5CSXFC5D6F31C7N - Cyclone V SX SoC FPGA 85K LE | Intel
N.º de pieza: 5CSXFC5D6F31C7N ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $425 | $425,00 |
| 10 | $395 | $3.950,00 |
| 100 | $348 | $34.800,00 |
| 500 | $312 | $156.000,00 |
| 1.000 | $285 | $285.000,00 |
5CSXFC5D6F31C7N Descripción general
An SoC FPGA combines a general-purpose processor subsystem (HPS) with programmable logic on a single die, eliminating the need for a separate processor chip and providing high-bandwidth on-chip interconnects between the ARM cores and the FPGA fabric. Within the broader semiconductor taxonomy, the Cyclone V SX belongs to the SoC FPGA product family, which sits between pure microcontrollers and high-end FPGAs, offering low total power, deterministic real-time performance, and flexible I/O. Cyclone V devices use TSMC's 28 nm low-power process and integrate transceivers, PCIe Gen2 hard IP blocks, and hard memory controllers.
Key features of the 5CSXFC5D6F31C7N include 85K logic elements (LEs), 4,480 Kbits of embedded memory, 87 variable-precision DSP blocks, and dual ARM Cortex-A9 cores with NEON media-processing engines. The 800 MHz HPS supports DDR2/DDR3/LPDDR2 interfaces with error correction, while the FPGA fabric supports DDR3 up to 800 MHz. Hard PCIe Gen2 x4 controllers and three PLL types (FPGA PLLs, HPS PLLs, transceiver PLLs) simplify clock tree design.
Typical applications include industrial motor control drives with EtherCAT or PROFIBUS, factory automation controllers, video surveillance with on-chip analytics, and portable medical imaging pre-processing. The 896-FBGA package is pin-compatible with other 5CSXFC5D6F31 speed-grade 7 variants, allowing design migration between commercial and industrial grades with the same PCB.
Designers should plan decoupling carefully: the HPS and FPGA fabric each require their own rail sequencing, and the integrated transceivers demand 0.1 uF and 0.01 uF high-frequency ceramic capacitors within 1 cm of the power pins. JTAG and Active Serial configuration paths must be wired to the dedicated dual-purpose pins to enable in-system programming.
This page synthesizes distributor pricing, drop-in Cyclone V alternatives, and practical SoC FPGA design notes not found in the manufacturer datasheet, helping engineers select the right speed grade and temperature range for their volume production build.
Alternativas directas para 5CSXFC5D6F31C7N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 5CSXFC5D6F31C7N (mismo factor de forma y huella) — difiere en Logic Elements, Operating Temperature, Package, Family, Transceivers.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
5CSXFC5D6F31I7N
✅ Sustitución directa✓ En stock
$138.2 / unidad
Ver hoja de datos →5CSXFC5D6F31C8N
✅ Sustitución directa✓ En stock
$171 / unidad
Ver hoja de datos →5CSXFC6D6F31C6N
✅ Sustitución directa✓ En stock
$285 / unidad
Ver hoja de datos →5CSXFC6D6F31C7N
✅ Sustitución directa✓ En stock
$360 / unidad
Ver hoja de datos →5CSTFD6D5F31I7N
✅ Sustitución directa✓ En stock
$290 / unidad
Ver hoja de datos →5CGXFC7D6F31C7N
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
5CSXFC5D6F31C7N Valores máximos y características eléctricas
| Product Type | SoC FPGA (HPS + FPGA fabric) |
| Series | Cyclone V SX |
| HPS Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Logic Elements | 85,000 |
| Logic Blocks | 32,075 |
| Maximum Operating Frequency | 800 MHz |
| Transceivers | 9 |
| Transceiver Data Rate | 3.125 Gbps |
| Temperatura de funcionamiento | 0C to +85C (commercial) |
| Encapsulado | 896-FBGA (31x31 mm) |
| Tipo de montaje | Surface Mount (BGA) |
| Process Technology | 28 nm low-power |
| Estado RoHS | Compliant |
Guía de configuración de pines de 5CSXFC5D6F31C7N 896-fbga (31x31 mm)
Configuración de pines para 5CSXFC5D6F31C7N (encapsulado 896-fbga (31x31 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 5CSXFC5D6F31C7N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
5CSXFC5D6F31C7N es adecuado para 6 aplicacións: Industrial Motor Control Drives, Machine Vision and Video Analytics, Factory Automation Controllers, Portable Medical Imaging Devices, Automotive Driver Assistance (ADAS) Pre-Processing, Software-Defined Radio Baseband.
Industrial Motor Control Drives
The 5CSXFC5D6F31C7N's dual ARM Cortex-A9 HPS at 800 MHz runs FOC and motion control algorithms while the FPGA fabric generates deterministic PWM and decodes encoder feedback with sub-microsecond jitter. The 9 transceivers up to 3.125 Gbps support EtherCAT, PROFINET, and EtherNet/IP industrial Ethernet protocols, while hard PCIe Gen2 blocks enable host-side supervisory communication with PLC controllers. Compared with discrete MCU+FPGA solutions, the integrated SoC reduces BOM cost by 25-35% and eliminates HPS-to-FPGA inter-chip latency in servo loops.
Recomendado
Machine Vision and Video Analytics
The 5CSXFC5D6F31C7N's 85K logic elements implement image preprocessing pipelines including color-space conversion, Bayer demosaicing, and histogram equalization directly in the FPGA fabric, offloading the HPS for higher-level analytics. The MIPI CSI-2 and LVDS soft IP cores running on dedicated transceiver channels ingest 1080p60 streams at 148.5 MHz pixel clock, while the HPS executes OpenCV-based object detection. The 896-FBGA package with 364 user I/O pins provides ample connectivity for parallel image sensors, GPIO triggers, and illumination control.
Recomendado
Factory Automation Controllers
The 5CSXFC5D6F31C7N integrates deterministic industrial I/O handling through its FPGA fabric with Linux-capable processing on the dual ARM Cortex-A9 HPS, enabling single-chip PLC replacements. The 87 variable-precision DSP blocks accelerate PID loop math for up to 32 axes of motion, while the hard memory controller supports DDR3 with ECC for reliable operation in electrically noisy factory environments. Industrial Ethernet stacks (PROFINET IRT, EtherCAT) run on dedicated transceivers with cycle times down to 250 microseconds.
Recomendado
Portable Medical Imaging Devices
The 5CSXFC5D6F31C7N's low-power 28 nm process and integrated HPS+FPGA architecture reduce total system power by 30-40% versus discrete two-chip designs, critical for battery-operated portable ultrasound and patient monitors. The FPGA fabric processes raw transducer or sensor data at line rates up to 200 MHz, while the ARM HPS runs compressed sensing and image reconstruction algorithms. The 896-FBGA commercial temperature grade meets the 0C to 85C envelope required by IEC 60601-1 medical equipment safety standards for clinic and home-use devices.
Recomendado
Automotive Driver Assistance (ADAS) Pre-Processing
Although not AEC-Q100 qualified, the 5CSXFC5D6F31C7N serves as a development platform and pre-production reference for ADAS sensor fusion, with the HPS running perception algorithms and the FPGA fabric fusing multiple camera and radar streams. The 9 transceivers aggregate sensor data from surround-view cameras at 3.125 Gbps per lane, and the hard PCIe Gen2 x4 controllers stream pre-processed results to a host ADAS processor at 5 Gbps. For volume automotive deployment, designers migrate to AEC-Q100 qualified Cyclone V Auto variants sharing the same toolchain.
Recomendado
Software-Defined Radio Baseband
The 5CSXFC5D6F31C7N's 9 transceivers at 3.125 Gbps handle multiple digital radio standards (LTE, Wi-Fi, custom protocols) in parallel, while the FPGA fabric implements digital down-conversion, channelization, and FEC decoding. The dual ARM Cortex-A9 cores at 800 MHz run the MAC layer and protocol stack, offloading DSP-heavy baseband work to the FPGA's 87 variable-precision DSP blocks. The 4,480 Kbits of embedded memory buffers samples between the transceiver frontend and HPS, eliminating external SRAM in cost-sensitive small-cell designs.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 5CSXFC5D6F31C7N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 5CSXFC5D6F31I7N | 5CSXFC5D6F31C8N | 5CSXFC6D6F31C6N | 5CSXFC6D6F31C7N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 896-FBGA (31x31) | 896-FBGA (31x31) - same | 896-FBGA (31x31) - same | 896-FBGA (31x31) - same | 896-FBGA (31x31) - same |
| Logic Elements | 85,000 | 85,000 | 85,000 | 110,000 | 110,000 |
| Speed Grade | 7 (commercial) | 7 (industrial) | 8 (commercial) | 6 (commercial) | 7 (commercial) |
| Operating Temperature | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C |
| HPS Processor | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Transceivers | 9 at 3.125 Gbps | 9 at 3.125 Gbps | 9 at 3.125 Gbps | 9 at 3.125 Gbps | 9 at 3.125 Gbps |
| Process Technology | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power |
Diferenciadores clave
- Balanced 85K LE density with full 9-transceiver complement at commercial temperature (frente a 5CSXFC6D6F31C6N)
- Drop-in commercial-to-industrial temperature migration without PCB changes (frente a 5CSXFC5D6F31I7N)
- Integrated HPS eliminates external processor chip for Linux-capable designs (frente a 5CSTFD6D5F31I7N)
Notas de diseño
The Cyclone V SX SoC FPGA requires multiple supply rails: VCC (core), VCCPLL, VCCPD (I/O pre-drivers), VCCIO (I/O banks), VCCAUX, VCCA_FPLL, and dedicated HPS rails (VCC_HPS, VCC_HPS_PLL, DDR_PLL). Sequence the HPS and FPGA power supplies per Intel's power management design guidelines; VCC must ramp before VCCIO for any given bank or the I/O pins can latch up. Use a dedicated sequencer IC (such as Intel's EM11x family) to enforce monotonic ramping within 100 ms across all rails.
The 896-FBGA package has a typical theta_JA in the 12-15 C/W range with proper thermal via array (4 thermal vias under the central BGA pad, 0.3 mm diameter, connected to internal ground planes). For full-fabric utilization with all 9 transceivers active, designers should plan for up to 4-5 W of dissipation. In enclosed industrial cabinets, attach a heatsink with thermal interface material rated for the 85C ambient ceiling, or derate the operating temperature if natural convection is the only cooling.
Route all 9 transceiver channels with 100 ohm differential impedance and length matching within 0.127 mm (5 mil) for lanes above 2.5 Gbps. Place 0.1 uF and 0.01 uF high-frequency ceramic decoupling capacitors within 1 cm of every transceiver power pin and use a continuous ground reference plane under all high-speed traces. For DDR3 interfaces, route the address/command group and byte lanes with proper fly-by topology and maintain 50 ohm single-ended impedance with length matching within 0.5 mm per byte lane.
Do not confuse speed grade 7 (slower timing, lower cost) with grade 8 (faster) when ordering - swapping one letter changes the Fmax and may cause timing failures on critical paths. The HPS boot source must be configured through MSEL pins before power-up; using JTAG only as a fallback prevents reliable field updates. Avoid assigning sensitive analog signals to bank 8A, which has higher noise coupling from the transceiver PLL supply; consult the pin connection guidelines for clean bank assignments.
Información de cumplimiento
RoHS compliant per Intel/Altera Cyclone V product page. Commercial temperature grade only - not AEC-Q100 qualified. For automotive designs, consider AEC-Q100 qualified Cyclone V Auto variants which share the same toolchain but different part numbers.