10CX220YF780I5G - Cyclone 10 GX 220K LE FPGA | Intel | F780
N.º de pieza: 10CX220YF780I5G ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $2850 | $2.850,00 |
| 10 | $2680 | $26.800,00 |
| 100 | $2420 | $242.000,00 |
| 500 | $2210 | $1.105.000,00 |
| 1.000 | $1995 | $1.995.000,00 |
10CX220YF780I5G Descripción general
What is a Cyclone 10 GX FPGA? An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device containing programmable logic blocks, interconnect, and I/O that can be customized after manufacturing using HDL bitstreams. Cyclone 10 GX sits in Intel's low-end FPGA portfolio below Stratix 10, targeting power- and cost-sensitive applications that still need high-speed transceivers and embedded hard IP. Within the broader taxonomy: FPGA -> programmable logic device (PLD) -> digital IC -> integrated circuit (IC).
Key features of the 10CX220YF780I5G include 284 (18x19) variable-precision DSP blocks, 12 transceiver channels up to 12.5 Gbps supporting protocols such as PCIe Gen2 x4, 10GbE, CPRI, and JESD204B, hard memory controllers, and a maximum of 284 user I/O pins. The device supports the -40C to +100C industrial temperature range (the 'I' speed/temperature grade), making it suitable for harsh-environment industrial and military/aerospace adjacent applications.
Architecturally, the 10CX220 uses a 20 nm process technology, an adaptive logic module (ALM) based core fabric, and embedded SRAM blocks distributed across the die. The hard IP blocks (PCIe, memory controllers, transceivers) reduce soft logic overhead and power consumption. The 780-pin FCBGA package provides ample signal breakout for the high-speed serial links and parallel I/O.
Typical applications include industrial machine vision and video processing, motor control and factory automation, broadcast and professional video (SDI/DisplayPort bridges), 4K UHD video capture cards, software-defined radio (SDR) platforms, and PCIe-based accelerator cards in edge computing. The combination of low static power, transceiver bandwidth, and small footprint suits space-constrained embedded designs.
When designing with the Cyclone 10 GX, engineers should plan power sequencing, JTAG access, and configuration scheme (AS, PS, JTAG, or FPP) up front. Use Intel Quartus Prime Lite/Standard edition for synthesis, place-and-route, and timing closure. The 780-ball BGA requires PCB design rules for microvia stacks and controlled-impedance routing on high-speed TX/RX pairs.
This page synthesizes distributor pricing, drop-in same-family alternatives (10CX220YF780I6G, 10CX220YF780E5G, etc.), a 780-FCBGA pinout reference, and practical Quartus Prime design notes not found in the bare datasheet PDF.
Alternativas directas para 10CX220YF780I5G — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10CX220YF780I5G (mismo factor de forma y huella) — difiere en Package, DSP Blocks, Speed Grade, Process Technology, Hardened PCIe.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10CX220YF780I6G
✅ Sustitución directa✓ En stock
$121.83 / unidad
Ver hoja de datos →10CX220YF780E5G
✅ Sustitución directa✓ En stock
$615 / unidad
Ver hoja de datos →10CX220YF780E6G
✅ Sustitución directa✓ En stock
$1720 / unidad
Ver hoja de datos →10CX220YF780I5G Valores máximos y características eléctricas
| Series | Cyclone 10 GX |
| Logic Elements | 220,000 |
| Embedded Memory (bits) | 13,752,320 |
| DSP Blocks | 284 (variable-precision) |
| Maximum User I/O | 284 |
| Transceivers | Up to 12 channels at up to 12.5 Gbps |
| Hard IP | PCIe Gen2 hard IP, hard memory controllers |
| Process Technology | 20 nm |
| Encapsulado | 780-BBGA, FCBGA (F780) |
| Tipo de montaje | Surface Mount (BGA) |
| Temperatura de funcionamiento | -40C to +100C (Industrial) |
| Speed Grade | 5 (industrial) |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
| Configuration Schemes | AS, PS, JTAG, FPP |
Guía de configuración de pines de 10CX220YF780I5G 780-bbga, fcbga (f780)
Configuración de pines para 10CX220YF780I5G (encapsulado 780-bbga, fcbga (f780)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10CX220YF780I5G.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10CX220YF780I5G es adecuado para 7 aplicacións: Industrial Machine Vision, 4K UHD Video Capture and Processing, Factory Automation and Motor Control, Software Defined Radio (SDR) Platform, PCIe Accelerator Cards for Edge Computing, Medical Imaging and Diagnostics, Aerospace Avionics and UAV Payloads.
Industrial Machine Vision
The 10CX220YF780I5G is ideal for industrial machine vision and image processing pipelines requiring high-speed parallel sensor interfaces. The 220K logic elements and 284 DSP blocks deliver real-time processing for Bayer demosaicing, color correction, and edge detection on streams up to 4K at 60 fps. The 12.5 Gbps transceivers accept MIPI CSI-2, SLVS-EC, or sub-LVDS sensor data via FPGA PHY bridges. Compared to ASSP vision processors, the Cyclone 10 GX delivers deterministic latency and field-upgradable algorithms while consuming less than 8 W typical. The industrial temperature grade (-40C to +100C) supports factory floor deployment without additional thermal management. Companion MPNs include image sensor serializers and external DRAM.
Recomendado
4K UHD Video Capture and Processing
Broadcast and professional video capture cards leverage the 10CX220YF780I5G for SDI/HDMI/DisplayPort bridging and color-space conversion. The hard PCIe Gen2 x4 endpoint IP delivers up to 20 Gbps host throughput, sufficient for uncompressed 4K 60p video ingest. Embedded memory (13.75 Mbits) and 284 DSP blocks implement real-time scaling, sharpening, and overlay composition. The transceiver channels support 12G-SDI and DisplayPort 1.2 at full rate without external reclockers. Designers pair the FPGA with HDMI 2.0 receivers and SDI adaptive cable equalizers. Compared to ASIC solutions, the Cyclone 10 GX enables protocol upgrades via bitstream reload.
Recomendado
Factory Automation and Motor Control
The 10CX220YF780I5G drives multi-axis motor control and real-time industrial Ethernet in factory automation. The 220K logic elements implement field-oriented control (FOC), SVPWM, and EtherCAT/CANopen/EtherNet/IP protocol stacks in soft logic. The 284 user I/O pins connect to multiple encoder inputs, gate drivers, and current/voltage sensors without external muxing. The industrial temperature grade (-40C to +100C) ensures operation in unconditioned cabinets. Transceivers enable PROFINET IRT and SERCOS III at 100 Mbps. Compared to microcontrollers, the FPGA delivers deterministic sub-microsecond control loop timing critical for high-speed servo control.
Recomendado
Software Defined Radio (SDR) Platform
Software defined radio designs use the 10CX220YF780I5G for wideband ADC/DAC interfacing, digital up/down-conversion (DUC/DDC), and channelization. The 12 transceiver channels operating up to 12.5 Gbps accept JESD204B/C data from RF ADCs like the AD9234 or AD9680 at full sample rate. The 284 DSP blocks implement polyphase filterbanks, FFTs, and digital pre-distortion (DPD) for transmit chains. Hard memory controllers feed external DDR3/DDR4 for capture buffers. Compared to GPU-based SDR, the Cyclone 10 GX delivers deterministic low-latency processing with lower power. The industrial temperature grade supports outdoor tactical and aerospace adjacent deployments.
Recomendado
PCIe Accelerator Cards for Edge Computing
Edge computing accelerator cards use the 10CX220YF780I5G as a low-cost FPGA host for inference and signal preprocessing. The hard PCIe Gen2 x4 IP block in endpoint mode delivers up to 20 Gbps host interconnect for low-latency data transfer. The 220K logic elements implement quantized CNN inference engines, FFT pipelines, or protocol offload. The 780-FCBGA package provides ample I/O for QSFP28 network interfaces and DDR4 SODIMM memory expansion. Compared to high-end Stratix 10 devices, the Cyclone 10 GX offers lower static power (~3 W typical) for thermally constrained edge enclosures. The 'I5G' speed/temperature grade supports industrial edge servers.
Recomendado
Medical Imaging and Diagnostics
The 10CX220YF780I5G serves medical imaging systems including ultrasound, endoscopy, and digital X-ray detector readout. The 284 DSP blocks deliver real-time beamforming for 64-channel ultrasound with sub-degree phase resolution. The 13.75 Mbit embedded memory and external DDR3 interface store raw RF frame buffers before compression. Transceivers accept LVDS data from TFT detector panels at multi-Gbps rates. The industrial temperature grade supports operating-room and field-deployment environments. Compared to DSP-only solutions, the FPGA enables field upgrades for new imaging modes without hardware redesign. Compliance with IEC 60601-1 is the integrator's responsibility.
Recomendado
Aerospace Avionics and UAV Payloads
Unmanned aerial vehicle (UAV) and avionics payloads use the 10CX220YF780I5G for sensor fusion, video encoding, and low-latency communication links. The transceiver channels support SDR datalinks, MIL-STD-1553B bridges, and ARINC 429 interfaces via soft IP. The 220K logic elements implement H.264/H.265 encoding for full-HD video downlink. The industrial temperature grade (-40C to +100C) handles avionics bay and high-altitude conditions. The 780-FCBGA package offers mechanical robustness for vibration profiles per DO-160. Compared to ASIC-based solutions, the FPGA enables post-deployment algorithm updates via partial reconfiguration.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10CX220YF780I5G — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10CX220YF780I6G | 10CX220YF780E5G | 10CX220YF780E6G | 10CX220YF672I5G | 10CX220YF672I6G |
|---|---|---|---|---|---|---|
| Package | 780-BBGA, FCBGA (F780) | 780-BBGA, FCBGA (F780) - same | 780-BBGA, FCBGA (F780) - same | 780-BBGA, FCBGA (F780) - same | 672-BBGA, FCBGA (F672) - different | 672-BBGA, FCBGA (F672) - different |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 220,000 | 220,000 | 220,000 | 220,000 | 220,000 | 220,000 |
| Speed Grade | 5 | 6 (faster) | 5 | 6 (faster) | 5 | 6 (faster) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended (0C to +85C) | Extended (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Embedded Memory (bits) | 13,752,320 | 13,752,320 | 13,752,320 | 13,752,320 | 13,752,320 | 13,752,320 |
| DSP Blocks | 284 | 284 | 284 | 284 | 284 | 284 |
| Max Transceiver Rate | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps |
| Pin-to-Pin Drop-In Compatible | Reference | Yes - identical ball map, only speed grade differs | Yes - identical ball map, only temp grade differs | Yes - identical ball map, temp and speed differ | No - 672-BBGA vs 780-BBGA, requires PCB redesign | No - 672-BBGA vs 780-BBGA, requires PCB redesign |
Diferenciadores clave
- 12.5 Gbps transceiver bandwidth at lowest power in its class (frente a 10CL120YF780I7G (Cyclone V))
- Hard PCIe Gen2 IP block eliminates soft-logic overhead (frente a 10CX150YF780I5G (lower-density sibling))
- 780-FCBGA package offers maximum I/O density in Cyclone 10 GX family (frente a 10CX220YF672I5G (F672 package))
Notas de diseño
Estimated: Cyclone 10 GX 10CX220 at full resource utilization (~85% LE, all transceivers active) dissipates approximately 5-8 W typical and up to 12 W peak. The 780-FCBGA package thermal resistance theta_JB is approximately 2.1 C/W (junction-to-board). For typical 8 W dissipation at 100C ambient, junction-to-board temperature rise is ~17C, leaving ~63C headroom for board-level thermal design. Recommended: use a 6-layer PCB with a dedicated inner ground plane stitched with thermal vias (0.3 mm pitch, 0.2 mm drill) under the BGA for heat spreading. Above 10 W dissipation, attach a small heatsink via thermal interface material.
The 780-FBGA package uses a 1.0 mm ball pitch. PCB design requires microvia (laser-drilled, 0.1 mm) stack-up to break out the inner rows. Use a 1-2-1 or 1-2-2-1 HDI stack-up with 0.4 mm core. Maintain 50 ohm single-ended and 100 ohm differential controlled impedance for high-speed transceiver channels. Length-match + and - pairs within 150 microns for 12.5 Gbps signals. Keep AC-coupling capacitors within 4 mm of the FPGA receiver balls. Reference Cyclone 10 GX device family pin connection guidelines for unused-pin handling.
Common pitfall: leaving JTAG TCK floating causes spurious configuration attempts. Always tie TCK to GND via 1-10 kohm pulldown if unused. Pitfall: failing to provide a clean core voltage ramp (VCCINT 0.95V) within 100 ms risks CMOS latch-up; use a soft-start controller like the LTC3026 or Intel's recommended power sequencer. Pitfall: for production boards, do not rely on Active Serial (AS) configuration without external watchdog - add a configuration reset supervisor to recover from brownouts. Always validate bitstream with Quartus Prime 18.1 or later for Cyclone 10 GX support.
The 10CX220 requires multiple supply rails: VCCINT (0.95V core), VCCD_PLL (1.0V for PLLs), VCCPT (1.0V for transceiver digital), VCCA_PLL, VCC_HSSI (1.0-1.2V for transceivers), VCCIO (1.2V-3.3V depending on I/O bank standard). Recommended power solution: Intel's Cyclone 10 GX power management reference uses the LTC3026 (core), ISL80015 (transceiver), and a DDR termination regulator. Use a 4-6 phase controller if paralleling regulators for high-transceiver designs. Estimated typical total power budget at 8 W: 5.5 A on VCCINT, 1.2 A on VCC_HSSI.
Información de cumplimiento
RoHS compliant per Altera/Intel product page ('G' suffix = lead-free). AEC-Q100 not applicable - this is an industrial-grade FPGA, not an automotive-qualified part. Refer to Intel automotive product lines for AEC-Q100 equivalents.
