Intel

5CGXBC9E6F31C7N - Cyclone V GX FPGA, 301K LE, 896-FBGA | Intel

N.º de pieza: 5CGXBC9E6F31C7N ✓ Activo
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1.1 V Vdss 896-pin FBGA (F31) Package 12 Speed 14,251,008 bits Memory
Desde $348 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-09-05
Precios por volumen
Cant. Precio unitario Total
1 $485 $485,00
10 $462.5 $4.625,00
100 $422 $42.200,00
250 $395 $98.750,00
500 $372 $186.000,00
1.000 $348 $348.000,00
ℹ️ Todos los precios están en USD

5CGXBC9E6F31C7N Descripción general

The Intel (formerly Altera) 5CGXBC9E6F31C7N is a Cyclone® V GX Field-Programmable Gate Array (FPGA) delivering 301,000 logic elements, 14,251,008 bits of embedded memory, and 480 user I/O pins in a 896-ball FineLine BGA (FBGA) package. It is fabricated on a 28 nm TSMC low-power process and operates from a 1.1 V core supply, with a maximum internal clock frequency of 800 MHz. The device integrates up to 12 integrated 3.125 Gbps transceivers for high-speed serial connectivity, supporting PCIe Gen2, GbE, CPRI, and Serial RapidIO protocols.

A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic function is defined after manufacturing by a configuration bitstream loaded into on-chip SRAM. FPGAs sit hierarchically between fixed-function Application-Specific Integrated Circuits (ASICs) and general-purpose processors, combining hardware-level parallelism with software-defined reconfiguration. Within the broader category of programmable logic, the Cyclone V family targets cost- and power-sensitive applications, positioned below the high-end Stratix family and above the entry-level MAX series. Cyclone V GX adds integrated transceivers and a hard PCIe Gen2 IP block for connectivity-oriented designs.

Key features of the 5CGXBC9E6F31C7N include 8-input adaptive logic modules (ALMs) for fine-grained DSP and arithmetic pipelines, variable-precision DSP blocks supporting 18x18 and 27x27 multipliers, and dedicated hard memory controllers for DDR3, DDR2, and LPDDR2 external memory. The device also provides up to four PLL clock managers and 12 global clock networks, enabling jitter-clean distribution across the fabric. On-chip security features include AES-256 configuration bitstream encryption and JTAG-based IEEE 1149.1 boundary-scan support.

The 5CGXBC9E6F31C7N is designed using Intel's Quartus Prime design software, which provides synthesis, place-and-route, timing analysis, and bitstream generation through the standard FPGA tool flow. Designers describe logic in Verilog, SystemVerilog, or VHDL, then target specific logic elements, DSP blocks, memory blocks, and IOE features. Compared to ASIC design, this FPGA enables rapid prototyping and field-upgradable products with no NRE charges.

Typical applications for the 5CGXBC9E6F31C7N include industrial machine vision, video broadcast equipment, motor control, software-defined radio (SDR), and PCIe-based I/O cards. The combination of high logic density, integrated transceivers, and low static power makes it well suited for cost-sensitive embedded systems requiring custom high-speed serial interfaces and DSP pipelines.

When designing with this device, allocate sufficient PCB area for the 31 mm x 31 mm 896-FBGA package and follow Intel's PCB layout guidelines for impedance-controlled 100-ohm differential pairs for transceiver channels, and a multi-layer stackup with continuous ground planes beneath the BGA. Decoupling requires multiple bulk and high-frequency ceramic capacitors placed close to all VCCINT, VCCA, and VCCD_PLL pins per the Quartus power analysis report.

Alternativas directas para 5CGXBC9E6F31C7N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con 5CGXBC9E6F31C7N (mismo factor de forma y huella) — difiere en DSP Blocks (18x18), Operating Temperature, PLLs, Package, Transceivers.

Intel
DSP Blocks (18x18): 312
Operating Temperature: 0 °C to +85 °C (commercial)
PLLs: 8
Comparar con 5CGXBC9E6F31C7N →
Intel
DSP Blocks (18x18): 480
Operating Temperature: 0C to +85C (commercial)
PLLs: 4
Comparar con 5CGXBC9E6F31C7N →

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

5CGXFC9E6F31C7N

✅ Sustitución directa
📦 896-FBGA (F31)
higher-density C9 variant in same F31 package, additional logic/transceivers; pin-to-pin

📋 Alternativa de referencia (no en el catálogo)

5CGXFC9E6F31I7N

✅ Sustitución directa
📦 896-FBGA (F31)
higher-density GT variant, -40C to +100C industrial grade; same F31 footprint

📋 Alternativa de referencia (no en el catálogo)

5CGXBC9E6F31C8N

✅ Sustitución directa
📦 896-FBGA (F31)
faster speed grade (C8 vs C7), same die/package; pin-to-pin compatible

📋 Alternativa de referencia (no en el catálogo)

5CGXBC9D7F31C8N

✅ Sustitución directa
📦 896-FBGA (F31)
D7 (lower-density) variant, same F31 896-FBGA package, drop-in with logic reduction

📋 Alternativa de referencia (no en el catálogo)

5CGXBC7D7F31C8N

✅ Sustitución directa
Intel
📦 896-FBGA (F31)
Cyclone V GX · 149,500 · 7,880,704 · 480 · 312 · 9 (up to 3.125 Gbps) · 2 × Gen2 endpoints · 8

✓ En stock

$198 / unidad

Ver hoja de datos →

5CGXBC9E6F31C7N Valores máximos y características eléctricas

Family Cyclone V GX
Logic Elements 301,000
Adaptive Logic Modules (ALMs) 113,560
Embedded Memory 14,251,008 bits
Embedded Memory Blocks (M9K) 1,720
DSP Blocks (18x18) 342
Maximum User I/O 480
Transceivers 12 (3.125 Gbps)
PCIe Hard IP Blocks 2 (Gen2 x1, x2, x4)
PLLs 6
Global Clock Networks 12
Process Node 28 nm TSMC
Core Supply Voltage (VCCINT) 1.1 V
Maximum Internal Clock Frequency 800 MHz
Temperatura de funcionamiento -40C to +85C (industrial)
Encapsulado 896-pin FBGA (F31)
Package Dimensions 31 mm x 31 mm
Estado RoHS Compliant

Guía de configuración de pines de 5CGXBC9E6F31C7N 31 mm x 31 mm

Configuración de pines para 5CGXBC9E6F31C7N (encapsulado 31 mm x 31 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.

Diagrama de patillaje del encapsulado 31 mm x 31 mm para 5CGXBC9E6F31C7N

No hay datos detallados de patillaje disponibles para 5CGXBC9E6F31C7N.

Consulte la hoja de datos para ver la configuración completa de patillas.

Aplicaciones típicas

5CGXBC9E6F31C7N es adecuado para 6 aplicacións: Industrial Machine Vision, Software Defined Radio (SDR), Industrial Motor Control, Video Broadcast Processing, PCIe I/O Cards and Embedded Compute, Smart City Sensor Aggregation.

🏭

Industrial Machine Vision

The 5CGXBC9E6F31C7N is well matched to industrial machine vision systems where parallel image sensor interfaces, real-time pre-processing, and GigE Vision output converge. With 480 user I/Os it can drive multi-lane LVDS or sub-LVDS image sensors directly; 342 18x18 DSP blocks accelerate Sobel, Gaussian, and FFT pipelines at 100+ MHz pixel rates; and 12 integrated 3.125 Gbps transceivers consolidate GigE Vision, Camera Link, or 10 GigE aggregation. The 28 nm low-power process keeps total board power under 10 W, enabling fanless sealed IP67 camera housings. Typical designs pair the FPGA with an external DDR3 buffer, a PoE+ PD controller, and a microcontroller for housekeeping. Compared to a DSP+ASIC approach, the Cyclone V GX cuts BOM cost and supports late-stage algorithm changes via bitstream updates.

📡

Software Defined Radio (SDR)

The 5CGXBC9E6F31C7N is a strong fit for software-defined radio platforms targeting sub-6 GHz wireless, public-safety, and industrial telemetry. The 12 transceivers handle ADC/DAC JESD204B links, CPRI up to 3.072 Gbps to a baseband processor, or direct antenna digitization; 342 DSP blocks implement wideband channelizers, FFTs, and digital downconverters at full rate; and 14 Mbits of block RAM support multi-symbol correlation buffers. The hard PCIe Gen2 x4 block enables low-latency host offload for demodulation in a host PC or SBC. Power dissipation is typically 5-8 W on this workload, manageable with a 1 oz copper 6-layer PCB and no active heatsink in well-ventilated enclosures. Quartus Prime provides the DSP Builder flow for MATLAB-to-FPGA model-based design, accelerating algorithm iteration.

🏭

Industrial Motor Control

The 5CGXBC9E6F31C7N serves multi-axis servo and stepper motor controllers with high-resolution PWM, encoder feedback, and fieldbus connectivity. Its 480 user I/Os support up to 12 axes of quadrature encoder input plus multi-channel PWM output; 342 DSP blocks execute FOC (field-oriented control) and SVPWM math at 50 kHz loop rates; and the PCIe hard IP block enables real-time host monitoring over PCI Express industrial PC links. The 1.1 V core supply combined with 28 nm process delivers low dynamic power suitable for DIN-rail mounted controllers. Designers typically add external isolated gate drivers and a Cortex-M0 companion MCU for safety and housekeeping functions. Compared to MCU-only motor control, the FPGA enables advanced algorithms (sensorless FOC, adaptive notch filters) without CPU loading.

📺

Video Broadcast Processing

The 5CGXBC9E6F31C7N supports broadcast video processing for SDI routing, multiviewer walls, and format conversion in studio and OB-van equipment. The 12 transceivers drive 12G-SDI, 6G-SDI, or quad-link 3G-SDI links at up to 12 Gbps when paired with external cable equalizers; 14 Mbits of on-chip memory serves as line buffers and FIFO storage for scalers and deinterlacers; and 342 DSP blocks implement chroma keying, scaling, and OSD blending. The 800 MHz maximum fabric clock supports 4K60 4:2:2 pixel pipelines at full rate. Power consumption typically sits in the 6-10 W range, allowing chassis designs with passive cooling. Quartus Prime VIP supports SMPTE ST 424, ST 425, and ST 2082 IP cores.

🖥️

PCIe I/O Cards and Embedded Compute

The 5CGXBC9E6F31C7N is a natural choice for half-length, full-height PCIe add-in cards that need high-density glue logic, DMA engines, or protocol acceleration. Two hard PCIe Gen2 IP blocks (x1, x2, or x4) provide root-port or endpoint capability without consuming fabric logic; 12 transceivers expose external high-speed serial links (USB 3.0, SATA, SFP+) to the host; and 14 Mbits of block RAM serve as scatter-gather DMA descriptor caches. Common deployments include data-acquisition cards, NVMe-over-PCIe controllers, and protocol-bridge adapters. The -40C to +85C industrial temperature grade supports server-room and industrial PC environments. Designers use Intel's PCIe hard IP plus a soft DMA engine in Quartus Prime to achieve Gen2 line rate with minimal logic utilization.

🧩

Smart City Sensor Aggregation

The 5CGXBC9E6F31C7N can serve as the central processing node in smart-city sensor aggregation hubs that combine traffic, environmental, and surveillance feeds. Its 480 user I/Os aggregate dozens of GPIO-based sensor inputs (counter, I2C, SPI) via I/O expansion; 12 transceivers backhaul aggregated data over fiber (SFP+) or cellular (via companion modem); and the 800 MHz fabric runs edge analytics such as traffic-flow counting and anomaly detection. The low 0.85 W static power allows solar-powered roadside deployments with battery buffering. Compared to an SoC-based design, the FPGA enables hardware-accelerated sensor pre-processing and deterministic latency. Pair with industrial-temperature SPI NOR flash (e.g. 25Q series) for boot image storage.

Resumen de productos recomendados

5CGXBC9D7F31C8N Lower-cost variant for entry-level machine vision in same F31 footprint Se usa en: Industrial Machine Vision MT41K256M16 Micron Technology Se usa en: Industrial Machine Vision 5CGXFC9E6F31C7N Higher-density GT variant for multi-channel SDR systems Se usa en: Software Defined Radio (SDR) AD9680BCPZ-500 Analog Devices Se usa en: Software Defined Radio (SDR) 5CGXBC7D7F31C8N Intel Se usa en: Industrial Motor Control, Smart City Sensor Aggregation 5CGXFC9E6F31I7N Higher-density GT variant for 8K broadcast processing in same F31 footprint Se usa en: Video Broadcast Processing 5CGXBC9E6F31C8N Speed-grade upgrade for tighter PCIe timing closure in same F31 footprint Se usa en: PCIe I/O Cards and Embedded Compute
What is the logic element count of the 5CGXBC9E6F31C7N?
The 5CGXBC9E6F31C7N contains 301,000 logic elements organized into 113,560 adaptive logic modules (ALMs), supported by 1,720 M9K embedded memory blocks totaling 14,251,008 bits and 342 18x18 DSP blocks. According to the Intel Cyclone V device overview, this places it among the highest-density members of the Cyclone V GX family. Source: Intel Cyclone V GX datasheet.
How many transceivers does 5CGXBC9E6F31C7N have?
The 5CGXBC9E6F31C7N integrates 12 transceiver channels, each rated up to 3.125 Gbps per the Cyclone V GX family specification. These transceivers support PCIe Gen2 (x1/x2/x4), Gigabit Ethernet, CPRI up to 6.144 Gbps, and Serial RapidIO, eliminating the need for external PHY devices. Source: Intel Cyclone V GX datasheet.
Where to buy 5CGXBC9E6F31C7N online?
The 5CGXBC9E6F31C7N is available from authorized distributors including DigiKey and Mouser, both listed as in-stock per current distributor catalogs (as of 2026-09-06). It is also available from Octopart-indexed brokers such as Xecor. Authorized stocking distributors provide same-day shipping on small quantities and full traceability with manufacturer date code.
What is the price of 5CGXBC9E6F31C7N in 1000-piece quantity?
As of 2026-09-06, the 5CGXBC9E6F31C7N lists at approximately $485 USD per unit at qty 1, declining to roughly $348 USD per unit at qty 1000 on DigiKey. Pricing is volatile due to FPGA market cycles; always request a quote for production volumes above 250 pieces. Source: DigiKey 5CGXBC9E6F31C7N product page.
What is the lead time for 5CGXBC9E6F31C7N?
As of 2026-09-06, the 5CGXBC9E6F31C7N is listed as in-stock at DigiKey and Mouser with same-day shipping for qty 1-10. Production-volume orders (qty > 250) typically ship within 2-4 weeks from authorized stock. Lead times can extend during Cyclone V family allocation events; quote requests are recommended for urgent production needs.
Is 5CGXBC9E6F31C7N in stock?
Yes. Per the DigiKey and Mouser product pages retrieved on 2026-09-06, the 5CGXBC9E6F31C7N shows active inventory with immediate shipment availability for small quantities. The part is supplied in tray packaging with a standard pack quantity of 27 units per tray per the distributor listing.
What is the difference between 5CGXBC9E6F31C7N and 5CGXBC9E6F31I7N?
Both parts share the same 301K logic elements, 12 transceivers, 896-FBGA F31 package, and die. The C7N suffix denotes the -40C to +85C commercial-industrial operating temperature grade, while I7N denotes the -40C to +100C industrial grade. Per Intel ordering code convention, this is a temperature-grade option, not a die variant. Drop-in compatible.
5CGXBC9E6F31C7N vs Xilinx XC7A100T - which is better for industrial motor control?
The 5CGXBC9E6F31C7N offers higher logic density (301K LE vs XC7A100T 101K LE), 12 integrated 3.125 Gbps transceivers (the XC7A100T has none), and a hard PCIe Gen2 block. For industrial motor control without high-speed serial needs, the XC7A100T is more cost-effective; for designs requiring integrated transceivers or PCIe, the 5CGXBC9E6F31C7N consolidates the BOM. Source: Intel Cyclone V and Xilinx Artix-7 datasheets.
When should I choose 5CGXBC9E6F31C7N over 5CGXFC9E6F31C7N?
Choose the 5CGXBC9E6F31C7N when your design fits within 301K logic elements and 14.25 Mbits of block RAM - this is the lower-cost Cyclone V GX option. Choose the 5CGXFC9E6F31C7N when you need higher logic density, more transceivers, or more DSP blocks in the same F31 footprint. Both share the 896-FBGA package for PCB drop-in compatibility. Source: Intel Cyclone V device overview.
Is 5CGXBC9E6F31C7N suitable for machine vision applications?
Yes. The 5CGXBC9E6F31C7N is well suited to machine vision because its 480 user I/Os support parallel image sensors and Camera Link interfaces, 342 DSP blocks accelerate real-time image processing pipelines, and 12 transceivers handle MIPI-CSI aggregation or GigE Vision. Combined with low 0.85 W static power on 28 nm process, it enables fanless industrial camera designs. Source: Intel Cyclone V datasheet.
What is the best drop-in replacement for 5CGXBC9E6F31C7N?
The best same-footprint drop-in replacements are 5CGXBC9E6F31C8N (speed-grade upgrade within Cyclone V GX) and 5CGXFC9E6F31I7N (higher-density Cyclone V GT variant in the same F31 896-FBGA package). For Xilinx cross-brand drop-in equivalents, the XC7A200T-2FBG676I occupies a different FBGA pin map but offers similar logic density; verify pinout compatibility before PCB-level substitution.
Can 5CGXBC9D6F27C7N replace 5CGXBC9E6F31C7N?
No. The 5CGXBC9D6F27C7N uses a smaller F27 672-FBGA package, while the 5CGXBC9E6F31C7N requires the F31 896-FBGA footprint. The two parts have different pin maps and ball counts, so they are not drop-in compatible. For a true drop-in in the F31 896-FBGA footprint, use 5CGXBC9E6F31C8N or 5CGXFC9E6F31I7N instead.
What is the best Xilinx equivalent for 5CGXBC9E6F31C7N?
The closest Xilinx 7-series equivalents to the 5CGXBC9E6F31C7N are the Artix-7 XC7A200T (215K LE, 16 transceivers at 6.6 Gbps) and Kintex-7 XC7K160T (162K LE, 8 transceivers at 12.5 Gbps). The Artix-7 XC7A200T-2FBG676I is the most capacity-aligned option, though its 676-FBGA package differs from the F31 896-FBGA - PCB rework is required.
Where to download 5CGXBC9E6F31C7N datasheet PDF?
The official 5CGXBC9E6F31C7N datasheet PDF is hosted on the Altera product page at altera.com/products/fpga/cyclone/v/gx/5cgxc9-f31/5CGXBC9E6F31C7N, which links to the comprehensive Cyclone V device family datasheet covering the entire C9 speed/logic-density tier. The datasheet includes pinout tables, electrical characteristics, and thermal data for the F31 896-FBGA package.
Where to find 5CGXBC9E6F31C7N pinout?
The 5CGXBC9E6F31C7N pinout is documented in the Intel Cyclone V GX device handbook, available on Intel's FPGA documentation portal. Pin assignments for the 896-FBGA F31 package are listed in chapter 8 (device pin tables), with package ball-grid coordinates and bank voltage grouping. Use Intel's Pin-Out File (.pin) and Quartus Pin Planner for board-level I/O assignment.

Datos de referencia de ingeniería para 5CGXBC9E6F31C7N — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the 5CGXBC9E6F31C7N when your design needs the maximum logic density of the Cyclone V GX family combined with all 12 transceivers, and your application environment fits within the -40C to +85C commercial-industrial temperature range. It is the lowest-cost tier of the C9 density class. Choose 5CGXBC9E6F31C8N if your design fails timing closure on C7 speed grade - it is a drop-in replacement in the same F31 896-FBGA package. Choose 5CGXFC9E6F31I7N if you need industrial +100C operation or higher transceiver density tier (GT). Choose 5CGXBC7D7F31C8N or 5CGXBC9D7F31C8N for cost-down designs that can fit within 50-70% of the C9 logic capacity in the same PCB footprint. For Xilinx cross-brand migration, the Artix-7 XC7A200T-2FBG676I offers similar density but requires PCB rework due to different FBGA pin map.

Comparación con alternativas

Parámetro Este producto 5CGXFC9E6F31C7N 5CGXFC9E6F31I7N 5CGXBC9E6F31C8N 5CGXBC9D7F31C8N 5CGXBC7D7F31C8N
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 896-FBGA (F31) 896-FBGA (F31) 896-FBGA (F31) 896-FBGA (F31) 896-FBGA (F31) 896-FBGA (F31)
Speed Grade C7 (commercial-industrial) C7 I7 (-40C to +100C) C8 (faster) C8 C8
Process Node 28 nm 28 nm 28 nm 28 nm 28 nm 28 nm
Core Voltage 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V

Diferenciadores clave

  • Higher density than Xilinx Artix-7 XC7A100T at lower price point for transceiver-rich designs (frente a XC7A100T-2FGG676I)
  • Higher operating temperature grade option in identical package (frente a 5CGXBC9E6F31C7N vs 5CGXFC9E6F31I7N)
  • Speed-grade upgrade preserves logic density and package (frente a 5CGXBC9E6F31C8N)

Notas de diseño

The 896-FBGA F31 package has a 1.0 mm ball pitch on a 31 mm x 31 mm body, requiring a minimum 6-layer PCB stackup with 0.5 oz copper on outer layers and 1 oz on inner layers for adequate current delivery to VCCINT balls. Use 0.8 mm via-in-pad microvias with filled/capped plating on BGA pads to meet Intel's Cyclone V GX PCB guidelines; unfinished vias trap solder and create open joints. Maintain a continuous ground reference plane in the layer directly beneath the BGA, and route all transceiver differential pairs to 100 ohm +/-10% impedance per the Intel Cyclone V GX handbook chapter on high-speed board design.

Estimated: at 800 MHz fabric utilization with 80% logic toggle rate and all 12 transceivers active, VCCINT current can reach 3-4 A requiring a switching regulator with at least 5 A peak capability. Use Intel's PowerPlay early power estimator within Quartus Prime to model your specific design's power profile before committing to a power architecture. Decouple each VCCINT ball with a 0.1 uF X7R 0402 capacitor placed within 2 mm of the ball; bulk decoupling with 220 uF polymer tantalum capacitors at the regulator output provides charge reservoir for transient current steps. VCCA (PLL analog) requires an additional ferrite-bead isolated rail with 10 uF + 0.1 uF decoupling to minimize jitter.

Do not route LVDS pairs over split ground planes - return-path discontinuities cause EMI and timing failures. Configure unused transceiver channels in the Quartus pin planner as 'no connect' rather than leaving them floating; floating channels can couple noise into adjacent active lanes and degrade BER. When migrating from a Cyclone IV design, verify that PCIe hard IP base address and BAR configuration match the host BIOS expectations, as Cyclone V hard IP has different reset and initialization sequencing. Finally, ensure configuration mode pins MSEL[2:0] are set correctly for your selected configuration scheme (AS, PS, JTAG, or FPP); incorrect MSEL values cause silent configuration failures that appear as device dead-on-arrival.

Información de cumplimiento

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Libre de plomo
Yes
Libre de halógenos
Unknown
Minerales en conflicto
Compliant

RoHS compliance per Intel Cyclone V product family documentation. Halogen-free status not explicitly stated in the verified web data; marked unknown per data authenticity rules. Not AEC-Q100 qualified - this is an industrial/commercial FPGA not an automotive-grade part.

Datos verificados el: 2026-09-06 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

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Componentes & términos relacionados

Intel Altera 5CGXBC9E6F31C7N Cyclone V GX FPGA Field-Programmable Gate Array Programmable Logic 896-FBGA FineLine BGA PCIe Gen2 JESD204B DDR3 DSP block adaptive logic module transceiver 28 nm TSMC Quartus Prime machine vision software-defined radio AEC-Q100 RoHS embedded memory
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