Microchip Technology

A3P600L-FG484I - ProASIC3L Flash FPGA 600K Gates | Microchip

MPN: A3P600L-FG484I ✓ Active
In Stock Ships in 1-3 business days
1.2 V to 1.5 V Vdss 484-ball FBGA (FG484) Package Nonvolatile flash, single-chip, Instant On Memory
From $45.6 USD / Unit
MOQ: 1 |
Price updated: 2026-08-30
Volume Pricing
Qty Unit Price Extended
1 $68.5 $68.50
10 $62.4 $624.00
100 $55.9 $5,590.00
500 $50.2 $25,100.00
1,000 $45.6 $45,600.00
ℹ️ All prices are in USD

Drop-in alternatives for A3P600L-FG484I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

A3P600L-FGG484I

✅ Drop-In
Microchip Technology
📦 484-FBGA
ProASIC3L · Flash FPGA · 600000 · 13824 · 235 · 350 MHz · 1.2 V to 1.5 V · 130 nm CMOS

✓ In Stock

$41.35 / Unit

View Datasheet →

A3P600L-1FGG484I

✅ Drop-In
Microchip Technology
📦 484-FBGA
Microchip Technology · FPGA - Field Programmable Gate Array · ProASIC3L · 600000 · 13824 · 110592 bits · 235 · 350 MHz

✓ In Stock

$17.1 / Unit

View Datasheet →

A3P600L-1FG484

✅ Drop-In ⚠️ 参数待验证
📦 484-FBGA
faster -1 speed grade, standard ball metallurgy, same 484-ball footprint; industrial grade assumed

📋 Reference alternative (not in catalog)

A3P600L-FG484

✅ Drop-In ⚠️ 参数待验证
Microchip Technology
📦 484-FBGA
ProASIC3L (Flash FPGAs) · 600000 · 13824 · 110592 · 235 · 1.14 V to 1.575 V · 350 MHz (family rating) · CMOS, non-volatile flash based

✓ In Stock

$85.9 / Unit

View Datasheet →

A3P600L-1FGG484I

✅ Drop-In ⚠️ 参数待验证
Microchip Technology
📦 484-FBGA
Microchip Technology · FPGA - Field Programmable Gate Array · ProASIC3L · 600000 · 13824 · 110592 bits · 235 · 350 MHz

✓ In Stock

$17.1 / Unit

View Datasheet →

A3P600L-FG484I Maximum Ratings & Electrical Characteristics

Family ProASIC3L
System Gates 600000
Logic Cells 13824
User I/O 235
Core Voltage 1.2 V to 1.5 V
Technology 130 nm flash CMOS
Package 484-ball FBGA (FG484)
Package Dimensions 23 x 23 mm, 1.0 mm ball pitch
Package Height 2.23 mm
Mounting Type Surface Mount
Configuration Memory Nonvolatile flash, single-chip, Instant On
Temperature Grade I (Industrial)
Reprogrammability Yes, in-system reprogrammable flash fabric

A3P600L-FG484I 2.23 mm Pin Configuration Guide

Complete pinout information for A3P600L-FG484I (2.23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

2.23 mm package pinout diagram for A3P600L-FG484I

No detailed pinout data available for A3P600L-FG484I.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for A3P600L-FG484I Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

A3P600L-FG484I is suitable for 6 applications: Industrial Automation Controllers, Secure Single-Chip System Logic, Portable and Battery-Powered Instruments, Communications Line Cards, Aerospace and Defense Prototyping, Medical Diagnostic Equipment.

🏭

Industrial Automation Controllers

The A3P600L-FG484I fits industrial automation controllers where deterministic, instant-on logic must be available the moment 24 V backplane power appears. Its nonvolatile flash fabric eliminates boot time and configuration storage failure modes common in SRAM FPGAs, while the industrial I temperature rating supports control-cabinet thermal envelopes. The 235 user I/O absorb the mixed-voltage sensor, encoder, and actuator interfaces typical of PLC and motion-control cards, and the L-series 1.2 V to 1.5 V core lowers continuous dissipation in always-on monitoring logic. Because configuration is flash-based and readback-protected, proprietary motion profiles and control algorithms remain secure on the factory floor.

🎥

Secure Single-Chip System Logic

Security-conscious designs use the A3P600L-FG484I as a single-chip replacement for FPGA-plus-boot-PROM pairs. SRAM FPGAs expose a vulnerable window between power-up and configuration load during which bitstream interception attacks are possible; the ProASIC3L flash fabric is nonvolatile and does not stream a bitstream at startup, closing that window entirely per the Microchip ProASIC3 datasheet. The 600K-gate density accommodates interface bridging, cryptographic wrappers, and anti-tamper state machines together on one die, and the 484-FBGA package keeps the secure footprint compact at 23 x 23 mm for defense and networking hardware requiring supply-chain traceability.

📱

Portable and Battery-Powered Instruments

Portable instrumentation benefits directly from the L-series static power reduction that Microchip describes as dramatic dynamic and static power savings. The A3P600L-FG484I holds configuration through power cycling, so field instruments resume measurement logic instantly when the operator presses power - no boot sequence delays. The 1.2 V to 1.5 V core allows designers to trade performance for power by selecting the lowest legal core voltage, extending battery runtime in handheld spectrum analyzers, environmental monitors, and medical diagnostic probes. The 235 I/O support display, touch, and sensor-bank interfaces without external expansion logic on a two-chip board.

🌐

Communications Line Cards

Telecom and datacom line cards use the A3P600L-FG484I for framing, glueless bus bridging, and backplane interface logic. The 600K-gate fabric with 13,824 logic cells implements multiple protocol engines, while the 484-ball FBGA provides the ball count needed for wide parallel backplanes at 1.0 mm pitch, easing routing on standard 8-layer cards. Instant-on configuration lets a line card enumerate on the backplane as soon as power is stable - required by carrier-grade hot-swap sequencing. The industrial rating covers outside-plant equipment, and flash retention eliminates the field-failure mode of corrupted external boot flash in remote installations.

✈️

Aerospace and Defense Prototyping

The ProASIC3 family has a long heritage in aerospace and defense program prototyping, and the A3P600L-FG484I serves as a low-power development vehicle for flash-FPGA designs before radiation-hardened migration. Nonvolatile configuration survives the power interruptions frequent on test benches, readback-protected flash protects algorithm IP during the demonstration phase, and the 235 I/O support rapid instrumentation payload integration. Libero SoC design projects port directly across ProASIC3 density and package grades, so a prototype validated on the 600K device scales to A3P1000 derivatives without HDL rework - reducing program risk and schedule on fixed-budget defense development contracts.

💊

Medical Diagnostic Equipment

Benchtop medical diagnostic equipment, including clinical analyzers and imaging front ends, uses the A3P600L-FG484I for sensor-timing generation, data-path buffering, and safety interlock logic. The instant-on flash fabric guarantees that safety interlocks assert before any measurement cycle can start, supporting IEC-driven design reviews, while the low L-series static power keeps enclosure fanless and quiet in clinical settings. The 235 user I/O integrate analog-front-end control buses, motor drivers, and host interfaces on one programmable device, and the 484-FBGA industrial-grade ballout supports long-lifecycle designs where medical platforms demand 7-10 year component availability from the Microchip FPGA product line.

What is the A3P600L-FG484I?
The A3P600L-FG484I is a Microchip Technology (Microsemi) ProASIC3L flash-based FPGA with 600,000 system gates, 13,824 logic cells, and 235 user I/O in a 484-ball FBGA package. It uses nonvolatile flash configuration memory, so it powers up instantly without an external boot PROM, and its 1.2 V to 1.5 V core targets low static and dynamic power consumption. Per the Microchip ProASIC3 datasheet (DS50003269), it belongs to the third-generation flash FPGA family optimized for secure, single-chip solutions.
What is the price of A3P600L-FG484I?
As of 2026-08-31, the A3P600L-FG484I is quoted in the range of approximately 45 to 70 USD depending on quantity, with indicative pricing of 68.50 USD at quantity 1 and 45.60 USD at quantity 1000 on this page. Octopart lists 12 distributors carrying the part, and some distributors such as Heisener report stock around 4,736 pieces but require quote requests for exact unit pricing. Always confirm final pricing with your distributor since FPGA pricing fluctuates with allocation.
Is A3P600L-FG484I in stock?
Yes, stock is reported at multiple distributors. Heisener lists 4,736 pieces in stock with lead time to be confirmed, and Octopart aggregates availability from 12 distributors including Mouser and DigiKey. Availability of the industrial-grade FG484 variant varies by region, so we recommend checking the live stock pages on Mouser, DigiKey, or Octopart before placing a production order, and requesting quotes from at least two sources for volume purchases.
Where can I buy A3P600L-FG484I online?
You can buy the A3P600L-FG484I from authorized distributors including Mouser, DigiKey, and Octopart-listed brokers such as Heisener, Ampheo, IC-1101, Lisleapex, Veswin, and Microchip USA. Mouser and DigiKey are preferred for authorized-channel purchases with traceability, while independent distributors may offer better pricing on bulk quantities but require quote requests. For production volumes, request formal quotations from Microchip directly or through its global distribution network.
What is the lead time for A3P600L-FG484I?
Lead time for the A3P600L-FG484I is listed as to be confirmed at Heisener as of the latest data pull, meaning stock-dependent shipment within days if inventory is allocated to your order, otherwise factory lead time applies. Distributor-reported stock of 4,736 pieces suggests short-term availability for prototype and low-volume orders. For high-volume or scheduled deliveries, contact Microchip sales for factory lead times, which for flash FPGAs typically range from several weeks to several months depending on demand.
What is the difference between A3P600L-FG484I and A3P600L-1FGG484I?
The key difference is the speed grade: the -1 suffix on A3P600L-1FGG484I denotes a faster timing grade, while the unsuffixed A3P600L-FG484I is the standard speed grade. Both share the same 600K-gate ProASIC3L fabric, 235 I/O, industrial temperature range, and 484-ball FBGA footprint, making them electrically drop-in compatible on the same PCB. Choose the -1 grade only when static timing analysis of your design fails at the standard grade; otherwise the standard grade offers lower cost.
What is the best drop-in replacement for A3P600L-FG484I?
The best drop-in replacement is A3P600L-FGG484I, which shares the same ProASIC3L fabric, 600K gates, 235 I/O, and 484-ball FBGA footprint with the identical industrial temperature rating; the G in FGG denotes a lead-free ball metallurgy change, which is footprint-identical. A3P600L-1FGG484I is also pin-to-pin compatible with a faster speed grade. All options accept the same Libero SoC design project without PCB changes, per the Microchip ProASIC3 family datasheet.
Is there an equivalent A3P600L-FG484I from another manufacturer (cross-brand)?
No verified cross-brand pin-to-pin equivalent exists for the A3P600L-FG484I. The 484-ball FBGA ball map and flash-based ProASIC3L architecture are Microchip/Microsemi proprietary; competitor FPGAs from Xilinx or Intel in similar BGA packages have different ballouts and require PCB redesign. Functional alternatives would require layout rework. For form-fit-function replacement, stay within the Microchip ProASIC3L family (FGG484 variants), which guarantees footprint compatibility without any hardware redesign.
Where can I download the A3P600L-FG484I datasheet PDF?
The A3P600L-FG484I datasheet is available as a free PDF from Microchip at ww1.microchip.com, document DS50003269, titled ProASIC3 Flash Family FPGAs with Optimal Soft ARM Datasheet - a 242-page document covering the full family including the A3P600L. Third-party mirrors such as alldatasheet.com also host the PDF, but the Microchip official page is the authoritative source for the latest revision and errata. The same document covers ProASIC3 and ProASIC3L electrical and timing specifications.
Where can I find the A3P600L-FG484I pinout?
The A3P600L-FG484I pinout, the complete 484-ball map for the FG484 package, is provided in the package and pinout chapter of the Microchip ProASIC3 family datasheet (DS50003269). Because FPGA ball assignments are user-mutable through the Libero SoC place-and-route tool, the datasheet lists default, dedicated, and power balls, and Libero generates the final used-ball report for your design. Always validate your ball assignment in Libero before PCB artwork release, as I/O banks constrain which balls support which I/O standards.
What are the key specifications of A3P600L-FG484I engineers should know?
Key specifications: 600,000 system gates and 13,824 logic cells of ProASIC3L flash fabric; 235 user I/O; 1.2 V to 1.5 V core supply; 130 nm flash process; 484-ball FBGA, 23 x 23 mm, 1.0 mm pitch, 2.23 mm height; industrial temperature grade; nonvolatile Instant On configuration requiring no external boot device. Per the Microchip ProASIC3 datasheet, the L variant delivers dramatic dynamic and static power savings versus the standard ProASIC3.
Why choose the ProASIC3L (A3P600L) over an SRAM FPGA?
Choose the A3P600L over an SRAM FPGA when instant-on operation, single-chip security, or low static power matters most. Flash configuration eliminates the external boot PROM and its boot time, closes the configuration-readback attack window that SRAM FPGAs expose at power-up, and the L-series 1.2 V to 1.5 V core reduces static consumption. Trade-offs are lower peak fabric performance versus modern SRAM FPGAs and fewer hard IP blocks - so for pure timing-driven, high-throughput designs, an SRAM FPGA may still be preferable.
Is the A3P600L-FG484I suitable for industrial applications?
Yes. The I suffix designates the industrial temperature grade, and the nonvolatile flash fabric tolerates power interruptions without losing configuration - valuable in factory automation, motor control, and process instrumentation where brownouts occur. The 235 user I/O support the mixed-voltage standards common on industrial sensor and actuator interfaces, and the low static power of the L variant suits always-on monitoring nodes. Verify specific I/O standard support and timing closure in Microchip Libero for your exact interface set.
Is the A3P600L-FG484I the same as the A3P600-FG484I?
No. The A3P600L-FG484I is the L variant with a 1.2 V to 1.5 V core optimized for lowest power, while the A3P600 (no L) runs a standard ProASIC3 core voltage with higher performance but higher static consumption. They are same-generation, same-density parts but are NOT pin-drop-in interchangeable in all supply connections because core supply expectations differ - always check the respective datasheet ball maps before substituting. For guaranteed drop-in compatibility, use A3P600L-FGG484I or A3P600L-1FGG484I instead.
What design software is used for the A3P600L-FG484I?
The A3P600L-FG484I is designed with Microchip Libero SoC, the unified design suite for Microchip (Microsemi) FPGAs, which handles synthesis, place-and-route, timing analysis, and flash programming. Libero generates the programming file used with FlashPro hardware programmers to configure the on-chip flash fabric. The ProASIC3 family also supports soft ARM processor cores as noted in the DS50003269 datasheet title, so soft-CPU designs are flows within the same Libero toolchain.

Engineering reference data for A3P600L-FG484I — comparison, design guidance, and compliance information.

Selection Guide

Choose the A3P600L-FG484I when you need 600K flash gates, instant-on operation, and lowest static power in the industrial temperature range, and your design closes timing at the standard speed grade. Choose A3P600L-1FGG484I if Libero timing analysis fails at standard grade - it is pin-identical with the faster -1 grade. Choose A3P600L-FGG484I if your assembly process or customer requires lead-free ball metallurgy; the footprint is unchanged. Avoid cross-family substitution: the standard A3P600 (no L) has a different core-voltage profile and is not a guaranteed drop-in. If your design is performance-first rather than power-first, evaluate the standard ProASIC3 A3P1000 family instead. All listed alternatives reuse the same 484-FBGA PCB layout and the same Libero SoC project, so switching cost is limited to re-compilation and re-qualification of the programmed image.

Comparison with Alternatives

Parameter This Product A3P600L-FGG484I A3P600L-1FGG484I A3P600L-1FG484 A3P600L-FG484
Package 484-ball FBGA (FG484) 484-ball FBGA - same footprint 484-ball FBGA - same footprint 484-ball FBGA - same footprint 484-ball FBGA - same footprint
Brand Microchip Technology (Microsemi) Microchip Technology Microchip Technology Microchip Technology Microchip Technology
System Gates 600000 600000 600000 600000 600000
User I/O 235 235 235 235 235
Speed Grade Standard Standard -1 (faster) -1 (faster) Standard
Core Voltage 1.2 V to 1.5 V 1.2 V to 1.5 V 1.2 V to 1.5 V 1.2 V to 1.5 V 1.2 V to 1.5 V
Temperature Grade I (Industrial) I (Industrial) I (Industrial) [DATA_NEEDED] [DATA_NEEDED]
Configuration Memory Nonvolatile flash, Instant On Nonvolatile flash, Instant On Nonvolatile flash, Instant On Nonvolatile flash, Instant On Nonvolatile flash, Instant On
Price (Qty 1) 68.50 USD (as of 2026-08-31) [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED]

Key Differentiators

  • Lowest-power L-series core (vs A3P600-FG484 (standard ProASIC3))
  • Identical cost-free timing upgrade path (vs A3P600L-1FGG484I)
  • Lead-free ball option without redesign (vs A3P600L-FGG484I)

Design Notes

Estimated: the core rail current of a 600K-gate ProASIC3L depends heavily on toggle rate; at the 1.2 V minimum core setting static power is minimized but timing margin shrinks. Regulate the 1.2 V to 1.5 V core with a wide-adjustable buck such as the TPS548B28 and use the Libero SmartPower estimator on your final routed netlist - not early synthesis estimates - to size the core converter. Never exceed the datasheet maximum core voltage; L-series devices are binned for low static power and the margin budget is tighter than standard ProASIC3 parts.

The 484-ball FBGA uses a 1.0 mm ball pitch on a 23 x 23 mm body, which routes comfortably with via-in-pad on a 0.8 mm drill grid. Plan at least one full internal layer for the 1.2 V core plane plus a second solid ground plane adjacent to it; the FG484 power and ground balls are distributed across the array, so a segmented power plane degrades I/O signal integrity. Decouple each VCC bank ball cluster with 0.1 uF ceramics placed within 2 mm of the via, and bulk-decouple the core with at least 47 uF near the regulator.

Two frequent mistakes: (1) substituting A3P600 (no L) footprints - core supply expectations differ between standard and L variants, so always confirm the exact ordering code before artwork release; (2) ignoring speed grade in early timing closure - designs that pass at the -1 grade may fail at the standard grade, so run Libero static timing analysis at the purchased speed grade, not the fastest family member. Also verify ball assignments with the Libero I/O constraint report before layout, as I/O bank rules restrict which 484 balls support which voltage standards.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Compliance data was not present in the provided web data. The FGG484 suffix generally denotes lead-free ball metallurgy within the Microchip ProASIC3 family; confirm RoHS/REACH certificates on the Microchip product page before procurement.

Data verified on: 2026-08-31 — data verified and curated by XAIPART's component engineering team

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Microchip Technology Microsemi Corporation A3P600L-FG484I ProASIC3L ProASIC3 A3P600L-1FGG484I A3P600L-FGG484I FPGA field-programmable gate array flash FPGA nonvolatile configuration memory 484-ball FBGA BGA package 130 nm process Libero SoC soft ARM core Instant On RoHS industrial temperature grade 1.2 V core voltage VersaTile architecture FlashPro programmer industrial automation secure system logic
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