A3P600L-1FG484I - ProASIC3L 600K Flash FPGA | Microchip
N.º de pieza: A3P600L-1FG484I ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
A3P600L-1FG484I Descripción general
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory rather than an external configuration ROM. In the FPGA hierarchy (FPGA -> programmable logic device -> programmable semiconductor), flash FPGAs occupy the single-chip niche: they power up instantly, require no boot device, and resist configuration corruption, unlike SRAM FPGAs such as Xilinx Spartan or Altera Cyclone families.
Key features of the A3P600L include Microchip's Flash*Freeze technology, which dramatically reduces static and dynamic power by allowing near-instant sleep and wake without losing state; a 1.2 V to 1.5 V core voltage range; reprogrammable flash fabric with live-on-power-up operation; and 130 nm flash process technology. The 484-ball FBGA footprint provides ample I/O for bus-wide interfaces while remaining reflow-solderable on standard SMD assembly lines.
Architecturally, the ProASIC3L fabric is built from VersaTiles - fine-grained logic tiles that implement both combinational and sequential functions - supported by embedded RAM blocks, FIFO control, and flexible I/O banks supporting multiple voltage standards. Because configuration resides in flash, security against cloning and overbuild is inherently stronger than SRAM-based competitors.
Typical applications include portable and battery-powered instrumentation, industrial automation controllers, aerospace sub-systems requiring instant-on logic, communications line cards, and medical monitoring equipment where Flash*Freeze idle current is decisive.
Design consideration: budget the power rails per the Microchip power estimator for the -1 speed grade; the Flash*Freeze pin must be properly sequenced with the I/O banks to avoid bus contention during sleep entry and wake-up.
This page synthesizes distributor pricing context, same-family drop-in options, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas directas para A3P600L-1FG484I — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con A3P600L-1FG484I (mismo factor de forma y huella) — difiere en Package, Operating Temperature, Technology, Core Voltage, Configuration Memory.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
A3P600L-1FGG484I
✅ Sustitución directa✓ En stock
$17.1 / unidad
Ver hoja de datos →A3P600L-FG484I
✅ Sustitución directa✓ En stock
$45.6 / unidad
Ver hoja de datos →A3P600L-FGG484I
✅ Sustitución directa✓ En stock
$41.35 / unidad
Ver hoja de datos →A3P600L-1FG484
✅ Sustitución directa✓ En stock
$58.9 / unidad
Ver hoja de datos →A3P1000L-1FGG484I
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$28.8 / unidad
Ver hoja de datos →A3P600-2FGG484I
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$31.8 / unidad
Ver hoja de datos →A3P600L-1FG484I Valores máximos y características eléctricas
| Family | ProASIC3L |
| System Gates | 600K |
| Logic Elements (D9 register-cells) | 110592 |
| User I/O | 235 |
| Core Voltage | 1.2 V to 1.5 V |
| Technology | 130 nm flash process |
| Configuration Memory | On-chip Flash (single-chip, live at power-up) |
| Special Features | Flash*Freeze low-power technology |
| Speed Grade | -1 |
| Temperatura de funcionamiento | -40C to +100C (Industrial) |
| Encapsulado | 484-ball FBGA (FG484) |
| Tipo de montaje | Surface Mount |
| Programmability | In-system reprogrammable |
| Security | Flash-based, single-chip, secure against cloning |
Guía de configuración de pines de A3P600L-1FG484I 484-ball fbga (fg484)
Configuración de pines para A3P600L-1FG484I (encapsulado 484-ball fbga (fg484)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para A3P600L-1FG484I.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
A3P600L-1FG484I es adecuado para 6 aplicacións: Battery-Powered Portable Instrumentation, Industrial Automation Controllers, Aerospace and Defense Sub-Systems, Communications Line Cards, Medical Monitoring Equipment, Test and Measurement Instruments.
Battery-Powered Portable Instrumentation
The A3P600L-1FG484I fits portable and battery-operated instruments because its Flash*Freeze technology collapses both static and dynamic power while retaining full FPGA state, allowing instant wake on a trigger event. With 600K gates and up to 235 user I/Os, it can host the entire acquisition glue logic, sensor interface, and display controller on one chip running from a 1.2-1.5 V core rail. In use, the system parks the FPGA in Flash*Freeze between measurements, cutting idle current dramatically compared with SRAM FPGAs that must reload configuration after power-down. The trade-off is that wake-up transitions must be sequenced correctly to avoid I/O bus contention, so budget firmware and pin planning around the Flash*Freeze control pin.
Recomendado
Industrial Automation Controllers
The industrial temperature rating of -40C to +100C and the 484-ball FBGA with 235 user I/Os make the A3P600L-1FG484I a strong fit for PLC I/O modules, protocol bridges, and machine-control logic. Flash configuration is live at power-up, so machinery can start deterministically without a bootloader or external configuration PROM - a reliability benefit in electrically noisy factory environments. The -1 speed grade comfortably handles fieldbus interfacing, encoder counting, and safety interlock glue logic that do not require multi-hundred-MHz pipelines. Designers should group I/O banks by voltage standard (3.3 V, 2.5 V, 1.8 V interfaces) during pin assignment and verify supply sequencing per the Microchip power-up specifications for reliable operation across the full temperature range.
Recomendado
Aerospace and Defense Sub-Systems
Flash-based FPGAs are favored in aerospace sub-systems because the on-chip flash configuration resists single-event configuration upset far better than SRAM fabric and eliminates the configuration PROM, improving board-level reliability. The A3P600L-1FG484I's single-chip solution and secure flash configuration mitigate cloning and overbuild risks for defense hardware, while the -40C to +100C industrial range suits many avionic bay environments with appropriate derating. With 600K gates and 235 I/Os, the device implements telemetry framing, sensor aggregation, and redundant-voting logic. Note that this commercial-grade 'I' part is not automatically qualified for space; for space programs, evaluate Microchip's dedicated RT (radiation-tolerant) FPGA lines instead.
Recomendado
Communications Line Cards
In communications equipment, the A3P600L-1FG484I serves as line-card fabric glue: framing, deskewing, and backplane interface bridging across up to 235 I/Os in one 484-ball FBGA. The 1.2 V core keeps dynamic power low at moderate clock rates, which matters when dozens of line cards share a chassis power budget. Because configuration is in flash, cards come up live immediately after hot-swap insertion without waiting on a bitstream download from a CPU. Designers should place the device per the Microchip layout guidance for FBGA escape routing and verify I/O bank reference voltages against the backplane standards in use. For very high serial rates, confirm the -1 grade AC timing tables in the ProASIC3L datasheet before committing.
Recomendado
Medical Monitoring Equipment
Medical monitors benefit from the A3P600L-1FG484I's combination of instant-on flash configuration, quiet single-chip power, and Flash*Freeze idle mode between measurement windows. The 600K-gate capacity hosts patient-board front-end control, filtering pipelines, and alarm logic, while 235 user I/Os accommodate multi-lead sensor arrays and display interfaces. Instant wake from Flash*Freeze means an alarm condition can be serviced within the state-retention wake latency without a reconfiguration cycle - important for alarm responsiveness. The trade-off versus an MCU-only design is development complexity in Libero SoC, so choose this FPGA when parallel sensor processing or protocol aggregation outgrows MCU capability. Verify I/O protection for patient-connected circuits per applicable medical isolation requirements.
Recomendado
Test and Measurement Instruments
Bench and automated test equipment use the A3P600L-1FG484I as the timing, trigger, and bus-interface engine. The -1 speed grade supports the moderate clock rates typical of instrument control logic, while the large 484-ball FBGA ball grid supplies the 235 I/Os needed for relay-driver arrays, channel multiplexing, and parallel digital capture. Flash configuration gives deterministic power-up behavior that production test fixtures require, and single-chip operation simplifies calibration records by reducing component variability. Flash*Freeze lets a battery-backed portable tester sip power between DUT sessions. Designers should verify timing closure in Libero SoC for any trigger paths and reserve I/O banks for future channel expansion during pin planning.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para A3P600L-1FG484I — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | A3P600L-1FGG484I | A3P600L-FG484I | A3P1000L-1FGG484I | A3P600-2FGG484I |
|---|---|---|---|---|---|
| Package | 484-ball FBGA (FG484) | 484-ball FBGA - same footprint, lead-free balls | 484-ball FBGA - same footprint | 484-ball FBGA - same footprint | 484-ball FBGA - same footprint |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600K | 600K | 600K | 1M | 600K |
| Speed Grade | -1 | -1 | Standard (faster) | -1 | -2 |
| User I/O | 235 | 235 | 235 | 235 | 235 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Flash*Freeze Technology | Yes | Yes | Yes | Yes | No (ProASIC3, not 3L) |
| Temperature Range | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
Diferenciadores clave
- Flash*Freeze low-power mode with state retention (frente a A3P600-2FGG484I)
- Lowest speed grade minimizes dynamic power (frente a A3P600L-FG484I)
- Cost-optimized density point (frente a A3P1000L-1FGG484I)
Notas de diseño
Estimate: budget three rails - 1.2 V core (or 1.5 V), I/O bank rails, and auxiliary - using the Microchip ProASIC3L power estimator for the -1 speed grade before fixing the DC-DC design. Flash*Freeze entry/exit causes transient current steps; size bulk capacitance near the core rail so the regulator does not droop during wake-up. Because configuration is on-chip flash, there is no configuration current spike at power-up, which simplifies hot-swap supply design versus SRAM FPGAs.
The 484-ball FBGA requires careful escape routing: plan via-in-pad or dog-bone escapes for the outer two ball rows and reserve inner rows for power/ground. Follow the Microchip ProASIC3L layout guidelines for ball assignment and impedance control on high-speed I/O banks. Keep Flash*Freeze and reset control traces short and away from switching signals to avoid spurious sleep entry. Provide thermal vias per the datasheet package section, and verify ball-map matches the FGG variant if you later swap to the lead-free sibling - footprints are the same family pin map.
Do not confuse the FG (standard ball) and FGG (lead-free ball) suffixes when documentation requires RoHS proof - compliance paperwork differs even though the silicon is identical. The -1 speed grade is the slowest grade; designs characterized on faster FGG484 samples may fail timing on -1 silicon. Also remember that this commercial industrial part is not radiation-tolerant: do not substitute it into space programs. Finally, verify temperature range requirement before choosing A3P600L-1FG484 (commercial) as a substitute for the I-suffix industrial part.
Información de cumplimiento
FG suffix traditionally denotes standard ball finish while FGG denotes lead-free; the provided web data does not state RoHS status for this exact MPN - verify on the Microchip product page or choose the FGG variant for documented RoHS.