A3PE600-FGG484I - 600K-Gate ProASIC3E Flash FPGA | Microchip
MPN: A3PE600-FGG484I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $61.65 | $616.50 |
| 100 | $54.8 | $5,480.00 |
| 500 | $49.32 | $24,660.00 |
| 1,000 | $44.03 | $44,030.00 |
Drop-in alternatives for A3PE600-FGG484I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE600-2FGG484I
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View Datasheet →A3PE600-1FGG484IY
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE600-FG484I
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$86.1 / Unit
View Datasheet →A3PE600-1FGG484
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$44.9 / Unit
View Datasheet →A3PE600-2FGG484
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A3PE600-FGG484
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$53.7 / Unit
View Datasheet →A3PE600-FGG484I Maximum Ratings & Electrical Characteristics
| Logic Cells | 13824 cells |
| CLBs | 13824 |
| System Gates | 600000 |
| Maximum Frequency | 350 MHz |
| User I/Os | 270 |
| Embedded Flash Memory | 110592 bits |
| Technology | CMOS, flash-based nonvolatile |
| Family | ProASIC3E |
| Package | FBGA-484 (PBGA484), green |
| Package Dimensions | 23 x 23 mm, 2.23 mm height, 1.0 mm ball pitch |
| Mounting Type | Surface Mount (BGA) |
| Terminal Form | Ball |
| Number of Terminals | 484 |
| Operating Temperature | -40C to +85C (Industrial) |
| Configuration Memory | On-chip flash (Instant On, single chip) |
| RoHS Status | Compliant (green package per Jotrin) |
A3PE600-FGG484I 23 x 23 mm, 2.23 mm height, 1.0 mm ball pitch Pin Configuration Guide
Complete pinout information for A3PE600-FGG484I (23 x 23 mm, 2.23 mm height, 1.0 mm ball pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE600-FGG484I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE600-FGG484I is suitable for 6 applications: Industrial Automation Controllers, Aerospace and Defense Subsystems, Medical Instrumentation, Secure Communication Bridges, Test and Measurement Equipment, IoT Edge Gateways and Smart Sensors.
Industrial Automation Controllers
The A3PE600-FGG484I fits industrial automation because its 600k gates and 13,824 CLBs absorb motor-control state machines, fieldbus interfaces, and safety interlock logic in one nonvolatile device. Its -40C to +85C industrial rating and 270 user I/Os allow direct interfacing with 3.3V/2.5V sensors, encoders, and communication PHYs without glue logic. Because the flash fabric is Instant On, controller logic is active within microseconds of power-up - critical for deterministic machine startup and fail-safe watchdog designs. Compared with an SRAM FPGA plus boot flash, the single-chip solution reduces BOM count, board area, and configuration-failure modes on the factory floor. Place the part on a solid 1.5V core / 2.5V or 3.3V I/O rail plan with one bulk capacitor per rail pair, and use the 350 MHz fabric headroom for future functional upgrades via Libero recompilation.
Recommended
Aerospace and Defense Subsystems
Aerospace and defense programs choose the A3PE600-FGG484I because flash-based configuration eliminates the external bitstream storage that dominates SRAM-FPGA threat surfaces, providing single-chip Instant On logic for payload processors, telemetry interfaces, and secure boot bridges. The industrial -40C to +85C grade and availability of the Y-qualified A3PE600-1FGG484IY variant support high-reliability procurement with traceability, which distributors such as FPGAX specifically provide for this MPN. With 270 I/Os and 350 MHz fabric performance, the device implements radiation-tolerant system wrappers, bus bridges (MIL-STD-1553-style framing, UART/SPI/parallel), and sensor aggregation. Designers should apply conservative timing derating at the standard speed grade, lock I/O assignments early due to VREF minibank constraints, and use Libero secure design flows to prevent design extraction from the programmed flash.
Recommended
Medical Instrumentation
Medical diagnostic and monitoring equipment benefits from the A3PE600-FGG484I's deterministic Instant On behavior and low-power flash fabric. Its 13,824 logic cells handle sensor front-end sequencing, ADC framing, and display-interface glue logic, while 270 I/Os connect analog front ends, isolation barriers, and communication modules (USB, Ethernet PHY, CAN). Because the device configures from internal flash, patient-facing instruments power up into a known-safe state without boot delays or configuration readback failures - valuable for devices cycling power between examinations. The green RoHS-compliant FBGA-484 package supports standard SMT assembly for medical contract manufacturers. Designers should partition noise-sensitive analog support logic away from clock domains using the fabric's modular floorplanning in Libero, and verify industrial temperature compliance for sterilization-adjacent operating environments.
Recommended
Secure Communication Bridges
The A3PE600-FGG484I is well suited to secure protocol bridges, translating between legacy fieldbuses and modern Ethernet or serial links at up to 350 MHz internal clock rates. Flash-based security is the headline fit: Microchip's ProASIC3E flash fabric resists bitstream readback and cloning, so proprietary bridge logic remains protected without an external security IC. The 600k-gate fabric accommodates dual MAC-like framing engines, FIFO structures in fabric registers, and CRC/parity engines, while 270 I/Os support wide parallel buses to host CPUs plus multiple serial PHYs. Because the design is nonvolatile and single-chip, boards can be conformally coated and sealed for harsh environments without exposing a configuration device. Apply conservative decoupling (multiple 0.1uF ceramics per I/O bank plus bulk capacitance) and review I/O minibank VREF assignments early, as voltage-referenced standards consume one pin per minibank.
Recommended
Test and Measurement Equipment
Bench and automated test instruments use the A3PE600-FGG484I as the digital backbone for trigger logic, pattern generation, and timing capture. The 350 MHz fabric performance and 13,824 VersaTiles implement high-resolution event counters and delay generators, while 270 I/Os drive multi-channel digital pins, relay matrices, and front-panel interfaces. Instant On flash configuration means instruments are ready the moment power is applied - important for rack systems switched by master power sequencing. Compared with SRAM FPGAs, the single-chip design simplifies calibration records since the logic image is fixed in flash and cannot be corrupted by a failed configuration load. Designers should exploit footprint compatibility to FG484 and FG256 family packages when planning cost-reduced variants, and allocate PLL resources for clock multiplication from a low-jitter reference oscillator.
Recommended
IoT Edge Gateways and Smart Sensors
Edge gateways benefit from the A3PE600-FGG484I's combination of low static power flash fabric, 270 flexible I/Os, and security-resistant configuration. The device aggregates multiple sensor buses (SPI, I2C-style, UART, parallel) into a single deterministic interface toward a host MCU or wireless module, pre-processing data in the 600k-gate fabric to offload the host. Instant On behavior enables battery-backed or energy-harvesting nodes to become operational immediately, and the single-chip nonvolatile design removes the boot-flash attack surface in deployed IoT hardware. The industrial temperature grade covers unconditioned outdoor enclosures. Power planning matters: budget the 1.5V core rail and use Libero power-analysis to exploit the fabric's low static draw, keeping gateways within passive-cooling thermal budgets in sealed enclosures.
Recommended
Recommended Products Summary
Engineering reference data for A3PE600-FGG484I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE600-2FGG484I | A3PE600-1FGG484IY | A3PE600-FG484I | A3PE600-1FGG484 |
|---|---|---|---|---|---|
| Package | FBGA-484 (23 x 23 mm, 1.0 mm pitch) | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| Logic Cells / CLBs | 13,824 | 13,824 | 13,824 | 13,824 | 13,824 |
| Speed Grade | Standard | -2 (faster) | -1 | Standard | -1 |
| User I/Os | 270 | 270 | 270 | 270 | 270 |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | Commercial [DATA_NEEDED: exact range] |
| Configuration Technology | On-chip flash (Instant On) | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
| Lead Finish | Lead-free (FGG, green) | Lead-free (FGG) | Lead-free (FGG) | Standard (FG) [DATA_NEEDED: exact finish] | Lead-free (FGG) |
Key Differentiators
- Instant On nonvolatile flash configuration (vs SRAM-based FPGAs (e.g., external-config parts))
- Faster timing margin available without PCB change (vs A3PE600-FG484I (standard grade))
- High-reliability procurement path (vs A3PE600-FGG484 (commercial temp))
Design Notes
For the FBGA-484 (1.0 mm pitch, 23 x 23 mm), plan a via-in-pad or dog-bone escape strategy on 4+ layer stackups; 0.5 mm via capture pads with 0.25 mm microvias keep inner routing channels open. Reserve one I/O per minibank as VREF when using voltage-referenced standards, as the ProASIC3E datasheet requires. Verify the ball map against the datasheet tables (document 50003270B) rather than third-party summaries before releasing the footprint.
Budget three rails: 1.5V core, plus I/O bank voltages (typically 3.3V/2.5V). Estimated decoupling: at least one 0.1uF ceramic per supply ball pair plus 10uF bulk per rail and 47uF bulk at the regulator. Estimated: core current scales with toggle rate and utilized CLBs; use Microchip Libero power analysis with your actual design utilization (600k gates / 13,824 CLBs) to size the 1.5V regulator rather than assuming worst-case datasheet values.
Do not mix speed grades in a single design without re-running timing in Libero: substituting the slower standard grade for an -2 build invalidates prior timing closure. Also confirm the temperature suffix on incoming parts - FGG484 (commercial) and FGG484I (industrial, -40C to +85C) share a footprint but not the environmental rating, and the FG vs FGG prefix changes lead finish for compliance documentation.
With 270 user I/Os at up to hundreds of MHz edge rates, group fast-switching outputs away from clock-capable balls and use the fabric drive-strength and slew settings in Libero to limit simultaneous switching noise. Maintain a continuous ground reference plane under the BGA and series-terminate long single-ended traces (estimated 22-33 ohm typical starting point, verify per IBIS simulation).
Compliance Information
Jotrin lists the package as GREEN FBGA-484; FGG suffix denotes lead-free ball finish per Microchip naming. REACH, halogen-free, and conflict-minerals status not stated in provided data.
