A42MX09-3TQG176 - MX FPGA 14K Gates 176-TQFP | Microchip
N.º de pieza: A42MX09-3TQG176 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $45.5 | $45,50 |
| 10 | $41.2 | $412,00 |
| 100 | $37.8 | $3.780,00 |
| 500 | $34.9 | $17.450,00 |
| 1.000 | $32.1 | $32.100,00 |
A42MX09-3TQG176 Descripción general
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks and programmable interconnects that engineers configure to implement custom digital circuits. The MX family differs from SRAM FPGAs by using antifuse programming technology: configuration data is permanently burned into the device, making it non-volatile, instantly ready at power-up, and inherently more resistant to configuration readback attacks.
Key features include the flexible 5.0V-tolerant MX architecture, single-chip ASIC alternative positioning for high-volume integration of legacy PLD designs, and speed grade 3 performance (177 MHz/296 MHz toggle rates per family data). The antifuse fabric requires no external configuration ROM, reducing board cost and improving reliability versus SRAM-based alternatives.
Manufactured on a 0.45 um CMOS process, the MX architecture organizes logic into segmented routing channels optimized for moderate-density glue logic, state machines, bus interfacing, and legacy design consolidation. The device is programmed once via standard Microchip (Actel) programmers and cannot be reconfigured, which guarantees deterministic power-up behavior.
Typical applications include legacy PLD consolidation, industrial control, defense/aerospace upgrade programs where 5V compatibility matters, and high-volume cost-sensitive logic integration.
Design consideration: because antifuse devices are one-time programmable, verify the design thoroughly in simulation and, if possible, in a lower-cost engineering sample before committing to production programming; the 10-week manufacturer lead time (as of 2026-08-30) also demands careful supply planning.
Alternativas directas para A42MX09-3TQG176 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con A42MX09-3TQG176 (mismo factor de forma y huella) — difiere en Package, Family, Speed Grade, System Gates, Process Technology.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
A42MX16-2TQG176
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$28.4 / unidad
Ver hoja de datos →A42MX09-TQG176A
✅ Sustitución directa✓ En stock
$32.1 / unidad
Ver hoja de datos →A42MX09-TQG176M
✅ Sustitución directa✓ En stock
$58.75 / unidad
Ver hoja de datos →A42MX09-2TQG176
✅ Sustitución directa✓ En stock
$27.5 / unidad
Ver hoja de datos →A42MX24-TQG176
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$28.4 / unidad
Ver hoja de datos →A42MX09-3TQG176 Valores máximos y características eléctricas
| Family | MX (Actel/Microsemi antifuse FPGA) |
| System Gates | 14000 |
| Equivalent Gates | Approx. 9000 |
| Logic Blocks (CLBs) | 684 |
| Number of I/O | 104 |
| Supply Voltage (core) | 3 V to 3.6 V |
| Supply Voltage (I/O) | 4.75 V to 5.25 V |
| Temperatura de funcionamiento | 0C to +70C (TA) |
| Encapsulado | 176-TQFP (24x24 mm), 0.5 mm pitch |
| Tipo de montaje | Surface Mount |
| Speed Grade | 3 |
| Process Technology | 0.45 um CMOS |
| Programming Technology | Antifuse (one-time programmable) |
| Packaging | Tray |
| Estado RoHS | ROHS3 Compliant |
| Product Status | Active |
| Manufacturer Lead Time | 10 weeks |
Configuración de pines de A42MX09-3TQG176
| Pin 1-176 | User I/O / Power / GND — The A42MX09 TQG176 pinout provides 104 user I/O pins distributed across the 176-terminal LFQFP, with dedicated VCCA (core 3.3V), VCCI (I/O 5V), GND, and programming pins. Exact pin-number-to-function assignment is defined in the MX FPGA family datasheet package section - [DATA_NEEDED: per-pin assignment table] |
Aplicaciones típicas
A42MX09-3TQG176 es adecuado para 6 aplicacións: Legacy PLD Consolidation, 5V Industrial Control Systems, Defense and Aerospace System Upgrades, Bus Interface and Glue Logic, ASIC Prototyping and Bridge-to-ASIC, Cost-Sensitive High-Volume Logic Integration.
Legacy PLD Consolidation
The A42MX09-3TQG176 is purpose-built for integrating multiple legacy PLDs, GALs, and small CPLDs into a single low-cost antifuse FPGA. Its 14,000 system gates and 684 CLBs provide ample capacity for aggregating decades-old 22V10-class devices, while 5V-tolerant I/O eliminates level shifters when interfacing with original TTL-era circuitry. Because the antifuse fabric is non-volatile and requires no configuration ROM, the consolidated design powers up instantly, preserving original system boot behavior - a critical requirement when re-qualifying legacy industrial or defense equipment with minimal board changes.
Recomendado
5V Industrial Control Systems
Industrial controllers, motor drive boards, and PLC I/O modules built around 5V logic benefit directly from the MX family's dual-rail architecture: 4.75V-5.25V on I/O banks and 3V-3.6V for the core. The 104 user I/Os of the A42MX09-3TQG176 handle wide parallel buses, encoder interfaces, and relay control logic at TTL levels. Its 0C to +70C rating suits factory-floor environments, and the antifuse fabric is immune to configuration upsets from noisy industrial power, unlike SRAM FPGAs that can lose configuration during brownouts. The 176-TQFP 0.5 mm pitch supports standard SMT assembly.
Recomendado
Defense and Aerospace System Upgrades
Antifuse FPGAs are historically favored in defense programs because their programmed state cannot be read back and survives radiation-induced configuration upsets better than SRAM cells. The A42MX09-3TQG176 fits retrofit and life-extension programs where original Actel MX parts must be resourced. The M-suffix variant A42MX09-TQG176M offers military-screened equivalents for programs requiring extended screening. Instant-on, single-chip operation simplifies certification of upgraded subsystems, and the deterministic power-up avoids the sequencing complexity SRAM FPGAs impose on safety-critical power architectures.
Recomendado
Bus Interface and Glue Logic
The MX architecture's segmented routing and combinational-friendly CLBs make the A42MX09-3TQG176 efficient for address decoding, bus bridging, wait-state generation, and peripheral handshaking in microprocessor systems. Speed grade 3 supports toggle rates in the 177-296 MHz range at the fabric level, sufficient for legacy microprocessor bus timing. With 104 bidirectional I/Os, it can bridge an 8-bit or 16-bit host bus to multiple peripherals while implementing interrupts and DMA handshake logic, replacing dozens of 74-series devices and reducing board area and BOM line items substantially.
Recomendado
ASIC Prototyping and Bridge-to-ASIC
Microchip positions the MX family as a reliable single-chip ASIC alternative for high volumes. Designs can be prototyped on larger MX devices and mapped onto the A42MX09-3TQG176 for volume production, avoiding ASIC NRE costs at moderate volumes. The antifuse one-time-programmable fabric also serves as a secure fixed-function bridge in front of ASICs or processors, implementing bus conversion, chip-select logic, and power sequencing control. Because configuration is permanent, production units behave identically to validated engineering samples - a meaningful advantage over SRAM FPGA supply chains with varying bitstream sources.
Recomendado
Cost-Sensitive High-Volume Logic Integration
At 14,000 gates, the A42MX09-3TQG176 targets designs where per-unit cost dominates: consumer appliance control, metering front ends, and telecommunications line cards built on legacy platforms. The antifuse approach removes the cost of an external configuration flash device and the boot-time delay, and tray packaging suits contract manufacturing pick-and-place lines. Availability across six distributors (per Octopart data as of 2026-08-30) with an active lifecycle status mitigates end-of-life risk for long-lived products, though the 10-week factory lead time encourages safety-stock planning for continuous production.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para A42MX09-3TQG176 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | A42MX16-2TQG176 | A42MX09-TQG176A | A42MX09-2TQG176 | A42MX24-TQG176 |
|---|---|---|---|---|---|
| Package | 176-TQFP (24x24 mm) | 176-TQFP (24x24 mm) - same | 176-TQFP (24x24 mm) - same | 176-TQFP (24x24 mm) - same | 176-TQFP (24x24 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 14,000 | 24,000 | 14,000 | 14,000 | 36,000 |
| User I/O | 104 | 132 | 104 | 104 | 140 |
| Speed Grade | 3 (fastest) | 2 | A grade | 2 | Standard |
| Supply Voltage | 3V-3.6V core / 4.75V-5.25V I/O | 3V-3.6V core / 4.75V-5.25V I/O | 3V-3.6V core / 4.75V-5.25V I/O | 3V-3.6V core / 4.75V-5.25V I/O | 3V-3.6V core / 4.75V-5.25V I/O |
| Programming Technology | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) |
Diferenciadores clave
- Fastest speed grade in MX09 TQG176 family (frente a A42MX09-2TQG176)
- Lower cost at same footprint (frente a A42MX16-2TQG176)
- Commercial temperature screening for cost-optimized builds (frente a A42MX09-TQG176M)
Notas de diseño
The A42MX09-3TQG176 requires dual supply rails: 3V-3.6V for the core (VCCA) and 4.75V-5.25V for I/O (VCCI). Decouple each supply pin with 0.1uF ceramic capacitors placed within 2 mm of the pin, plus bulk 10uF per rail. Power-up sequencing requirements are relaxed compared to SRAM FPGAs, but verify the exact rail order in the MX datasheet power section before finalizing the regulator design.
Antifuse devices are one-time programmable - a configuration error renders the device scrap. Complete full timing simulation with Libero/Microchip tools and reserve budget for engineering samples before production programming. Also note the 10-week manufacturer lead time: maintain safety stock or order ahead of the production schedule to avoid line-down situations.
The 176-TQFP has a 0.5 mm pitch requiring solder-mask-defined pads per the datasheet land pattern (typically 0.5 mm pitch, 0.3 mm pad width). Use a no-clean or water-wash flux profile and inspect with AOI or X-ray for bridging on the fine-pitch perimeter. Thermal relief is generally adequate for this logic density, but connect the exposed ground fingering to a solid ground plane for signal integrity.
Información de cumplimiento
ROHS3 Compliant per Microchip USA and distributor data. Lead-free per PCB Electronics listing. REACH/halogen status not stated in provided data.
