10CX220YF780I6G - Cyclone 10 GX 220K LE FPGA, 780-FCBGA | Intel
N.º de pieza: 10CX220YF780I6G ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $136.99 | $136,99 |
| 10 | $130.48 | $1.304,80 |
| 100 | $124.26 | $12.426,00 |
| 500 | $122.5 | $61.250,00 |
| 1.000 | $121.83 | $121.830,00 |
10CX220YF780I6G Descripción general
A field-programmable gate array (FPGA) is a programmable logic device whose logic, routing and I/O are defined by configuration bitstream rather than hard-wired silicon. The Cyclone 10 GX family sits inside Intel's broader FPGA hierarchy: programmable logic device -> FPGA -> SRAM-based FPGA -> Cyclone series -> Cyclone 10 GX. Compared with ASICs, FPGAs give instant prototyping and field-upgrade flexibility; compared with low-cost CPLDs, they offer far higher logic density, embedded transceivers and DSP blocks for parallel arithmetic workloads.
Key features include up to 12 transceivers at 12.5 Gbps supporting PCIe Gen2 x4 hard IP, 6x 6.144 Gbps CPRI for wireless fronthaul, and 4 memory controllers with ECC. Logic resources scale to 220K logic elements and 156 DSP blocks for fixed- and floating-point compute. Industrial-grade temperature range (-40C to +100C) and lead-free/RoHS-compliant packaging suit embedded, broadcast and industrial imaging designs.
The Cyclone 10 GX architecture pairs a sea-of-LABs fabric with adaptive logic modules (ALMs), column-M20K memory blocks and 18x19 variable-precision DSP blocks with hardened IEEE-754 single-precision floating-point support. This combination lets one device implement both control-plane glue logic and high-throughput DSP pipelines without an external companion chip.
Typical applications include broadcast video processing, machine-vision frame grabbers, industrial motor control and encoder interfaces, low-cost PCIe accelerator cards, wireless baseband pre-processing (CPRI / OBSAI) and IoT edge analytics gateways. The high I/O count supports multiple camera sensors or Ethernet ports in a single device.
Designers should plan power-rail sequencing for the core, PLL and transceiver supplies separately and follow Intel's recommended decoupling per the Pin Connection Guidelines to meet transceiver jitter budgets. The I6G ordering code indicates industrial temperature grade, lead-free RoHS-compliant FCBGA.
This page synthesizes distributor pricing, drop-in Altera/Intel alternatives, application recommendations and design notes not found on any single distributor page.
Alternativas directas para 10CX220YF780I6G — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10CX220YF780I6G (mismo factor de forma y huella) — difiere en Package, Speed Grade, Mounting Type, DSP Blocks, Temperature Grade.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10CX220YF780I5G
✅ Sustitución directa✓ En stock
$1995 / unidad
Ver hoja de datos →10CX220YF780E6G
✅ Sustitución directa✓ En stock
$1720 / unidad
Ver hoja de datos →10CX220YF780E5G
✅ Sustitución directa✓ En stock
$615 / unidad
Ver hoja de datos →10CX150YF780I6G
✅ Sustitución directa✓ En stock
$325 / unidad
Ver hoja de datos →10CX105YF780I6G
✅ Sustitución directa✓ En stock
$1495 / unidad
Ver hoja de datos →10CX220YF780I6G Valores máximos y características eléctricas
| Family | Cyclone 10 GX |
| Logic Elements (LE) | 220,000 |
| Embedded Memory (bits) | 13,752,320 |
| User I/O Pins | 284 |
| Encapsulado | 780-FBGA (FCBGA), 29x29 mm |
| DSP Blocks | 156 |
| Process Technology | 20 nm |
| Temperatura de funcionamiento | -40C to +100C (Industrial) |
| Temperature Grade | I (Industrial) |
| Hardened PCIe | Yes - PCIe Gen2 x4 |
| Tipo de montaje | Surface Mount (BGA) |
| Nivel MSL | 3 (per JEDEC J-STD-020) |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
Guía de configuración de pines de 10CX220YF780I6G 780-fbga (fcbga), 29x29 mm
Configuración de pines para 10CX220YF780I6G (encapsulado 780-fbga (fcbga), 29x29 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10CX220YF780I6G.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10CX220YF780I6G es adecuado para 6 aplicacións: Broadcast Video Processing & Display, Industrial Machine Vision & Frame Grabbers, Low-Cost PCIe Accelerator Card, Wireless Fronthaul (CPRI / OBSAI), Motor Control & Industrial Encoder Interfaces, IoT Edge Analytics Gateway.
Broadcast Video Processing & Display
The 10CX220YF780I6G's 220K logic elements and 156 DSP blocks enable multi-channel video pipeline processing in broadcast and professional display equipment. With 284 user I/O and embedded M20K memory sufficient for multiple line buffers, the device can simultaneously handle 4K upscaling, color space conversion and frame-rate conversion without external memory contention. Hardened PCIe Gen2 x4 IP allows direct capture card integration into workstation hosts.
Recomendado
Industrial Machine Vision & Frame Grabbers
Industrial camera aggregation benefits from the 10CX220YF780I6G's 284 user I/O for multi-sensor parallel interfaces and its hardened PCIe endpoint for host-side transfer. Industrial-grade operating range (-40C to +100C) and lead-free RoHS-compliant FCBGA package suit factory-floor deployment. The DSP block count supports real-time Bayer demosaicing, defect detection and edge preprocessing directly on the FPGA before forwarding compact payloads to the host CPU.
Recomendado
Low-Cost PCIe Accelerator Card
The 10CX220YF780I6G integrates PCIe Gen2 x4 hard IP, eliminating the need for an external bridge chip on cost-optimized accelerator cards. With 220K logic elements and 13.75 Mbits of embedded memory, the device can implement moderate-throughput inference, compression or signal-processing pipelines. Its 12.5 Gbps transceivers connect to SFP+ cages for networked accelerator topologies.
Recomendado
Wireless Fronthaul (CPRI / OBSAI)
The 10CX220YF780I6G's 12 transceivers at up to 12.5 Gbps support up to 6 CPRI links at 6.144 Gbps or equivalent OBSAI rates for small-cell and remote-radio-head (RRH) fronthaul. Cyclone 10 GX's hardened PCS and deterministic latency allow time-synchronized IQ sample transport, while 220K logic elements host PHY-layer processing, framing and synchronization. Industrial temperature grade suits outdoor base-station enclosures.
Recomendado
Motor Control & Industrial Encoder Interfaces
Industrial servo and stepper motor control benefits from the 10CX220YF780I6G's combination of 284 user I/O (to interface encoders, Hall sensors and power-stage PWM channels) and 156 DSP blocks for Field-Oriented Control (FOC) math. Industrial-grade temperature range supports cabinet-mounted equipment, while the FCBGA package's high I/O density allows integration of multiple axes in a single device, reducing BOM and PCB area.
Recomendado
IoT Edge Analytics Gateway
The 10CX220YF780I6G supports edge analytics, protocol bridging and local storage in industrial IoT gateways. Its 220K logic elements run lightweight ML inference, encryption and protocol stacks (Modbus, EtherCAT, OPC-UA) while transceivers handle gigabit Ethernet uplinks. The hardened PCIe Gen2 endpoint lets designers add Wi-Fi 6 or 5G modems via M.2 sockets, and industrial temperature grade suits factory and outdoor cabinet deployments.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10CX220YF780I6G — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10CX220YF780I5G | 10CX220YF780E6G | 10CX220YF780E5G | 10CX150YF780I6G | 10CX105YF780I6G |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (FCBGA), 29x29 mm | 780-FBGA (FCBGA) - same | 780-FBGA (FCBGA) - same | 780-FBGA (FCBGA) - same | 780-FBGA (FCBGA) - same | 780-FBGA (FCBGA) - same |
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 220,000 | 220,000 | 220,000 | 220,000 | 150,000 | 105,000 |
| User I/O | 284 | 284 | 284 | 284 | 284 | 284 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended (0C to +100C) | Extended (0C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| RoHS / Lead-Free | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes |
Diferenciadores clave
- Highest-density Cyclone 10 GX in the 780-FBGA footprint (frente a 10CX150YF780I6G)
- Industrial temperature grade (-40C to +100C) (frente a 10CX220YF780E6G)
- Latest process revision (I6G) for improved silicon yield and power (frente a 10CX220YF780I5G)
Notas de diseño
The 10CX220YF780I6G requires separate power rails for the core (VCC), PLL (VCCA_PLL), transceiver blocks (VCCR_GXB / VCCT_GXB) and I/O banks (VCCIO). Power-rail ramp rates must follow Intel's Power-Up and Sequencing Guidelines for Cyclone 10 GX - typically monotonic ramp within 10 ms with strict sequencing of VCC before VCCIO. Failure to sequence correctly risks latch-up or in-rush currents that exceed package current limits.
Estimated: at full transceiver utilization (12 lanes at 12.5 Gbps) plus 70% logic utilization in a still-air environment, junction temperature can approach 95C. The 780-FBGA package exposes a thermal pad that must be soldered to a continuous ground plane with thermal vias (0.3 mm pitch, 0.2 mm drill) per Intel's Thermal Management Guidelines. For 10W+ designs, add a heatsink or forced-air cooling to maintain industrial-grade temperature margin.
Decoupling: place 0.1 uF MLCCs every 5-8 mm along VCCIO rails and 10 uF bulk caps within 50 mm of each supply pin. Transceiver rails need 0.01 uF + 0.1 uF + 4.7 uF per channel. Matched-length differential pairs for transceivers must be length-matched within 0.127 mm and skew-matched to the reference clock per Intel's Pin Connection Guidelines (PCG) for Cyclone 10 GX. Use a 4-8 layer stack-up with dedicated ground and power planes adjacent to the BGA break-out layer.
Do not confuse the F780 780-FBGA package with the F672 672-FBGA - they have different ball patterns, different I/O counts, and require entirely different PCB footprints. Reusing a 780-FBGA symbol on a 672-FBGA board will cause assembly failure. Also note that Cyclone 10 GX bitstreams are not compatible with Cyclone V or Cyclone IV - design reuse must include re-compilation with the Cyclone 10 GX device library in Intel Quartus Prime.
Transceiver channels require AC-coupling capacitors (typically 100 nF) on each serial link. Reference clock must be a low-jitter oscillator (typically <300 fs RMS for 10.3125 Gbps operation). Use IBIS-AMI models from Intel for channel simulation; run link-training with the Quartus Prime Transceiver Toolkit to validate eye margin before committing to PCB fabrication.
Información de cumplimiento
RoHS and lead-free confirmed via I6G ordering code suffix per Intel/Altera ordering code reference. Not AEC-Q100 qualified (industrial-grade FPGAs typically not qualified to AEC-Q100; AEC-Q100 parts are separate automotive OPNs). MSL 3 per JEDEC J-STD-020.
