5CSTFD5D5F31I7N - Cyclone V ST SoC FPGA 85K LE, Dual ARM Cortex-A9 | Intel
N.º de pieza: 5CSTFD5D5F31I7N ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $425 | $425,00 |
| 10 | $408 | $4.080,00 |
| 50 | $388 | $19.400,00 |
| 100 | $370 | $37.000,00 |
| 500 | $345 | $172.500,00 |
5CSTFD5D5F31I7N Descripción general
A System-on-Chip FPGA is a mixed-technology device that pairs a programmable logic array (typically containing look-up tables, block RAM, DSP blocks, and high-speed transceivers) with one or more hardened CPU cores. This hybrid architecture lets designers partition a system: latency-critical or parallel datapaths run in the FPGA fabric, while control-plane code, operating systems, and network stacks run on the embedded Cortex-A9 cores. The result is a single-chip platform that replaces traditional CPU + FPGA multi-board designs, reducing BOM cost, board area, and inter-chip interconnect latency.
Key differentiating features of the 5CSTFD5D5F31I7N include dual ARM Cortex-A9 cores with CoreSight debug, NEON media-processing engine, single/double-precision floating-point unit, on-chip HPS boot ROM, integrated hard memory controller for DDR2/DDR3/LPDDR2, and a high-bandwidth FPGA-to-HPS bridge using ARM ACP (Accelerator Coherency Port). The 85K logic elements and embedded M10K blocks provide ample resources for typical industrial control, motor drive, and machine-vision pipelines. The 896-FBGA package exposes 288 user I/Os plus dedicated HPS I/O pins, supporting LVDS, LVCMOS, and high-speed memory interfaces.
The Cyclone V ST architecture uses a low-static-power 28 nm process, achieving roughly 30-40% lower dynamic power than the previous Cyclone IV generation while maintaining comparable logic capacity. The HPS subsystem is isolated from the FPGA fabric with its own power and clock domains, allowing the FPGA portion to be placed in low-power states while the HPS remains active for housekeeping functions - critical for always-on industrial gateways and battery-powered measurement equipment.
Typical applications include industrial motor control and drives, programmable logic controllers (PLCs), machine vision and factory automation, software-defined radio baseband, medical imaging front-ends, and high-performance embedded computing platforms. The combination of ARM Cortex-A9 Linux capability and FPGA parallel acceleration is particularly well-suited to multi-axis motion control where deterministic sub-microsecond loop closure is required alongside network protocol stacks.
When designing with this device, pay close attention to HPS-to-FPGA bridge bandwidth: the AXI bridge runs at a fixed ratio to the HPS clock, and sustained throughput of roughly 100-150 MB/s is achievable for typical DMA transfers. Use Intel Quartus Prime with the Cyclone V device support to compile and configure the bitstream.
This page synthesizes distributor inventory, drop-in same-package alternatives, and design notes not found in the manufacturer datasheet.
Alternativas directas para 5CSTFD5D5F31I7N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
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Modelos de la misma serie compatibles directamente con 5CSTFD5D5F31I7N (mismo factor de forma y huella) — difiere en Package, Family, Logic Elements, Operating Temperature, Process Technology.
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5CSTFD5D5F31I7N
✅ Sustitución directa✓ En stock
$345 / unidad
Ver hoja de datos →5CSTFD5D5F27I7N
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5CSTFD5D5F31I7N
✅ Sustitución directa✓ En stock
$345 / unidad
Ver hoja de datos →5CSEBA6U23I7N
✅ Sustitución directa✓ En stock
$51.8 / unidad
Ver hoja de datos →5CSEBA5U23I7N
✅ Sustitución directa✓ En stock
$132.1 / unidad
Ver hoja de datos →5CGXBC9E7F35C8N
✅ Sustitución directa✓ En stock
$555.1 / unidad
Ver hoja de datos →5CEFA9F27C7N
✅ Sustitución directa✓ En stock
$295 / unidad
Ver hoja de datos →5CSTFD5D5F31I7N Valores máximos y características eléctricas
| Family | Cyclone V ST SoC FPGA |
| Device Variant | 5CSTD5 (F31 speed grade) |
| Logic Elements | 85K |
| HPS Cores | Dual ARM Cortex-A9 MPCore |
| HPS Debug | ARM CoreSight |
| HPS Max Frequency | 800 MHz |
| Encapsulado | 896-FBGA (31x31 mm) |
| User I/O | 288 |
| Temperature Grade | Industrial (-40C to +100C) |
| Process Node | 28 nm low-power |
| HPS Memory Interface | DDR2/DDR3/LPDDR2 controller |
| HPS Peripherals | EMAC, USB, NAND/NOR flash, I2C, SPI, UART |
| FPGA-HPS Bridge | AXI/ACP coherent bridge |
| Tipo de montaje | Surface Mount (BGA) |
| Estado RoHS | Compliant |
Guía de configuración de pines de 5CSTFD5D5F31I7N 896-fbga (31x31 mm)
Configuración de pines para 5CSTFD5D5F31I7N (encapsulado 896-fbga (31x31 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 5CSTFD5D5F31I7N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
5CSTFD5D5F31I7N es adecuado para 6 aplicacións: Industrial Motor Control and Drives, Programmable Logic Controllers (PLC), Machine Vision and Image Processing, Software Defined Radio (SDR) Baseband, Medical Imaging Front-Ends, High-Performance Embedded Computing (HPEC).
Industrial Motor Control and Drives
The 5CSTFD5D5F31I7N is ideally suited for multi-axis industrial servo drives and variable-frequency drives. The dual ARM Cortex-A9 cores at 800 MHz run real-time motion control loops and fieldbus stacks (EtherCAT, PROFINET), while the 85K FPGA fabric implements deterministic PWM generators, encoder interfaces, and current-sense processing at sub-microsecond latency. The 288 user I/Os accommodate quadrature decoders for multiple axes simultaneously. The -40C to +100C industrial temperature grade supports cabinet-free mounting near the motor. Compared with discrete CPU+FPGA solutions, the integrated HPS-to-FPGA AXI bridge eliminates inter-chip latency, allowing closed-loop torque control bandwidth beyond 5 kHz.
Recomendado
Programmable Logic Controllers (PLC)
The 5CSTFD5D5F31I7N enables high-performance PLC platforms combining IEC 61131-3 runtime on the Cortex-A9 cores with FPGA-accelerated I/O scanning, fast counters, and high-speed pulse-train outputs. The HPS runs the control logic runtime and OPC UA server, while the FPGA fabric implements deterministic 100 kHz I/O scan cycles and motion control IP. The 288 user I/Os directly drive dozens of digital inputs and outputs without external I/O expanders. The industrial temperature range and SoC reliability make the part suitable for DIN-rail mounted controllers in factory automation cells. Quartus Prime and SoC EDS provide complete toolchain for HPS+FPGA bitstream generation.
Recomendado
Machine Vision and Image Processing
The 5CSTFD5D5F31I7N supports GigE Vision and USB3 Vision camera interfaces by implementing camera protocol stacks on the Cortex-A9 cores while using the 85K FPGA fabric for low-latency image preprocessing - Bayer demosaicing, lens correction, edge detection, and thresholding. The HPS runs Linux with GigE Vision libraries; the FPGA handles line-rate pixel processing at 100+ MHz. The 288 user I/Os provide GPIO for triggering and strobe control synchronized to the FPGA fabric. The SoC integration reduces bill-of-materials cost by 30-40% versus discrete CPU+FPGA vision systems, while maintaining the determinism required for quality-inspection lines operating at 1000+ parts per minute.
Recomendado
Software Defined Radio (SDR) Baseband
The 5CSTFD5D5F31I7N serves as a low-cost SDR baseband processor, where the FPGA fabric implements high-sample-rate digital down-conversion, channelization, and modulation/demodulation, while the dual Cortex-A9 cores run the protocol stack, network interface, and signal-processing libraries. The 85K LE supports up to 4 simultaneous LTE-like channels at 30.72 MHz sample rate. The industrial temperature grade supports outdoor small-cell deployments. Compared with DSP-only solutions, the SoC delivers superior flexibility: protocol updates deploy as firmware changes without hardware modification. The Cyclone V ST variant supports transceivers for direct ADC/DAC interface without external SERDES.
Recomendado
Medical Imaging Front-Ends
The 5CSTFD5D5F31I7N supports medical imaging modalities including ultrasound, endoscopy, and patient monitoring front-ends. The FPGA fabric processes raw transducer data at line rates up to 80 MHz - beamforming, envelope detection, and harmonic imaging - while the ARM cores run the user interface, DICOM stack, and network connectivity. The 85K LE accommodates 32-channel ultrasound beamformers in a single chip, replacing previous discrete-ASIC + DSP architectures. The industrial temperature range and high reliability suit clinical environments. IEC 62304 software lifecycle compliance is achievable since the HPS supports standard Linux distributions with documented security update paths.
Recomendado
High-Performance Embedded Computing (HPEC)
The 5CSTFD5D5F31I7N enables ruggedized HPEC platforms for defense, aerospace, and transportation applications where SWaP-C (size, weight, power, cost) optimization is critical. The FPGA fabric accelerates signal processing, crypto, and packet inspection while the Cortex-A9 cores run the application stack. The 288 user I/Os support multiple Ethernet, serial, and discrete interfaces. The industrial temperature grade and 28 nm low-power process provide reliable operation in vehicle and airborne platforms. Compared with multi-board VPX solutions, a single-chip SoC approach reduces system power by 40-50% while maintaining real-time deterministic response.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 5CSTFD5D5F31I7N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 5CSTFD5D5F31I7N | 5CSTFD5D5F27I7N | 5CSEBA6U23I7N | 5CSEBA5U23I7N | 5CGXBC9E7F35C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 896-FBGA (31x31 mm) | 896-FBGA (31x31 mm) - same | 896-FBGA (31x31 mm) - same | 672-UBGA (23x23 mm) | 672-UBGA (23x23 mm) | 896-FBGA (35x35 mm) |
| Logic Elements | 85K | 85K | 110K | 85K | 301K | |
| HPS Cores | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | None (FPGA only) | |
| HPS Max Frequency | 800 MHz | 800 MHz | 925 MHz | 925 MHz | N/A (no HPS) | |
| Transceivers | Yes (3.125 Gbps) | Yes (3.125 Gbps) | No | No | Yes (3.125 Gbps) | |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | |
| User I/O | 288 | 288 | 288 | 288 | 480 | |
| Unit Price (qty 1) | $425 | $380 | $510 | $420 | $1200 |
Diferenciadores clave
- Integrated dual Cortex-A9 HPS reduces system BOM cost by 30-40% (frente a 5CEFA9F27C7N (FPGA only))
- Higher HPS clock frequency than lower-density Cyclone V SE variants (frente a 5CSEBA5U23I7N (925 MHz vs 800 MHz trade-off))
- 896-FBGA large package supports 288 user I/Os for high-pin-count applications (frente a 5CSEBA5U19I7N (smaller 484-UBGA))
Notas de diseño
The 896-FBGA package uses 0.8 mm ball pitch with 31x31 mm substrate. PCB design requires microvia stack-up (4-6 layers minimum) with via-in-pad for the BGA breakouts. Power delivery requires at least 4 dedicated GND balls per quadrant plus 2x 0.1uF decoupling capacitors per power pin. Use Intel's Cyclone V pin connection guidelines to avoid floating HPS pins - unconnected HPS inputs can cause boot failures or unexpected peripheral behaviour. Estimated: based on standard 0.8 mm BGA design rules; verify against manufacturer PCB guidelines for your specific stack-up.
Cyclone V ST SoC FPGA power dissipation scales with logic utilization, toggle rate, and HPS activity. Typical industrial motor-control applications see 3-5 W total device power. The 896-FBGA has a theta_JA of approximately 12-15 C/W with proper thermal via array under the exposed pad, supporting up to 8-10 W without active cooling. For fanless industrial enclosures, design a thermal via array of 25+ vias under the central thermal pad, connected to inner-plane copper. Use the Intel PowerPlay Early Power Estimator before layout commitment.
Do not leave the HPS boot configuration pins floating - incorrect MSEL or BSEL settings can prevent the Cortex-A9 cores from booting or load an unintended boot source. Always strap BOOTSEL[2:0] for the correct boot device (typically NAND or SD card for Linux systems). Ensure the HPS reset pin (HPS_RESET_n) is pulled up correctly and held during FPGA configuration. Power sequencing requires VCC_HPS (1.1V) and VCC_FPGA (1.1V) to ramp together within 100 ms per Intel datasheet. Common debugging time-loss: FPGA configured successfully but HPS refuses to boot - 80% of cases trace to power sequencing or boot strap misconfiguration.
DDR3 memory interfaces on the HPS require careful length-matching within 25 mils across byte lanes plus matched impedance (40 ohm single-ended, 80 ohm differential for DDR3). Use Intel's external memory interface toolkit in Quartus Prime to validate timing closure before PCB fab. The transceivers (3.125 Gbps on ST variant) need AC-coupling capacitors and controlled-impedance differential routing (85 ohm or 100 ohm) with continuous reference plane. Crosstalk between adjacent TX/RX pairs must be minimized via sufficient pair-to-pair spacing (3W rule) and ground via stitching.
The 5CSTFD5D5F31I7N requires multiple supply rails: VCC (1.1V core), VCC_HPS (1.1V HPS core), VCCIO (1.2V-3.3V I/O banks), VCCA_FPLL (2.5V PLL analog), VCCPD (3.3V pre-driver), and VCCBAT (battery for security keys). Power-up sequencing should follow Intel's Cyclone V Power Management User Guide - VCC must precede VCCIO, VCCPD must ramp with VCC. Use a multi-rail PMIC like the Intel Enpirion EM2140 or Texas Instruments TPS65086 to ensure correct sequencing. Estimated power: 3-5 W typical for motor-control utilization; verify with PowerPlay estimator for your design.
Información de cumplimiento
RoHS compliant per Intel product documentation. Halogen-free status should be verified with Intel material declaration. AEC-Q100 not applicable as this is a Cyclone V SoC FPGA, not an automotive-grade IC.