makes the part attractive for battery-powered or fanless embedded systems.
When designing with the 10CL025YU256C8G, ensure the Quartus Prime design suite is used for synthesis, place-and-route, and timing closure. Verify all I/O assignments against the U256 pinout, and provide adequate decoupling on each power rail (1.2V core, 2.5V analog, 3.3V I/O). For high-speed LVDS or DDR3 interfaces, follow the recommended PCB stackup and impedance control guidelines.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Engineers evaluating the Cyclone 10 LP family for a new design will find parametric comparisons, alternative part numbers, and application notes consolidated in one place.
Alternativas directas para 10CL025YU256C8G — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10CL025YU256C8G (mismo factor de forma y huella) — difiere en Package, Speed Grade, Logic Elements (LE), Operating Temperature, Process Technology.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10CL025YU256C6G
✅ Sustitución directa✓ En stock
$25.6 / unidad
Ver hoja de datos →10CL025YU256A7G
✅ Sustitución directa✓ En stock
$24.1 / unidad
Ver hoja de datos →10CL016YU256C8G
✅ Sustitución directa✓ En stock
$10.87 / unidad
Ver hoja de datos →10CL016YU256C6G
✅ Sustitución directa✓ En stock
$23.75 / unidad
Ver hoja de datos →10CL016YU256A7G
✅ Sustitución directa✓ En stock
$24.9 / unidad
Ver hoja de datos →10CL025YU256C8G Valores máximos y características eléctricas
| Family | Cyclone® 10 LP |
| Series | 10CL025 |
| Logic Elements | 24,624 |
| Total RAM Bits | 608,256 |
| User I/O Count | 150 |
| Encapsulado | 256-LFBGA / UFBGA (U256) |
| Package Dimensions | 14 mm x 14 mm |
| Ball Pitch | 0.8 mm |
| Core Voltage | 1.2 V |
| Temperatura de funcionamiento | 0C to +85C (Commercial) |
| Tipo de montaje | Surface Mount |
| Lead Shape | Ball |
| Recuento de pines | 256 |
| Configuration | Serial / Parallel |
| Embedded Multipliers | 66 (18x18) |
| PLLs | 4 |
| Static Power | 25 mW (typical) |
| Estado RoHS | Compliant |
Guía de configuración de pines de 10CL025YU256C8G 14 mm x 14 mm
Configuración de pines para 10CL025YU256C8G (encapsulado 14 mm x 14 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10CL025YU256C8G.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10CL025YU256C8G es adecuado para 7 aplicacións: Industrial I/O Expansion, Motor Control Front-End, Video Bridging and Format Adaptation, Sensor Fusion Hub, Low-Cost PCIe Endpoint Card, Discrete Glue Logic Replacement, Communication Protocol Bridge.
Industrial I/O Expansion
The 10CL025YU256C8G is well suited for industrial I/O expansion modules where 24,624 logic elements can implement multiple communication protocols (Modbus, RS-485, CAN, SPI, I2C) and 150 user I/O pins deliver enough headroom for opto-isolated inputs, relay outputs, and fieldbus transceivers. The 1.2V core voltage reduces thermal dissipation compared to legacy FPGAs, enabling fanless DIN-rail enclosure designs. Pair with the MAX1300 ADC for analog front-end monitoring.
Recomendado
Motor Control Front-End
The 10CL025YU256C8G provides deterministic hardware parallelism ideal for Field-Oriented Control (FOC) and stepper motor commutation loops. Its 66 embedded 18x18 multipliers accelerate Park/Clarke transforms and PID loops at sub-microsecond latency, while the 4 general-purpose PLLs synthesize the precise PWM switching frequencies required by IGBT/MOSFET gate drivers. The 150 I/O count supports multi-axis encoder feedback and resolver excitation simultaneously.
Recomendado
Video Bridging and Format Adaptation
The 10CL025YU256C8G can implement real-time video bridging between MIPI CSI-2, LVDS, parallel RGB, and HDMI interfaces, leveraging its hardware parallelism for pixel-rate processing without software bottlenecks. The 608 Kbits of embedded RAM supports line buffers and frame synchronization FIFOs, while 150 I/O lanes accommodate multi-channel parallel video buses. This makes the part suitable for industrial cameras, medical imaging, and HMI display controllers.
Recomendado
Sensor Fusion Hub
In sensor fusion applications, the 10CL025YU256C8G aggregates IMU, magnetometer, barometric, and GNSS data streams, running Kalman filter algorithms in hardware that would overwhelm a microcontroller. The 24,624 logic elements accommodate full sensor interfaces, while the 66 multipliers accelerate matrix operations required for 9-DoF fusion. Low static power of 25 mW enables battery-powered IoT and wearable designs with always-on sensor processing.
Recomendado
Low-Cost PCIe Endpoint Card
The Cyclone 10 LP architecture supports a hard PCIe Gen2 IP core that the 10CL025YU256C8G can implement as a single-lane endpoint, making it ideal for low-cost PCIe add-in cards such as protocol analyzers, data loggers, and custom accelerators. The 24K logic elements fit a Gen2 x1 endpoint plus DMA engine and device-side state machine. Its 1.2V core reduces auxiliary board power compared to larger FPGAs, which is critical for slot-powered cards.
Recomendado
Discrete Glue Logic Replacement
For designers consolidating TTL/CMOS glue logic - counters, address decoding, custom state machines, bus arbitration - the 10CL025YU256C8G replaces dozens of discrete packages with a single programmable device. The 24,624 logic elements and 150 I/O count exceed typical glue-logic demands, leaving significant headroom for design evolution. PCB real estate is reclaimed and BOM count drops, while the 1.2V core keeps thermal dissipation low.
Recomendado
Communication Protocol Bridge
The 10CL025YU256C8G implements multi-protocol bridging between UART, SPI, I2C, CAN, Ethernet MAC, and PCIe endpoints in a single device. Its 608 Kbits embedded RAM supports packet buffering, while 150 I/O pins accommodate multiple transceiver interfaces simultaneously. The 4 PLLs generate independent clocks for each protocol domain, eliminating external clock buffers and reducing BOM complexity.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10CL025YU256C8G — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10CL025YU256C6G | 10CL025YU256A7G | 10CL016YU256C8G | 10CL016YU256C6G | 10CL016YU256A7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-LFBGA (U256) | 256-LFBGA (U256) - same | 256-LFBGA (U256) - same | 256-LFBGA (U256) - same | 256-LFBGA (U256) - same | 256-LFBGA (U256) - same |
| Logic Elements | 24,624 | 24,624 | 24,624 | 15,408 | 15,408 | 15,408 |
| Total RAM Bits | 608,256 | 608,256 | 608,256 | 303,744 | 303,744 | 303,744 |
| User I/O Count | 150 | 150 | 150 | 150 | 150 | 150 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | C8 (speed grade 8) | C6 (speed grade 6) | A7 (grade 7) | C8 (speed grade 8) | C6 (speed grade 6) | A7 (grade 7) |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
Diferenciadores clave
- 25K logic element density at low power (frente a 10CL016YU256C8G)
- Speed grade 8 (C8) timing margin (frente a 10CL025YU256C6G)
- Drop-in compatibility with full Cyclone 10 LP U256 family (frente a 10CL016YU256C8G)
Notas de diseño
Estimated: At 1.2V core voltage and typical 25 mW static power plus dynamic power (varies with utilization and toggle rate), the 10CL025YU256C8G in a U256 BGA package typically dissipates 1-3W in real designs. The U256 BGA thermal pad must be soldered to a continuous ground plane with thermal vias for proper heat dissipation; without this, junction temperature can exceed 125C in enclosed industrial enclosures. Add 4-9 thermal vias (0.3 mm drill, 1 oz copper) directly under the package thermal pad.
Use microvia-in-pad technology (laser-drilled, 0.1 mm capture pad) on the 0.8 mm BGA balls to ensure reliable assembly yield on standard 6-layer FR-4 stackup. Route all signal escapes on the top layer with dog-bone fanout, and dedicate inner layers to ground/power planes. Decouple each power rail with 100nF X7R capacitors placed within 2 mm of the BGA balls, plus 10uF bulk capacitors on each supply island (1.2V VCCINT, 2.5V VCCA, 3.3V VCCIO).
Do not mix Cyclone 10 LP pin assignments between U256 (256-ball BGA) and E144 (144-pin EQFP) packages - I/O bank assignments and pin names differ entirely. Always re-run Quartus Prime Pin Planner for the U256 package when porting designs from other Cyclone 10 LP packages. Confirm MSL3 moisture sensitivity handling per J-STD-033 before reflow assembly - U256 BGA requires pre-bake if floor life exposure exceeds 168 hours.
Información de cumplimiento
RoHS and lead-free compliance per Intel/Altera product page. Commercial temperature grade (0C to +85C); industrial/automotive variants available in I7G and A7G suffixes.
