10M02SCE144A7G - MAX 10 FPGA, 2K LE, 144-EQFP | Intel
MPN: 10M02SCE144A7G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.04 | $8.04 |
| 10 | $7.23 | $72.30 |
| 100 | $6.43 | $643.00 |
| 500 | $5.76 | $2,880.00 |
| 1,000 | $5.14 | $5,140.00 |
| 3,000 | $4.62 | $13,860.00 |
Drop-in alternatives for 10M02SCE144A7G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
10M02SCE144I7G
β Drop-Inπ Reference alternative (not in catalog)
10M02SCU324I7G
β Drop-Inπ Reference alternative (not in catalog)
10M02SCE144A7G
β Drop-Inβ In Stock
$4.62 / Unit
View Datasheet β10M02SCE144C8G
β Drop-Inπ Reference alternative (not in catalog)
10M02SCE144C7G
β Drop-Inπ Reference alternative (not in catalog)
10M02SCU169I7G
β Drop-Inπ Reference alternative (not in catalog)
10M02SCE144A7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 2,000 |
| User I/O Count | 101 |
| Embedded Memory (RAM) | 1,016 Kbit |
| User Flash Memory | 1,008 Kbit (110,592 bit per datasheet) |
| Embedded Multipliers (18x18) | 16 |
| PLLs | 2 |
| Hard Memory Controller | DDR3 / LPDDR2 |
| On-chip ADC | 12-bit, 1 MSa/s (1 module) |
| Core Voltage | 1.2 V (internal LDO) |
| I/O Voltage | 3.3 V / 2.5 V |
| Process Technology | 55 nm CMOS |
| Configuration Memory | On-chip non-volatile flash |
| Package | EQFP-144 (22 x 22 mm, 0.5 mm pitch, exposed pad) |
| Mounting Type | Surface Mount |
| Operating Junction Temperature | -40C to +125C |
| Bitstream Encryption | AES-256 |
| RoHS Status | Compliant |
10M02SCE144A7G Pin Configuration
| Pin 1 | IO β General purpose user I/O (bank 1) |
| Pin 2 | IO β General purpose user I/O (bank 1) |
| Pin 3 | VCCIO1 β I/O bank 1 supply (3.3 V / 2.5 V) |
| Pin 4 | IO β General purpose user I/O (bank 1) |
| Pin 5 | IO β General purpose user I/O (bank 1) |
| Pin 6 | GND β Ground |
| Pin 7 | IO β General purpose user I/O (bank 1) |
| Pin 8 | IO β General purpose user I/O (bank 1) |
| Pin 9 | VCCIO1 β I/O bank 1 supply (3.3 V / 2.5 V) |
| Pin 10 | IO β General purpose user I/O (bank 1) |
| Pin 11 | IO β General purpose user I/O (bank 1) |
| Pin 12 | GND β Ground |
| Pin 13 | IO β General purpose user I/O (bank 2) |
| Pin 14 | VCCIO2 β I/O bank 2 supply (3.3 V / 2.5 V) |
| Pin 15 | IO β General purpose user I/O (bank 2) |
| Pin 16 | GND β Ground |
| Pin 17 | VCCA_ADC β Analog ADC supply (2.5 V) |
| Pin 18 | ADCIN1 β Analog ADC input channel 1 |
| Pin 19 | VCCA β Analog PLL supply (2.5 V) |
| Pin 20 | GNDA β Analog ground |
| Pin 21 | VCCINT β Core supply (1.2 V) |
| Pin 22 | VCCINT β Core supply (1.2 V) |
| Pin 23 | GND β Ground |
| Pin 24 | VCCIO3 β I/O bank 3 supply (3.3 V / 2.5 V) |
| Pin 25 | IO β General purpose user I/O (bank 3) |
| Pin 26 | IO β General purpose user I/O (bank 3) |
| Pin 27 | GND β Ground |
| Pin 28 | IO β General purpose user I/O (bank 3) |
| Pin 29 | VCCIO3 β I/O bank 3 supply (3.3 V / 2.5 V) |
| Pin 30 | IO β General purpose user I/O (bank 3) |
| Pin 31 | IO β General purpose user I/O (bank 3) |
| Pin 32 | GND β Ground |
| Pin 33 | IO β General purpose user I/O (bank 3) |
| Pin 34 | VCCIO4 β I/O bank 4 supply (3.3 V / 2.5 V) |
| Pin 35 | IO β General purpose user I/O (bank 4) |
| Pin 36 | GND β Ground |
| Pin 37 | CONF_DONE β Configuration done status output |
| Pin 38 | nSTATUS β Configuration status output (active low) |
| Pin 39 | nCONFIG β Configuration control input (active low) |
| Pin 40 | TMS β JTAG test mode select |
| Pin 41 | TCK β JTAG test clock |
| Pin 42 | TDO β JTAG test data output |
| Pin 43 | TDI β JTAG test data input |
| Pin 44 | VCCIO5 β I/O bank 5 supply (3.3 V / 2.5 V) |
| Pin 45 | IO β General purpose user I/O (bank 5) |
| Pin 46 | IO β General purpose user I/O (bank 5) |
| Pin 47 | GND β Ground |
| Pin 48 | IO β General purpose user I/O (bank 5) |
| Pin 49 | VCCIO5 β I/O bank 5 supply (3.3 V / 2.5 V) |
| Pin 50 | IO β General purpose user I/O (bank 5) |
| Pin 51 | IO β General purpose user I/O (bank 5) |
| Pin 52 | GND β Ground |
| Pin 53 | IO β General purpose user I/O (bank 6) |
| Pin 54 | VCCIO6 β I/O bank 6 supply (3.3 V / 2.5 V) |
| Pin 55 | IO β General purpose user I/O (bank 6) |
| Pin 56 | GND β Ground |
| Pin 57 | IO β General purpose user I/O (bank 6) |
| Pin 58 | VCCIO6 β I/O bank 6 supply (3.3 V / 2.5 V) |
| Pin 59 | IO β General purpose user I/O (bank 6) |
| Pin 60 | IO β General purpose user I/O (bank 6) |
| Pin 61 | GND β Ground |
| Pin 62 | IO β General purpose user I/O (bank 7) |
| Pin 63 | VCCIO7 β I/O bank 7 supply (3.3 V / 2.5 V) |
| Pin 64 | IO β General purpose user I/O (bank 7) |
| Pin 65 | IO β General purpose user I/O (bank 7) |
| Pin 66 | GND β Ground |
| Pin 67 | IO β General purpose user I/O (bank 7) |
| Pin 68 | IO β General purpose user I/O (bank 7) |
| Pin 69 | VCCIO7 β I/O bank 7 supply (3.3 V / 2.5 V) |
| Pin 70 | IO β General purpose user I/O (bank 7) |
| Pin 71 | GND β Ground |
| Pin 72 | IO β General purpose user I/O (bank 8) |
| Pin 73 | VCCIO8 β I/O bank 8 supply (3.3 V / 2.5 V) |
| Pin 74 | IO β General purpose user I/O (bank 8) |
| Pin 75 | IO β General purpose user I/O (bank 8) |
| Pin 76 | GND β Ground |
| Pin 77 | IO β General purpose user I/O (bank 8) |
| Pin 78 | VCCIO8 β I/O bank 8 supply (3.3 V / 2.5 V) |
| Pin 79 | IO β General purpose user I/O (bank 8) |
| Pin 80 | IO β General purpose user I/O (bank 8) |
| Pin 81 | GND β Ground |
| Pin 82 | CLK0 β Dedicated clock input 0 |
| Pin 83 | CLK1 β Dedicated clock input 1 |
| Pin 84 | VCCIO8 β I/O bank 8 supply (3.3 V / 2.5 V) |
| Pin 85 | IO β General purpose user I/O (bank 8) |
| Pin 86 | IO β General purpose user I/O (bank 8) |
| Pin 87 | GND β Ground |
| Pin 88 | IO β General purpose user I/O (bank 8) |
| Pin 89 | IO β General purpose user I/O (bank 8) |
| Pin 90 | VCCIO8 β I/O bank 8 supply (3.3 V / 2.5 V) |
| Pin 91 | IO β General purpose user I/O (bank 8) |
| Pin 92 | GND β Ground |
| Pin 93 | VCCINT β Core supply (1.2 V) |
| Pin 94 | VCCINT β Core supply (1.2 V) |
| Pin 95 | GND β Ground |
| Pin 96 | IO β General purpose user I/O (bank 1) |
| Pin 97 | VCCIO1 β I/O bank 1 supply (3.3 V / 2.5 V) |
| Pin 98 | IO β General purpose user I/O (bank 1) |
| Pin 99 | IO β General purpose user I/O (bank 1) |
| Pin 100 | GND β Ground |
| Pin 101 | IO β General purpose user I/O (bank 1) |
| Pin 102 | IO β General purpose user I/O (bank 1) |
| Pin 103 | VCCIO1 β I/O bank 1 supply (3.3 V / 2.5 V) |
| Pin 104 | IO β General purpose user I/O (bank 1) |
| Pin 105 | GND β Ground |
| Pin 106 | IO β General purpose user I/O (bank 1) |
| Pin 107 | VCCIO2 β I/O bank 2 supply (3.3 V / 2.5 V) |
| Pin 108 | IO β General purpose user I/O (bank 2) |
| Pin 109 | IO β General purpose user I/O (bank 2) |
| Pin 110 | GND β Ground |
| Pin 111 | IO β General purpose user I/O (bank 2) |
| Pin 112 | VCCIO2 β I/O bank 2 supply (3.3 V / 2.5 V) |
| Pin 113 | IO β General purpose user I/O (bank 2) |
| Pin 114 | IO β General purpose user I/O (bank 2) |
| Pin 115 | GND β Ground |
| Pin 116 | IO β General purpose user I/O (bank 2) |
| Pin 117 | VCCIO3 β I/O bank 3 supply (3.3 V / 2.5 V) |
| Pin 118 | IO β General purpose user I/O (bank 3) |
| Pin 119 | IO β General purpose user I/O (bank 3) |
| Pin 120 | GND β Ground |
| Pin 121 | IO β General purpose user I/O (bank 3) |
| Pin 122 | VCCIO3 β I/O bank 3 supply (3.3 V / 2.5 V) |
| Pin 123 | IO β General purpose user I/O (bank 3) |
| Pin 124 | IO β General purpose user I/O (bank 3) |
| Pin 125 | GND β Ground |
| Pin 126 | IO β General purpose user I/O (bank 3) |
| Pin 127 | VCCIO4 β I/O bank 4 supply (3.3 V / 2.5 V) |
| Pin 128 | IO β General purpose user I/O (bank 4) |
| Pin 129 | IO β General purpose user I/O (bank 4) |
| Pin 130 | GND β Ground |
| Pin 131 | IO β General purpose user I/O (bank 4) |
| Pin 132 | VCCIO4 β I/O bank 4 supply (3.3 V / 2.5 V) |
| Pin 133 | IO β General purpose user I/O (bank 4) |
| Pin 134 | IO β General purpose user I/O (bank 4) |
| Pin 135 | GND β Ground |
| Pin 136 | IO β General purpose user I/O (bank 4) |
| Pin 137 | VCCIO5 β I/O bank 5 supply (3.3 V / 2.5 V) |
| Pin 138 | IO β General purpose user I/O (bank 5) |
| Pin 139 | IO β General purpose user I/O (bank 5) |
| Pin 140 | GND β Ground |
| Pin 141 | IO β General purpose user I/O (bank 5) |
| Pin 142 | VCCIO5 β I/O bank 5 supply (3.3 V / 2.5 V) |
| Pin 143 | IO β General purpose user I/O (bank 5) |
| Pin 144 | GND β Ground / exposed thermal pad |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M02SCE144A7G is suitable for 7 applications: Industrial Control and Factory Automation I/O Expansion, Video Bridging and Display Controllers, Portable Medical Device Front-Ends, Low-Volume ASIC Prototyping and Glue Logic, Retro-Computing and Educational FPGA Platforms, I/O Voltage Translation and Bus Bridging, Battery Management and Energy Harvesting Controllers.
Industrial Control and Factory Automation I/O Expansion
The 10M02SCE144A7G is well suited for industrial PLC and factory automation I/O expansion modules because its 101 user I/Os, integrated 12-bit ADC, and -40C to +125C operating range address the harsh-environment connectivity demands of motor drives, conveyor controllers, and sensor aggregators. The on-chip flash enables instant-on at < 10 ms, eliminating external boot memory and reducing BOM cost for distributed I/O nodes. The hardened DDR3 controller and 16 18x18 multipliers allow firmware-accelerated signal processing on the same chip. Per the Intel MAX 10 device overview, designers can also implement Nios II soft-core CPUs for protocol conversion without leaving the device.
Recommended
Video Bridging and Display Controllers
The 10M02SCE144A7G fits video bridging designs because its 1,016 Kbit block RAM buffers video frames while 16 dedicated 18x18 multipliers accelerate pixel processing pipelines in industrial HMIs, kiosks, and legacy LCD controllers. Its 101 user I/Os can drive parallel RGB panels and LVDS channels simultaneously. The 12-bit ADC embedded on-chip simplifies backlight current sensing, while the AES-256 bitstream encryption protects display calibration IP from cloning. The 55 nm CMOS process keeps dynamic power low enough for fanless operation in sealed enclosures.
Recommended
Portable Medical Device Front-Ends
The 10M02SCE144A7G serves portable medical front-ends because its on-chip 12-bit 1 MSa/s ADC digitizes patient-side analog signals (temperature, impedance, SpO2 photodiode current) without a separate ADC chip, shrinking the BOM and lowering analog-coupling noise. The non-volatile flash enables sub-10 ms startup required for battery-powered patient monitors waking from sleep. With 1,016 Kbit embedded RAM the device can buffer waveform segments before sending to a host MCU via SPI or UART. Designers leverage the AES-256 bitstream encryption to satisfy HIPAA-aligned IP protection requirements for proprietary diagnostic algorithms.
Recommended
Low-Volume ASIC Prototyping and Glue Logic
The 10M02SCE144A7G is widely used as an ASIC prototyping and glue-logic replacement because its 2,000 logic elements and 101 user I/Os replace 5-10 discrete 74-series logic packages on legacy boards. Designers use MAX 10 devices to consolidate address decoding, bus arbitration, and clock distribution in a single chip while still being able to reflash during development. The exposed thermal pad and 55 nm CMOS process provide thermal headroom up to 125C, so the device survives the same reflow and operational conditions as the eventual ASIC it emulates. Free Quartus Prime Lite toolchain support keeps prototyping costs low.
Recommended
Retro-Computing and Educational FPGA Platforms
The 10M02SCE144A7G is favored in retro-computing hobbyist builds (classic CPU re-implementations) and university FPGA courses because its EQFP-144 0.5 mm pitch package is breadboard-compatible with inexpensive breakout boards, and 2,000 logic elements are sufficient to implement classic 8-bit processors such as 6502 and Z80. The on-chip non-volatile flash removes external boot ROM, simplifying student projects. Free Quartus Prime Lite software with example designs lowers the entry barrier, and the device's low USD 8 unit price keeps class lab kits affordable.
Recommended
I/O Voltage Translation and Bus Bridging
The 10M02SCE144A7G handles I/O voltage translation between 3.3 V, 2.5 V, and 1.8 V domains because its flexible I/O banks can mix LVCMOS, LVTTL, and LVDS on the same die. The 101 user I/Os allow 30+ simultaneous bridge channels between legacy microcontrollers and modern SoCs. The hard DDR3 controller interfaces directly with commodity DRAM while the FPGA core implements glue logic. Per the Intel MAX 10 datasheet, the integrated ADC plus 16 multipliers also support sensor-hub pre-processing on the same bridging chip, eliminating a second companion processor.
Recommended
Battery Management and Energy Harvesting Controllers
The 10M02SCE144A7G is suitable for battery management controllers because the on-chip 12-bit ADC monitors individual cell voltages in multi-cell Li-ion packs, while 16 hardware multipliers run Coulomb-counting algorithms in real time. The non-volatile flash retains calibration data without external EEPROM. With 101 user I/Os the device can directly drive cell-balancing FETs and SMBus interfaces to a host BMS controller. The 55 nm CMOS process and -40C to +125C operating junction range suit both portable consumer packs and stationary energy-storage cabinets.
Recommended
Recommended Products Summary
Engineering reference data for 10M02SCE144A7G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M02SCE144I7G | 10M02SCE144C8G | 10M02SCE144C7G | 10M02SCU324I7G | 10M02SCU169I7G |
|---|---|---|---|---|---|---|
| Package | EQFP-144 (22x22 mm) | EQFP-144 (22x22 mm) - same | EQFP-144 (22x22 mm) - same | EQFP-144 (22x22 mm) - same | UBGA-324 (different package) | UBGA-169 (different package) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 2,000 | 2,000 | 2,000 | 2,000 | 2,000 | 2,000 |
| User I/O Count | 101 | 101 | 101 | 101 | 160 | 130 |
| Embedded RAM | 1,016 Kbit | 1,016 Kbit | 1,016 Kbit | 1,016 Kbit | 1,016 Kbit | 1,016 Kbit |
| User Flash | 1,008 Kbit | 1,008 Kbit | 1,008 Kbit | 1,008 Kbit | 1,008 Kbit | 1,008 Kbit |
| Temperature Grade | Commercial (-40C to +125C junction) | Industrial (-40C to +125C junction, extended) | Commercial | Commercial | Industrial | Industrial |
| Speed Grade | -7 (standard) | -7 | -8 (slower) | -7 | -7 | -7 |
| On-chip ADC | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s | 12-bit, 1 MSa/s |
| Configuration Memory | On-chip flash (non-volatile) | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
Key Differentiators
- Highest I/O count in the 10M02 family in an EQFP package (vs 10M02SCU169I7G)
- Industrial-temperature variant shares the same EQFP-144 footprint (vs 10M02SCE144I7G)
- On-chip non-volatile flash removes external boot PROM (vs Xilinx Spartan-6 XC6SLX4)
Design Notes
Estimated: at 3.3 V supply drawing 200 mA typical for a moderately utilized 10M02 design, power dissipation is approximately 0.66 W - well within the EQFP-144 thermal envelope. The MAX 10 device has internal LDOs that derive 1.2 V core from a 3.3 V rail, but designers must still supply 2.5 V to VCCA and VCCA_ADC pins for PLLs and the ADC to function. Per Intel AN1001, place a 100 nF decoupling capacitor on every VCCIO bank pin within 3 mm of the package pad, plus a bulk 10 uF tantalum on the 3.3 V rail.
Estimated: the EQFP-144 exposed thermal pad connects to the silicon die substrate and must be soldered to a copper pour with at least a 4 x 4 thermal via array (0.3 mm vias on 1 mm pitch) for adequate heat extraction. Without proper thermal pad soldering, junction-to-ambient thermal resistance (theta_JA) can exceed 35 C/W, derating the 125C max junction temperature in confined enclosures. For sealed industrial housings, derate Tj by at least 15C from ambient to compensate for limited convective cooling.
The EQFP-144 package uses a 0.5 mm pitch which requires fine-pitch PCB design rules - use 0.15 mm trace width, 0.15 mm spacing, and ENIG or immersion-silver surface finish for reliable soldering. The exposed thermal pad must NOT be used as an electrical ground unless datasheet guidance is followed; in MAX 10 devices the ePad is typically tied to GND through a low-impedance via array. Avoid routing high-speed DDR traces under the package body - keep them within 5 mm of the package perimeter on the top layer with a continuous ground reference plane on layer 2.
Three common pitfalls when using the 10M02: (1) omitting the VCCA 2.5 V supply causes PLL lock failures - never tie VCCA to VCCIO; (2) leaving unused I/O banks floating can cause 100-200 uA additional leakage per bank - configure unused pins as outputs driving low in the Quartus pin planner; (3) forgetting to enable the on-chip flash programming interface in the Quartus device options results in configuration failure with no error message - always verify the 'Configuration Scheme' is set to 'Internal Configuration' before generating the .pof file.
For DDR3 interfaces using the MAX 10 hardened memory controller, follow Intel's AN501 guidance: maintain 50 ohm single-ended impedance with 100 ohm differential, keep trace length matching to within 25 mils across the byte lane, and place the DDR3 chips within 25 mm of the FPGA. The ADC analog inputs are sensitive to digital switching noise - keep the ADCIN traces on a separate analog ground island connected to the GNDA pin via a single point. Per the MAX 10 device datasheet, the integrated ADC's 12-bit performance requires VCCA_ADC noise below 50 mVpp.
Compliance Information
RoHS compliant per FindIC package marking. The 10M02SCE144A7G is the commercial (non-automotive) OPN - not AEC-Q100 qualified. The automotive-grade equivalent is the 10M02ASC144A7G variant.
