10M02SCU169A7G - MAX 10 FPGA, 2K LE, 169-UBGA | Intel / Altera
N.º de pieza: 10M02SCU169A7G ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $22.75 | $22,75 |
| 10 | $20.48 | $204,80 |
| 100 | $17.95 | $1.795,00 |
| 500 | $15.21 | $7.605,00 |
| 1.000 | $13.42 | $13.420,00 |
10M02SCU169A7G Descripción general
What is a MAX 10 FPGA? The MAX 10 is a non-volatile FPGA family from Intel, sitting in the taxonomy: programmable logic device (PLD) -> FPGA -> non-volatile FPGA -> low-density FPGA (under 50K LEs). Unlike SRAM-based FPGAs that require an external boot flash, MAX 10 integrates configuration flash on-die, enabling instant-on behavior at sub-15 ms. The family also embeds hard IP such as ADCs, PLLs, and DDR3 memory controllers, lowering BOM cost and PCB area for cost-sensitive industrial, automotive, and consumer applications.
Key features of the 10M02SCU169A7G include 130 user I/Os (out of 169 total balls), DSP blocks (12 x 18x18 multipliers), four general-purpose PLLs, support for LPDDR2, DDR3, DDR3L, and DDR2 external memory interfaces, an internal configuration speed up to 166 MHz, and 1.0 V/1.2 V core voltage options. The device operates across commercial and industrial temperature grades with the '7' speed grade ordering code denoting industrial temperature. Its 169-ball UBGA package offers a compact 11x11 mm footprint suitable for space-constrained designs.
The MAX 10 architecture combines a logic array fabric with hard IP for DSP arithmetic, embedded SRAM, and configuration flash. The dual-boot capability allows the FPGA to boot from on-chip flash for instant-on applications, then optionally load from external sources for field updates. The 12 x 18x18 multipliers enable fixed- and floating-point DSP operations without consuming soft logic, while the integrated ADC (1 Msps, 12-bit, 16 channels) eliminates external ADC chips for sensor-monitoring applications.
Typical applications include industrial motor control, factory automation I/O expansion, portable medical device glue logic, automotive driver-assistance (ADAS) sensor pre-processing, low-cost video processing, and as a bridge/companion to higher-end CPUs and SoCs. The instant-on capability also suits power-sequencing and hot-swap controller roles.
When designing with the 10M02SCU169A7G, verify the 169-ball UBGA land pattern, ensure JTAG access for in-system programming, and use Intel Quartus Prime (Lite or Standard) for synthesis. For migration to higher-density MAX 10 devices (10M08, 10M16, 10M25, 10M40, 10M50), the U169 package is footprint-compatible with the larger members of the MAX 10 family, simplifying board upgrades.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers source, qualify, and design with the 10M02SCU169A7G efficiently.
Alternativas directas para 10M02SCU169A7G — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10M02SCU169A7G (mismo factor de forma y huella) — difiere en Package, Process Technology, Core Voltage, PLLs, Family.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10M02SCE144A7G
✅ Sustitución directa✓ En stock
$4.62 / unidad
Ver hoja de datos →10M02SCU169C8G
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
10M02SCU169I7G
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
10M02SCU169A8G
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
LCMXO2-2000HC-4TG144C
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC2C32A-6VQG44C
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
10M02SCU169A7G Valores máximos y características eléctricas
| Family | MAX 10 |
| Logic Elements (LEs) | 2,000 |
| Adaptive Logic Modules (ALMs) | 160 |
| User Flash Memory | 110,592 bits |
| Block RAM (M9K) | 138 Kbits |
| DSP Blocks (18x18 Multipliers) | 12 |
| PLLs | 4 (fractional) |
| Maximum User I/O Pins | 130 |
| Encapsulado | 169-ball UBGA (U169) |
| Package Size | 11 x 11 mm |
| Process Technology | 55 nm embedded flash (TSMC) |
| Configuration Method | Internal flash, dual-boot support |
| Temperatura de funcionamiento | -40C to +125C (industrial) |
| Core Voltage | 1.0 V / 1.2 V |
| Speed Grade | 7 |
| Estado RoHS | Compliant |
Guía de configuración de pines de 10M02SCU169A7G 11 x 11 mm
Configuración de pines para 10M02SCU169A7G (encapsulado 11 x 11 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10M02SCU169A7G.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10M02SCU169A7G es adecuado para 6 aplicacións: Industrial Motor Control, Factory Automation I/O Expansion, Automotive Sensor Pre-Processing, Portable Medical Device Glue Logic, Low-Cost Video Processing & Bridging, Power Sequencing & Hot-Swap Control.
Industrial Motor Control
The 10M02SCU169A7G's 2,000 logic elements and 12 DSP 18x18 multipliers are well-matched to sensorless FOC and trapezoidal BLDC motor control loops, while the 169-ball UBGA package supports the wide pin count required for multi-axis encoder feedback. The device's industrial -40C to +125C temperature rating suits factory-floor cabinet environments, and instant-on flash configuration eliminates boot-time delays during safety-critical power-up sequencing. Quartus Prime DSP Builder and the integrated 12-bit ADC (separate ADC block on larger MAX 10) provide closed-loop current sensing without an external ADC chip.
Recomendado
Factory Automation I/O Expansion
With 130 user I/Os, the 10M02SCU169A7G can aggregate dozens of 24V industrial signals, perform level translation between 3.3V LVCMOS and 5V LVTTL, and add protocol bridging (Modbus, RS-485, I2C, SPI) in a single chip. The on-chip user flash stores configuration parameters and calibration constants per production line, while instant-on flash boot eliminates PLC scan-time jitter at startup. The wide LVDS support enables high-speed encoder and fieldbus interfaces.
Recomendado
Automotive Sensor Pre-Processing
The 10M02SCU169A7G's industrial temperature rating and robust 55 nm embedded flash process make it suitable for in-cabin sensor pre-processing in entry-level ADAS, body controllers, and driver-monitoring subsystems. The 2,000 LEs can implement image-pipeline pre-filters (resize, color-space conversion) before forwarding data to an external SoC over LVDS, while the 12 DSP blocks accelerate fixed-point FFT pre-processing for ultrasonic parking sensors. AEC-Q100 qualification status should be verified per specific MAX 10 part variant.
Recomendado
Portable Medical Device Glue Logic
In portable medical devices (blood-glucose meters, pulse oximeters, handheld ECGs), the 10M02SCU169A7G replaces multiple discrete CPLDs and logic buffers by consolidating display control, keypad scanning, battery management, and sensor I/O into a single programmable device. The 110 Kbits of user flash stores calibration coefficients and device serial numbers, while the instant-on capability supports fast wake-from-standby user experiences. Low static power consumption and small UBGA-169 footprint suit battery-powered handheld form factors.
Recomendado
Low-Cost Video Processing & Bridging
The 10M02SCU169A7G supports LVDS, MIPI D-PHY (with external resistors), and CMOS video interfaces, enabling low-cost video bridging applications such as format conversion between MIPI-CSI and parallel CMOS, frame-buffer cropping, and OSD overlay. The 12 x 18x18 DSP multipliers perform real-time color-space conversion and gamma correction. The dual-boot flash supports secure boot and field firmware updates for video processing modules in kiosks and digital signage.
Recomendado
Power Sequencing & Hot-Swap Control
The 10M02SCU169A7G's instant-on non-volatile configuration (sub-15 ms boot) and 130 LVCMOS-capable I/Os make it ideal for complex multi-rail power-sequencing controllers in ATCA, AdvancedTCA, and high-availability server backplanes. The 12 DSP blocks and 138 Kbits of M9K block RAM enable real-time monitoring of voltage, current, and temperature rails via integrated ADC channels. The on-chip user flash stores fault logs and sequencing profiles that survive power cycling.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10M02SCU169A7G — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10M02SCE144A7G | 10M02SCU169C8G | 10M02SCU169I7G | LCMXO2-2000HC-4TG144C |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Lattice Semiconductor |
| Package | 169-ball UBGA (U169) | 144-pin EQFP | 169-ball UBGA (U169) - same | 169-ball UBGA (U169) - same | 144-pin TQFP |
| Logic Elements | 2,000 | 2,000 | 2,000 | 2,000 | 2,000 LUTs |
| Block RAM | 138 Kbits | 138 Kbits | 138 Kbits | 138 Kbits | 74 Kbits |
| User Flash | 110,592 bits | 110,592 bits | 110,592 bits | 110,592 bits | None (volatile config) |
| DSP Blocks | 12 x 18x18 | 12 x 18x18 | 12 x 18x18 | 12 x 18x18 | None (soft multipliers) |
| Max User I/O | 130 | 79 | 130 | 130 | 104 |
| Operating Temperature | -40C to +125C (Industrial) | -40C to +125C (Industrial) | 0C to +85C (Commercial) | -40C to +125C (Industrial) | 0C to +85C (Commercial) |
Diferenciadores clave
- On-chip user flash for parameter storage (frente a LCMXO2-2000HC-4TG144C)
- Footprint-compatible same-family upgrades (frente a 10M02SCE144A7G)
- Integrated DSP blocks for fixed-point math (frente a XC2C32A-6VQG44C)
Notas de diseño
The 169-ball U169 UBGA uses a 0.8 mm ball pitch and 11x11 mm body. Use 0.4 mm-diameter NSMD (non-solder-mask defined) pads with a 0.5 mm via-in-pad (VIPPO) stack-up for reliable BGA reflow. Assign at least 4 inner layers to GND for return-path integrity, and route all 4 PLL analog power pins (VCCA_PLL) from a ferrite-isolated 2.5V LDO to minimize jitter. Estimated: based on standard MAX 10 U169 layout guidelines; verify against the MAX 10 Hardware Reference Manual.
The MAX 10 core requires 1.0 V (low-power mode) or 1.2 V (typical). VCCIO is banked and supports 1.2 V to 3.3 V per I/O bank. Place 0.1 uF X7R ceramic decoupling caps within 2 mm of every VCC pin and one 10 uF bulk cap per power rail. Estimate: a fully-loaded 10M02 design with 130 active I/Os and 100 MHz operation consumes approximately 25-50 mA quiescent current and 150-300 mA peak; verify against the MAX 10 PowerPlay Early Power Estimator before final BOM release.
Do not confuse the U169 UBGA package with the older E144 EQFP package - the ball pitch and footprint are not compatible. Ensure JTAG TMS, TDI, TDO, TCK pins are routed with 4.7 kohm pull-ups to VCCIO_8 (3.3 V) to enable reliable configuration from a USB-Blaster. The CONFIG_SEL pin (if present in your variant) must be tied high for internal flash boot, or low for external EPCQ boot. The DEV_OE and DEV_CLRn pins should be tied to logic high and 4.7 kohm pull-up respectively for normal operation.
Información de cumplimiento
RoHS and REACH compliance confirmed via Altera/Intel product environmental compliance documentation. AEC-Q100 status is part-variant dependent - check specific MAX 10 automotive datasheet addendum for AEC-qualified variants. Halogen-free per JEDEC JS709B.
