A3PE600-FG484I - ProASIC3E FPGA 600K Gates 484-FBGA | Microchip
N.º de pieza: A3PE600-FG484I ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $132.5 | $132,50 |
| 10 | $119.25 | $1.192,50 |
| 100 | $106 | $10.600,00 |
| 500 | $95.4 | $47.700,00 |
| 1.000 | $86.1 | $86.100,00 |
A3PE600-FG484I Descripción general
A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks (CLBs) and programmable interconnects that designers configure to implement custom digital circuits. The A3PE600 belongs to the ProASIC3E family, part of the broader hierarchy FPGA -> programmable logic device (PLD) -> programmable logic -> semiconductor. Unlike SRAM FPGAs, ProASIC3E devices use flash-based configuration cells, giving them a single-chip, non-volatile, instant-on solution with no external boot PROM.
Key features include 600K system gates with roughly 13,824 logic cells (7K usable LEs), system performance up to 231 MHz, a 1.5V core supply (1.425V to 1.575V operating range), and abundant advanced features such as embedded RAM blocks and extensive I/O flexibility. The flash fabric delivers low total cost of ownership (TOC) because it eliminates configuration devices and supports secure, single-chip designs.
Architecturally, ProASIC3E combines the VersaTile logic structure with dedicated embedded memory blocks, enabling designers to build FIFOs, dual-port RAMs, and state machines while the 270 user I/Os support multiple single-ended and differential standards. The 130nm flash process also offers intrinsically low static power and high resistance to configuration upset compared with SRAM-based competitors.
Typical applications include industrial automation and motor control, aerospace and defense payloads requiring instant-on operation, communications and networking line cards, and medical instrumentation. The industrial temperature grade (I suffix) and flash security make it well suited for harsh or security-sensitive environments.
Design consideration: verify core supply at 1.5V within the 1.425V-1.575V window and budget the 484-ball footprint carefully; this part is RoHS non-compliant per distributor data, so confirm regulatory acceptance for new designs or consider the FGG (green) package variants.
This page synthesizes distributor pricing tiers, drop-in alternatives from the same ProASIC3E family, and practical design notes not found on standard distributor listings.
Alternativas directas para A3PE600-FG484I — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con A3PE600-FG484I (mismo factor de forma y huella) — difiere en Package, Configuration Memory, Operating Temperature, Family, System Gates.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
A3PE600-FGG484I
✅ Sustitución directa✓ En stock
$44.03 / unidad
Ver hoja de datos →A3PE600-FGG484
✅ Sustitución directa✓ En stock
$53.7 / unidad
Ver hoja de datos →A3PE600-1FG484I
✅ Sustitución directa✓ En stock
$48.6 / unidad
Ver hoja de datos →A3PE600-1FGG484
✅ Sustitución directa✓ En stock
$44.9 / unidad
Ver hoja de datos →A3PE600-1FG484
✅ Sustitución directa✓ En stock
$48.1 / unidad
Ver hoja de datos →A3PE600-FG484M
✅ Sustitución directa✓ En stock
$68.9 / unidad
Ver hoja de datos →A3PE600-FG484I Valores máximos y características eléctricas
| Logic Cells | 13824 cells |
| Usable LEs | 7 KLEs |
| System Gates | 600000 gates |
| Embedded RAM Bits | 110592 bits |
| User I/O | 270 |
| Maximum System Frequency | 231 MHz |
| Process Technology | 130 nm |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) |
| Configuration Technology | Flash-based (non-volatile, single chip) |
| Encapsulado | 484-FBGA (23 x 23 mm, 1 mm ball pitch) |
| Temperatura de funcionamiento | -40C to +100C (TJ) |
| Tipo de montaje | Surface Mount |
| Packaging | Tray |
| Estado RoHS | Non-compliant |
| Manufacturer Lead Time | 8 weeks |
| Product Status | Active |
| Family | ProASIC3E |
Guía de configuración de pines de A3PE600-FG484I 484-fbga (23 x 23 mm, 1 mm ball pitch)
Configuración de pines para A3PE600-FG484I (encapsulado 484-fbga (23 x 23 mm, 1 mm ball pitch)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para A3PE600-FG484I.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
A3PE600-FG484I es adecuado para 6 aplicacións: Industrial Automation and Motor Control, Aerospace and Defense Payloads, Communications and Networking Line Cards, Medical Instrumentation, Test and Measurement Equipment, Secure Embedded Systems and IoT Gateways.
Industrial Automation and Motor Control
The A3PE600-FG484I fits industrial automation because its 600K gates and 270 user I/Os can integrate PWM generation, encoder interfaces, and fieldbus glue logic in one flash device running at up to 231 MHz. The -40C to +100C junction rating survives factory-floor temperature extremes, and the flash fabric is immune to configuration loss during brownouts, a known failure mode of SRAM FPGAs. In a typical motor drive, the FPGA sits between an MCU such as a Microchip PIC32 and the gate-driver stage, handling dead-time insertion and fault latching with deterministic timing. Because configuration is stored on-chip, no external flash is exposed to noisy EMC environments, and the 1.5V core keeps static power low in always-on control cabinets.
Recomendado
Aerospace and Defense Payloads
The A3PE600-FG484I suits aerospace and defense electronics because Microsemi/Microchip ProASIC3E flash FPGAs were designed for high-reliability, single-chip, instant-on operation: the bitstream resides in on-chip flash cells, eliminating the configuration PROM that would otherwise be a single point of failure and an attack surface in secure systems. The 270 I/Os accommodate spacewire-like parallel buses, telemetry framing, and sensor aggregation, while the -40C to +100C junction rating covers flight-cabin conditions. In a typical payload, the FPGA implements telemetry encoders and watchdog logic alongside a rad-hardened processor, providing autonomous health monitoring from the moment power is applied. Designers should confirm required screening levels (this part is a commercial-industrial grade) and rely on Microchip's defense program heritage for documentation support.
Recomendado
Communications and Networking Line Cards
For networking line cards and backplane bridges, the A3PE600-FG484I provides 110,592 embedded RAM bits for packet buffering and FIFO stages plus 270 I/Os for bus interfacing, all in one non-volatile 484-FBGA chip. The 231 MHz system performance handles SONET-style framing, TDM switching, and parallel PHY glue functions, while the flash fabric powers up configured, reducing line-card bring-up time in redundant systems. In a typical design, the FPGA bridges a microprocessor local bus to backplane LVDS or single-ended standards, using internal dual-port RAM blocks for clock-domain crossing FIFOs. The 1.5V core draws low static current, helpful in rack equipment with strict power budgets, and the industrial temperature grade supports outdoor telecom cabinets.
Recomendado
Medical Instrumentation
Medical diagnostic equipment such as blood analyzers, ultrasound front ends, and patient-monitoring gateways benefits from the A3PE600-FG484I's combination of deterministic custom logic and single-chip security. The flash configuration prevents bitstream tampering, supporting device integrity requirements, while 13,824 logic cells implement timing engines for sensor sampling, filter accelerators, and display interfaces at up to 231 MHz. The 484-ball FBGA with 270 I/Os connects to ADC front ends, motorized fluidics, and USB or Ethernet bridge chips without external glue logic. Because the fabric is non-volatile and instant-on, instruments begin self-test immediately at power-up, an important behavior for devices with strict warm-up and calibration sequences. The -40C to +100C range comfortably covers clinical operating environments.
Recomendado
Test and Measurement Equipment
Bench and rack instruments, including logic analyzers, signal generators, and automated test fixtures, use the A3PE600-FG484I as a configurable timing and protocol engine. Its 231 MHz fabric and 110,592 RAM bits support pattern generators, trigger comparators, and capture buffers, while 270 user I/Os fan out to probe pods and trigger buses through the 484-FBGA footprint. The flash-based design matters in T&M because instruments must be fully operational the instant the front-panel power switch is pressed, with no configuration load time, and field updates are managed securely through JTAG. The industrial temperature rating supports portable instruments used outdoors, and the deterministic fabric timing simplifies specification of measurement repeatability across production units.
Recomendado
Secure Embedded Systems and IoT Gateways
Security-sensitive embedded systems and industrial IoT gateways exploit the ProASIC3E's flash security: the A3PE600-FG484I stores its configuration in non-volatile on-chip cells with readback protection options, making reverse engineering of the design substantially harder than with SRAM FPGAs that expose their bitstream during boot. With 600K gates and 270 I/Os, a gateway can implement custom bus interfaces (Modbus, proprietary sensor buses), crypto accelerators, and tamper-monitoring state machines in a single -40C to +100C chip. The instant-on fabric performs integrity checks before the host processor boots, and the 1.5V core keeps standby power low for battery-backed installations. Compared with adding an external crypto chip, integrating security logic in the FPGA fabric reduces BOM count and attack surface.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para A3PE600-FG484I — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | A3PE600-FGG484I | A3PE600-FGG484 | A3PE600-1FG484I | A3PE600-FG484 |
|---|---|---|---|---|---|
| Package | 484-FBGA (23x23 mm) | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) |
| System Gates | 600000 gates | 600000 gates | 600000 gates | 600000 gates | 600000 gates |
| Embedded RAM Bits | 110592 bits | 110592 bits | 110592 bits | 110592 bits | 110592 bits |
| User I/O | 270 | 270 | 270 | 270 | 270 |
| Speed Grade | Standard | Standard | Standard | -1 (faster) | Standard |
| Operating Temperature | -40C to +100C (TJ) | -40C to +100C (TJ) | Commercial range | -40C to +100C (TJ) | Commercial range |
| RoHS Status | Non-compliant | Compliant (green package) | Compliant (green package) | Non-compliant | Non-compliant |
Diferenciadores clave
- Flash-based single-chip non-volatile configuration (frente a SRAM FPGAs (e.g., Xilinx Spartan-3 family))
- RoHS-compliant drop-in path exists (frente a A3PE600-FG484 (non-green, same die))
- Speed-grade upgradability on the same footprint (frente a A3PE600-FG484I (standard grade, this part))
Notas de diseño
Supply the 1.5V core rail within the 1.425V-1.575V window using a low-noise LDO or buck regulator with at least 3% accuracy over line, load, and temperature. Because ProASIC3E is flash-based, no separate configuration power rail or boot PROM supply is needed, but I/O bank supplies must be sequenced before or with the core per the ProASIC3E power-up guidelines in the Microchip datasheet. Add bulk and 0.1uF decoupling capacitors at each VCC/VCCI bank pin pair as recommended in the manufacturer's PCB layout application notes.
The 484-ball FBGA with 1 mm ball pitch (23x23 mm) typically requires a 6-layer or more PCB to escape all 270 I/Os plus power balls without excessive fanout congestion. Use via-in-pad or dog-bone escape patterns per IPC BGGA layout practice, and dedicate internal planes for the 1.5V core and I/O bank rails. Select your solder ball metallurgy consistently: the FG (standard) and FGG (green) variants must not be mixed on the same reflow profile qualification, so confirm ball composition during stencil and reflow profile development.
Two frequent mistakes with this device: (1) designing new RoHS-regulated products with the FG package, which distributor data flags as RoHS non-compliant - use the pin-identical FGG variants instead; (2) ignoring the 8-week factory lead time in production planning - the part is active but long-lead, so maintain buffer stock or qualify A3PE600-1FG484I as a complete no-modification replacement (per FindIC cross-reference data) to de-risk the supply chain. Also remember the design must be retargeted and timing re-verified in Libero when swapping speed grades.
Información de cumplimiento
Distributor (Microchip USA) data states RoHS Status: RoHS non-compliant for the FG package. The FGG (green) package variants are the RoHS-compliant options. Other compliance attributes not stated in provided data.
