5CSXFC6C6U23I7N - Cyclone V SX SoC FPGA, 110K LE, 672-UBGA | Intel
N.º de pieza: 5CSXFC6C6U23I7N ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $117.26 | $117,26 |
| 10 | $112.5 | $1.125,00 |
| 100 | $105.75 | $10.575,00 |
| 500 | $98.4 | $49.200,00 |
| 1.000 | $92.1 | $92.100,00 |
5CSXFC6C6U23I7N Descripción general
A System-on-Chip FPGA is an integrated device that combines a hard processor subsystem with programmable logic on a single silicon die, allowing designers to partition tasks between software running on the ARM core and hardware accelerators implemented in the FPGA fabric. This heterogeneous architecture reduces bill-of-materials cost, board area, and power consumption compared with using a discrete microprocessor plus a standalone FPGA, while preserving the deterministic latency of hardware logic. The Cyclone V SX product line (hypernym: SoC FPGA -> FPGA -> programmable logic -> semiconductor device) targets industrial motor control, video surveillance, automotive driver assistance, and protocol bridging.
Key differentiating features of the 5CSXFC6C6U23I7N include dual-core ARM Cortex-A9 MPCore with CoreSight debug and trace, a 32-bit DDR3 SDRAM controller with ECC support inside the HPS, and integrated peripheral IPs (EMAC, USB 2.0, CAN, SPI, I2C, UART) implemented as hardened blocks rather than soft logic. A high-bandwidth interconnect bridge ties the HPS to the FPGA fabric, allowing low-latency message passing between software tasks and custom accelerators without consuming fabric resources.
Typical applications for the 5CSXFC6C6U23I7N include industrial motor drives, factory automation controllers, video processing and surveillance systems, automotive infotainment and ADAS preprocessing, and protocol bridging between industrial Ethernet and legacy fieldbuses. The combination of Cortex-A9 cores for Linux or RTOS control loops and FPGA fabric for deterministic I/O makes this part well suited for mixed software/hardware designs.
When designing with this device, plan the power sequencing for the HPS and FPGA rails separately and use the dedicated HPS cold/warm reset inputs. The 672-pin UBG-A package requires a 23x23 mm, 1.0 mm ball-pitch land pattern, so PCB fabrication must support fine-pitch BGA assembly and X-ray or endoscopic inspection is recommended for first-article builds.
This page synthesizes distributor pricing, package drop-in alternatives, and design notes not found in the manufacturer datasheet alone.
Alternativas directas para 5CSXFC6C6U23I7N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 5CSXFC6C6U23I7N (mismo factor de forma y huella) — difiere en Package, Logic Elements, Process Technology, Operating Temperature, DSP Blocks.
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5CSXFC6C6U23I7NES
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5CSXFC6C6U23A7N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$328.75 / unidad
Ver hoja de datos →5CSXFC6C6U23C7N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$215.8 / unidad
Ver hoja de datos →5CSEBA2U23I7N
✅ Sustitución directa✓ En stock
$124 / unidad
Ver hoja de datos →5CSEMA5U23I7N
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5CSXFC6C6U23I7N Valores máximos y características eléctricas
| Family | Cyclone V SX |
| Logic Elements | 110,000 |
| Process Technology | 28 nm |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz |
| Core Supply Voltage | 1.1 V |
| Encapsulado | 672-pin UBG-A (23x23 mm) |
| Ball Pitch | 1.0 mm |
| Temperatura de funcionamiento | -40C to +100C (industrial) |
| Tipo de montaje | Surface Mount (BGA) |
| HPS Memory Controller | DDR3 with ECC |
| HPS Peripherals | EMAC, USB 2.0, CAN, SPI, I2C, UART |
| SEU Error Detection/Correction | Supported |
| Hot Swap Support | Yes |
| Estado RoHS | Compliant |
Guía de configuración de pines de 5CSXFC6C6U23I7N 672-pin ubg-a (23x23 mm)
Configuración de pines para 5CSXFC6C6U23I7N (encapsulado 672-pin ubg-a (23x23 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 5CSXFC6C6U23I7N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
5CSXFC6C6U23I7N es adecuado para 6 aplicacións: Industrial Motor Drive Control, Video Surveillance and Processing, Automotive Infotainment and ADAS Preprocessing, Industrial Protocol Bridging (EtherCAT / Profinet to Legacy Fieldbus), Medical Diagnostic Imaging Equipment, Smart Grid and Energy Management Gateways.
Industrial Motor Drive Control
The 5CSXFC6C6U23I7N is well suited for industrial motor drives where software control loops must coexist with deterministic PWM generation. The dual-core ARM Cortex-A9 at 800 MHz runs Linux or RTOS-based field-oriented control algorithms, while the FPGA fabric implements the high-resolution PWM, encoder decoding, and protection logic in hardware. The integrated DDR3 controller with ECC handles parameter storage and current/torque sampling without consuming fabric block memory. Compared with a discrete MCU + CPLD architecture, this SoC FPGA reduces board area by roughly 30-40% and simplifies EMC layout by collapsing two clock domains into one. The 28 nm low-power process keeps the 1.1 V core supply manageable, even at the continuous 1 A current draws typical of multi-axis drives.
Recomendado
Video Surveillance and Processing
In video surveillance designs, the 5CSXFC6C6U23I7N's dual-core ARM Cortex-A9 HPS runs Linux-based video management software and network stacks, while the FPGA fabric accelerates motion detection, H.264 encoding preprocessing, or analytics at deterministic frame rates. The integrated EMAC and USB 2.0 peripherals inside the HPS simplify IP-camera designs by eliminating external PHY bridges. The 110K logic elements are sufficient to process two to four 1080p video streams simultaneously with on-the-fly overlay. Designers benefit from the SoC architecture by having a single memory space for both CPU and FPGA, eliminating DDR sharing arbitration that would otherwise require an external memory controller.
Recomendado
Automotive Infotainment and ADAS Preprocessing
The 5CSXFC6C6U23I7N serves as a video preprocessing hub in automotive infotainment and ADAS designs, where the Cortex-A9 cores run AUTOSAR or QNX middleware while the FPGA fabric implements sensor fusion and image preprocessing pipelines. The hardened CAN and SPI peripherals in the HPS directly interface with vehicle body networks, eliminating the need for an external CAN controller. With the industrial -40C to +100C temperature grade, the device can be placed behind the dashboard or near the head unit. Designers should note that AEC-Q100 automotive qualification requires selecting the appropriate automotive-grade OPN, but the same silicon foundation supports both industrial and automotive design wins.
Recomendado
Industrial Protocol Bridging (EtherCAT / Profinet to Legacy Fieldbus)
The 5CSXFC6C6U23I7N excels as a protocol bridge between modern industrial Ethernet standards and legacy fieldbuses such as RS-485, CAN, or proprietary deterministic networks. The dual-core ARM Cortex-A9 HPS runs the industrial Ethernet master stack (EtherCAT, PROFINET, or EtherNet/IP) while the FPGA fabric implements the legacy fieldbus physical layer and timing-critical response handlers. The high-bandwidth HPS-to-FPGA interconnect avoids the latency penalty that would otherwise arise from a separate SPI or parallel bus between a standalone MCU and FPGA. This architecture is commonly deployed in factory automation gateways and smart-grid communication modules.
Recomendado
Medical Diagnostic Imaging Equipment
In medical imaging equipment such as ultrasound or portable patient monitors, the 5CSXFC6C6U23I7N combines deterministic FPGA hardware for signal acquisition with ARM Cortex-A9 cores for processing and connectivity. The FPGA fabric handles front-end beamforming, filtering, or ECG/EEG preprocessing at sample rates well beyond CPU capability. The Cortex-A9 cores then perform display rendering, network connectivity, and user interface. The integrated DDR3 controller with ECC is critical for medical-grade data integrity, while the industrial temperature range supports portable diagnostic carts. Compared with a discrete CPU+FPGA architecture, the SoC FPGA simplifies IEC 60601 EMC compliance by reducing the number of high-speed board traces.
Recomendado
Smart Grid and Energy Management Gateways
The 5CSXFC6C6U23I7N powers substation gateways and smart-grid energy management controllers where deterministic hardware meets networked software. The dual-core ARM Cortex-A9 runs secure communications stacks (TLS, IEC 61850) while the FPGA fabric handles fast protection logic, synchronized phasor measurement, and high-speed ADC sampling. Hardened peripherals inside the HPS (EMAC, USB, CAN) interface directly with substation communication backbones. The industrial temperature range (-40C to +100C) supports deployment in unconditioned outdoor cabinets. By collapsing CPU and FPGA into a single device, the design gains significant reliability advantages in environments where traditional discrete architectures would suffer from inter-chip synchronization drift.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 5CSXFC6C6U23I7N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 5CSXFC6C6U23I7NES | 5CSXFC6C6U23A7N | 5CSXFC6C6U23C7N | 5CSEBA2U23I7N | 5CSEMA5U23I7N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-UBG-A (23x23 mm, 1.0 mm pitch) | 672-UBG-A (23x23 mm) - same | 672-UBG-A (23x23 mm) - same | 672-UBG-A (23x23 mm) - same | 672-UBG-A (23x23 mm) - same | 672-UBG-A (23x23 mm) - same |
| Family | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V SE | Cyclone V SE |
| Logic Elements | 110,000 | 110,000 | 110,000 | 110,000 | ~25,000 | ~85,000 |
| HPS | Dual-core Cortex-A9 @ 800 MHz | Dual-core Cortex-A9 @ 800 MHz | Dual-core Cortex-A9 @ 800 MHz | Dual-core Cortex-A9 @ 800 MHz | Dual-core Cortex-A9 | Dual-core Cortex-A9 |
| Process Node | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Lifecycle Status | Active | Engineering sample | Active | Active | Active | Active |
| Drop-in Footprint Match | Reference | Yes - identical | Yes - identical | Yes - identical | Yes - identical | Yes - identical |
Diferenciadores clave
- Highest logic capacity in the U23 footprint Cyclone V SX family (frente a 5CSEBA2U23I7N)
- True drop-in replacement with engineering sample qualification (frente a 5CSXFC6C6U23I7NES)
- Industrial temperature grade at the same package (frente a 5CSXFC6C6U23C7N)
Notas de diseño
The 5CSXFC6C6U23I7N in the 672-UBG-A package requires a PCB land pattern with 1.0 mm ball pitch. Estimated: at full HPS+FPGA utilization with industrial -40C to +100C ambient, the junction can rise approximately 15-20C above ambient at moderate clock loads. Provide a thermal pad array under the central BGA region and at least four thermal vias per inner ball grid to dissipate heat from the silicon die. Forced-air cooling is recommended for sealed enclosures.
Place the HPS DDR3 SDRAM as close as possible to the dedicated HPS DDR balls, routing within the matched-length constraints defined in the Cyclone V external memory interface guidelines. Keep the DDR reference voltage (VREF) and the DDR VTT termination network on the same PCB layer as the memory devices to avoid impedance discontinuities. Use a 4-layer stack-up with continuous ground planes under the BGA to minimize crosstalk on the HPS-FPGA interconnect bridge.
Plan separate power rails for the FPGA core (1.1 V), HPS core (1.1 V), HPS I/O (1.8 V or 3.3 V), and FPGA I/O banks (1.2 V to 3.0 V depending on bank standard). Use the recommended power-on sequencing with the HPS cold reset held until all rails are stable. The Cyclone V device datasheet specifies minimum ramp rates; violation can cause configuration memory corruption or HPS boot failures.
Do not substitute the 5CSXFC6C6U23I7N with non-U23 package variants on the same PCB footprint; the 672-ball UBG-A is the only one in the U23 designation. Mixing SX with SE family members of the same U23 package will fit the footprint but produce different logic capacity and DSP counts, which can cause bitstream and firmware incompatibility. Always regenerate the Quartus project when swapping between SX, SE, and ST family members.
Información de cumplimiento
RoHS and lead-free compliance per Altera/Intel product page. Industrial temperature grade but not AEC-Q100 qualified; select automotive-grade OPN for vehicle applications. Halogen-free status not explicitly stated in available data.
