A42MX09-3TQG176 - MX FPGA 14K Gates 176-TQFP | Microchip
MPN: A42MX09-3TQG176 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $45.5 | $45.50 |
| 10 | $41.2 | $412.00 |
| 100 | $37.8 | $3,780.00 |
| 500 | $34.9 | $17,450.00 |
| 1,000 | $32.1 | $32,100.00 |
Drop-in alternatives for A42MX09-3TQG176 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A42MX16-2TQG176
✅ Drop-In✓ In Stock
$28.4 / Unit
View Datasheet →A42MX09-TQG176A
✅ Drop-In✓ In Stock
$32.1 / Unit
View Datasheet →A42MX09-TQG176M
✅ Drop-In✓ In Stock
$58.75 / Unit
View Datasheet →A42MX09-2TQG176
✅ Drop-In✓ In Stock
$27.5 / Unit
View Datasheet →A42MX24-TQG176
✅ Drop-In✓ In Stock
$28.4 / Unit
View Datasheet →A42MX09-3TQG176 Maximum Ratings & Electrical Characteristics
| Family | MX (Actel/Microsemi antifuse FPGA) |
| System Gates | 14000 |
| Equivalent Gates | Approx. 9000 |
| Logic Blocks (CLBs) | 684 |
| Number of I/O | 104 |
| Supply Voltage (core) | 3 V to 3.6 V |
| Supply Voltage (I/O) | 4.75 V to 5.25 V |
| Operating Temperature | 0C to +70C (TA) |
| Package | 176-TQFP (24x24 mm), 0.5 mm pitch |
| Mounting Type | Surface Mount |
| Speed Grade | 3 |
| Process Technology | 0.45 um CMOS |
| Programming Technology | Antifuse (one-time programmable) |
| Packaging | Tray |
| RoHS Status | ROHS3 Compliant |
| Product Status | Active |
| Manufacturer Lead Time | 10 weeks |
A42MX09-3TQG176 Pin Configuration
| Pin 1-176 | User I/O / Power / GND — The A42MX09 TQG176 pinout provides 104 user I/O pins distributed across the 176-terminal LFQFP, with dedicated VCCA (core 3.3V), VCCI (I/O 5V), GND, and programming pins. Exact pin-number-to-function assignment is defined in the MX FPGA family datasheet package section - [DATA_NEEDED: per-pin assignment table] |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A42MX09-3TQG176 is suitable for 6 applications: Legacy PLD Consolidation, 5V Industrial Control Systems, Defense and Aerospace System Upgrades, Bus Interface and Glue Logic, ASIC Prototyping and Bridge-to-ASIC, Cost-Sensitive High-Volume Logic Integration.
Legacy PLD Consolidation
The A42MX09-3TQG176 is purpose-built for integrating multiple legacy PLDs, GALs, and small CPLDs into a single low-cost antifuse FPGA. Its 14,000 system gates and 684 CLBs provide ample capacity for aggregating decades-old 22V10-class devices, while 5V-tolerant I/O eliminates level shifters when interfacing with original TTL-era circuitry. Because the antifuse fabric is non-volatile and requires no configuration ROM, the consolidated design powers up instantly, preserving original system boot behavior - a critical requirement when re-qualifying legacy industrial or defense equipment with minimal board changes.
Recommended
5V Industrial Control Systems
Industrial controllers, motor drive boards, and PLC I/O modules built around 5V logic benefit directly from the MX family's dual-rail architecture: 4.75V-5.25V on I/O banks and 3V-3.6V for the core. The 104 user I/Os of the A42MX09-3TQG176 handle wide parallel buses, encoder interfaces, and relay control logic at TTL levels. Its 0C to +70C rating suits factory-floor environments, and the antifuse fabric is immune to configuration upsets from noisy industrial power, unlike SRAM FPGAs that can lose configuration during brownouts. The 176-TQFP 0.5 mm pitch supports standard SMT assembly.
Recommended
Defense and Aerospace System Upgrades
Antifuse FPGAs are historically favored in defense programs because their programmed state cannot be read back and survives radiation-induced configuration upsets better than SRAM cells. The A42MX09-3TQG176 fits retrofit and life-extension programs where original Actel MX parts must be resourced. The M-suffix variant A42MX09-TQG176M offers military-screened equivalents for programs requiring extended screening. Instant-on, single-chip operation simplifies certification of upgraded subsystems, and the deterministic power-up avoids the sequencing complexity SRAM FPGAs impose on safety-critical power architectures.
Recommended
Bus Interface and Glue Logic
The MX architecture's segmented routing and combinational-friendly CLBs make the A42MX09-3TQG176 efficient for address decoding, bus bridging, wait-state generation, and peripheral handshaking in microprocessor systems. Speed grade 3 supports toggle rates in the 177-296 MHz range at the fabric level, sufficient for legacy microprocessor bus timing. With 104 bidirectional I/Os, it can bridge an 8-bit or 16-bit host bus to multiple peripherals while implementing interrupts and DMA handshake logic, replacing dozens of 74-series devices and reducing board area and BOM line items substantially.
Recommended
ASIC Prototyping and Bridge-to-ASIC
Microchip positions the MX family as a reliable single-chip ASIC alternative for high volumes. Designs can be prototyped on larger MX devices and mapped onto the A42MX09-3TQG176 for volume production, avoiding ASIC NRE costs at moderate volumes. The antifuse one-time-programmable fabric also serves as a secure fixed-function bridge in front of ASICs or processors, implementing bus conversion, chip-select logic, and power sequencing control. Because configuration is permanent, production units behave identically to validated engineering samples - a meaningful advantage over SRAM FPGA supply chains with varying bitstream sources.
Recommended
Cost-Sensitive High-Volume Logic Integration
At 14,000 gates, the A42MX09-3TQG176 targets designs where per-unit cost dominates: consumer appliance control, metering front ends, and telecommunications line cards built on legacy platforms. The antifuse approach removes the cost of an external configuration flash device and the boot-time delay, and tray packaging suits contract manufacturing pick-and-place lines. Availability across six distributors (per Octopart data as of 2026-08-30) with an active lifecycle status mitigates end-of-life risk for long-lived products, though the 10-week factory lead time encourages safety-stock planning for continuous production.
Recommended
Recommended Products Summary
Engineering reference data for A42MX09-3TQG176 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A42MX16-2TQG176 | A42MX09-TQG176A | A42MX09-2TQG176 | A42MX24-TQG176 |
|---|---|---|---|---|---|
| Package | 176-TQFP (24x24 mm) | 176-TQFP (24x24 mm) - same | 176-TQFP (24x24 mm) - same | 176-TQFP (24x24 mm) - same | 176-TQFP (24x24 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 14,000 | 24,000 | 14,000 | 14,000 | 36,000 |
| User I/O | 104 | 132 | 104 | 104 | 140 |
| Speed Grade | 3 (fastest) | 2 | A grade | 2 | Standard |
| Supply Voltage | 3V-3.6V core / 4.75V-5.25V I/O | 3V-3.6V core / 4.75V-5.25V I/O | 3V-3.6V core / 4.75V-5.25V I/O | 3V-3.6V core / 4.75V-5.25V I/O | 3V-3.6V core / 4.75V-5.25V I/O |
| Operating Temperature | 0C to +70C | [DATA_NEEDED] | [DATA_NEEDED] | 0C to +70C | [DATA_NEEDED] |
| Programming Technology | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) |
Key Differentiators
- Fastest speed grade in MX09 TQG176 family (vs A42MX09-2TQG176)
- Lower cost at same footprint (vs A42MX16-2TQG176)
- Commercial temperature screening for cost-optimized builds (vs A42MX09-TQG176M)
Design Notes
The A42MX09-3TQG176 requires dual supply rails: 3V-3.6V for the core (VCCA) and 4.75V-5.25V for I/O (VCCI). Decouple each supply pin with 0.1uF ceramic capacitors placed within 2 mm of the pin, plus bulk 10uF per rail. Power-up sequencing requirements are relaxed compared to SRAM FPGAs, but verify the exact rail order in the MX datasheet power section before finalizing the regulator design.
Antifuse devices are one-time programmable - a configuration error renders the device scrap. Complete full timing simulation with Libero/Microchip tools and reserve budget for engineering samples before production programming. Also note the 10-week manufacturer lead time: maintain safety stock or order ahead of the production schedule to avoid line-down situations.
The 176-TQFP has a 0.5 mm pitch requiring solder-mask-defined pads per the datasheet land pattern (typically 0.5 mm pitch, 0.3 mm pad width). Use a no-clean or water-wash flux profile and inspect with AOI or X-ray for bridging on the fine-pitch perimeter. Thermal relief is generally adequate for this logic density, but connect the exposed ground fingering to a solid ground plane for signal integrity.
Compliance Information
ROHS3 Compliant per Microchip USA and distributor data. Lead-free per PCB Electronics listing. REACH/halogen status not stated in provided data.
