ATSAM4SD32BA-AUR - 120MHz Cortex-M4 MCU, 2MB Flash, 64-LQFP | Microchip
N.º de pieza: ATSAM4SD32BA-AUR ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $10.84 | $10,84 |
| 10 | $9.85 | $98,50 |
| 100 | $8.91 | $891,00 |
| 500 | $8.12 | $4.060,00 |
| 1.000 | $7.4 | $7.400,00 |
| 2.500 | $6.78 | $16.950,00 |
ATSAM4SD32BA-AUR Descripción general
A microcontroller (MCU) is an integrated circuit that combines a CPU core, program memory (Flash), working memory (SRAM), and configurable peripherals on a single die, providing a self-contained compute platform for embedded systems. ARM Cortex-M4 MCUs extend this with DSP instructions and optional single-precision FPU, positioning the family between classic Cortex-M3 controllers and Cortex-M7 application processors. The SAM4S series specifically targets industrial and consumer designs that need high code density, generous RAM, and USB connectivity without requiring an external MPU.
Key features include 2 MB Flash (2M x 8) for application and bootloader storage, 160 KB SRAM split into 128 KB general-purpose plus 32 KB tightly-coupled, and a flexible 8-channel DMA controller with descriptor-based transfers. The integrated High-speed USB 2.0 device port with on-chip transceiver eliminates external PHY cost, while two CAN controllers and one Ethernet MAC (GMII-capable via MII/RMII) make the part suitable for connected industrial nodes. Hardware cryptographic acceleration is not present, but the Cortex-M4F core executes AES/SHA software routines efficiently.
Architecture-wise, the ATSAM4SD32BA-AUR uses Atmel/Microchip's SAM4S pipeline with a 5-stage Cortex-M4 core running up to 120 MHz core / 150 MHz peripheral bus. The embedded Flash uses 128-bit-wide prefetch buffers with ECC-free storage for high throughput. The 1.2V internal core regulator is paired with brown-out detectors and a 12-bit windowed watchdog for functional-safety class B/C designs when used with Microchip's ASF software framework.
Typical applications include industrial PLC I/O modules, USB-connected data loggers, point-of-sale terminals, CAN-gateway motor-control front-ends, and consumer white-goods HMI panels. Compared with smaller SAM4S siblings, the 2 MB Flash variant supports full embedded GUIs and over-the-air (OTA) bootloader schemes that require dual-bank storage. The LQFP-64 footprint is shared with most SAM4S/4SD parts, simplifying PCB layout when migrating memory options.
When designing with this part, budget adequate decoupling on each VDDCORE/VDDIO pair, follow the 64-LQFP thermal pad layout recommendation, and review the bootloader section of the datasheet to leverage the SAM-BA ROM monitor for field upgrades. For absolute lowest BOM, designs must respect the 1.2V internal regulator decoupling requirement of at least 4.7 uF X7R on VDDOUT and a 0.1 uF on each VDDCORE pin.
This page synthesizes distributor pricing, pin-compatible SAM4S family drop-ins, USB-equipped application companions, and practical EMC/ESD layout notes not consolidated in the manufacturer datasheet PDF.
Alternativas directas para ATSAM4SD32BA-AUR — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con ATSAM4SD32BA-AUR (mismo factor de forma y huella) — difiere en Package, Core, USB, ADC, CAN.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
ATSAM4SD32BA-AU
✅ Sustitución directa✓ En stock
$9.45 / unidad
Ver hoja de datos →ATSAM4SD32BB-AUR
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
ATSAM4SD32BA-ANR
✅ Sustitución directa✓ En stock
$6.72 / unidad
Ver hoja de datos →ATSAM4S16BA-AU
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
ATSAM4SA16BA-AUR
✅ Sustitución directa✓ En stock
$5.45 / unidad
Ver hoja de datos →ATSAM4SD32BA-AUR Valores máximos y características eléctricas
| Manufacturer | Microchip Technology (Atmel) |
| Series | SAM4S (SAM4SD32 sub-family) |
| Core | ARM Cortex-M4F (32-bit, single-precision FPU) |
| Core Frequency (max) | 120 MHz |
| Program Memory | 2 MB Flash (2M x 8) |
| SRAM | 160 KB (128 KB general + 32 KB tightly-coupled) |
| Operating Voltage (VDD) | 1.62 V to 3.6 V |
| Core Voltage (VDDOUT) | 1.2 V (internal LDO) |
| Temperatura de funcionamiento | -40 C to +85 C (industrial) |
| Encapsulado | 64-LQFP, 10x10 mm, 0.5 mm pitch |
| Tipo de montaje | Surface Mount |
| I/O Pins | 47 (multi-function multiplexed) |
| USB | USB 2.0 High-Speed Device/Host/OTG, on-chip transceiver |
| ADC | 8-channel, 10-bit, 1 MSPS |
| DAC | 2-channel, 12-bit |
| Timer/Counter | TC block 0/1 (six 16-bit channels), PWM, 32-bit RTT |
| Communication | 5x USART, 3x UART, 2x TWI (I2C), 3x SPI, 1x HS-SPI, 2x CAN, EMAC, HS-USB |
| DMA | 8-channel peripheral DMA (PDC) + 8-channel central DMA |
| RoHS / REACH | Compliant (Pb-free LQFP) |
| Nivel MSL | MSL3 (per JEDEC J-STD-020) |
Configuración de pines de ATSAM4SD32BA-AUR
| Pin 1 | PB0/AD0 — GPIO PB0, ADC input channel 0 |
| Pin 2 | PB1/AD1 — GPIO PB1, ADC input channel 1 |
| Pin 3 | PB2/AD2 — GPIO PB2, ADC input channel 2 |
| Pin 4 | PB3/AD3 — GPIO PB3, ADC input channel 3 |
| Pin 5 | VDDOUT — 1.2V internal regulator output; 4.7uF bulk + 0.1uF decoupling required |
| Pin 6 | VDDIN — Voltage regulator input; tie to VDDIO externally |
| Pin 7 | VDDIO — I/O supply, 1.62V to 3.6V |
| Pin 8 | GNDCORE — Core ground return |
| Pin 9 | PA0/AD4 — GPIO PA0, ADC input channel 4, peripheral I/O |
| Pin 10 | PA1/AD5 — GPIO PA1, ADC input channel 5 |
| Pin 11 | PA2/AD6 — GPIO PA2, ADC input channel 6 |
| Pin 12 | PA3/AD7 — GPIO PA3, ADC input channel 7, DAC0 reference |
| Pin 13 | PA4 — GPIO PA4, peripheral I/O |
| Pin 14 | PA5 — GPIO PA5, peripheral I/O |
| Pin 15 | PA6 — GPIO PA6, peripheral I/O |
| Pin 16 | PA7 — GPIO PA7, peripheral I/O |
| Pin 17 | PA8 — GPIO PA8, peripheral I/O |
| Pin 18 | PA9 — GPIO PA9, peripheral I/O |
| Pin 19 | PA10 — GPIO PA10, peripheral I/O |
| Pin 20 | PA11 — GPIO PA11, peripheral I/O |
| Pin 21 | PA12 — GPIO PA12, peripheral I/O |
| Pin 22 | PA13 — GPIO PA13, peripheral I/O |
| Pin 23 | PA14 — GPIO PA14, peripheral I/O |
| Pin 24 | PA15 — GPIO PA15, peripheral I/O |
| Pin 25 | GND — I/O ground |
| Pin 26 | PA16 — GPIO PA16, peripheral I/O |
| Pin 27 | PA17 — GPIO PA17, peripheral I/O |
| Pin 28 | PA18 — GPIO PA18, peripheral I/O |
| Pin 29 | PA19 — GPIO PA19, peripheral I/O |
| Pin 30 | PA20 — GPIO PA20, peripheral I/O |
| Pin 31 | PA21/HDMA — GPIO PA21, HS-USB data minus (DM) |
| Pin 32 | PA22/HDP — GPIO PA22, HS-USB data plus (DP) |
| Pin 33 | VDDIO — I/O supply, 1.62V to 3.6V |
| Pin 34 | VBG — Bandgap reference; 0.1uF decoupling to GND |
| Pin 35 | PA23 — GPIO PA23, peripheral I/O |
| Pin 36 | PA24 — GPIO PA24, peripheral I/O |
| Pin 37 | PA25 — GPIO PA25, peripheral I/O |
| Pin 38 | PA26 — GPIO PA26, peripheral I/O |
| Pin 39 | PA27 — GPIO PA27, peripheral I/O |
| Pin 40 | PA28 — GPIO PA28, peripheral I/O |
| Pin 41 | PA29 — GPIO PA29, peripheral I/O |
| Pin 42 | PA30 — GPIO PA30, peripheral I/O |
| Pin 43 | PA31 — GPIO PA31, peripheral I/O |
| Pin 44 | PB4 — GPIO PB4, peripheral I/O |
| Pin 45 | PB5 — GPIO PB5, peripheral I/O |
| Pin 46 | PB6 — GPIO PB6, peripheral I/O |
| Pin 47 | PB7 — GPIO PB7, peripheral I/O |
| Pin 48 | PB8 — GPIO PB8, peripheral I/O |
| Pin 49 | PB9 — GPIO PB9, peripheral I/O |
| Pin 50 | PB10 — GPIO PB10, peripheral I/O |
| Pin 51 | PB11 — GPIO PB11, peripheral I/O |
| Pin 52 | PB12 — GPIO PB12, peripheral I/O |
| Pin 53 | PB13 — GPIO PB13, peripheral I/O |
| Pin 54 | PB14 — GPIO PB14, peripheral I/O |
| Pin 55 | PB15/ERASE — GPIO PB15, ERASE pin for SAM-BA ROM bootloader |
| Pin 56 | NRST — Active-low reset input; 100k pullup + 10nF to GND |
| Pin 57 | TST — Test mode pin; tie to GND for normal operation |
| Pin 58 | FWUP — Firmware update wake-up; tie to GND if unused |
| Pin 59 | XIN — Crystal oscillator input (3-20 MHz) or external clock input |
| Pin 60 | XOUT — Crystal oscillator output |
| Pin 61 | GNDPLL — PLL ground return |
| Pin 62 | VDDPLL — PLL supply; tie to VDDOUT via ferrite bead |
| Pin 63 | VDDIO — I/O supply, 1.62V to 3.6V |
| Pin 64 | GND — I/O ground |
Aplicaciones típicas
ATSAM4SD32BA-AUR es adecuado para 8 aplicacións: Industrial CAN-bridge / Gateway, USB Data Logger / Streaming Sensor Node, Point-of-Sale Terminal Controller, Motor Control Front-End (BLDC / FOC), Smart Home Sensor Hub / IoT Gateway, HMI Touch Controller / White Goods Panel, Medical Patient-Monitor Auxiliary Processor, Audio Mixer / USB Digital Audio Bridge.
Industrial CAN-bridge / Gateway
The ATSAM4SD32BA-AUR is a strong fit for industrial CAN-to-Ethernet/CAN-to-USB gateway nodes where its dual CAN 2.0B controllers and on-chip HS-USB OTG simplify protocol conversion without external bridges. With 120 MHz Cortex-M4F and 160 KB SRAM the part runs a full CANopen or J1939 stack plus lwIP TCP/IP simultaneously, while the 2 MB Flash hosts the gateway firmware, web UI, and a SAM-BA OTA bootloader for field updates. The -40C to +85C industrial temperature range covers factory-floor deployments, and the 64-LQFP package survives high-vibration mounting. Per the SAM4S datasheet, both CAN controllers share 256 mailboxes with timestamping for deterministic bridge latency.
Recomendado
USB Data Logger / Streaming Sensor Node
The ATSAM4SD32BA-AUR's integrated USB 2.0 High-Speed Device port with on-chip transceiver makes it a drop-in choice for tethered data loggers that stream ADC samples at >1 MSPS over USB. The 8-channel 10-bit ADC and two 12-bit DAC outputs cover most industrial-sensor chains, and 160 KB SRAM buffers multi-kilohertz sample streams before DMA-to-USB transfer. Designers can implement USB CDC + vendor-class HID composite devices using the Microchip ASF stack, and the 2 MB Flash holds firmware plus configuration profiles. The HS-USB port supplies bus power and data in one connector, reducing enclosure cost.
Recomendado
Point-of-Sale Terminal Controller
The ATSAM4SD32BA-AUR suits POS terminal designs where 2 MB Flash is needed to host an embedded Linux-equivalent RTOS GUI plus application logic, while USB Host mode supports barcode scanners and HID peripherals. The Cortex-M4F core executes AES encryption routines in software to secure PIN pad traffic, and the EMAC interface can drive a MagTek encrypted head via SPI. The 64-LQFP footprint keeps board cost low and supports hand-rework for serviceability. Per the SAM4S datasheet, the chip's wide 1.62-3.6V supply tolerates 5V-tolerant GPIO mixed-mode signal paths common in legacy POS peripherals.
Recomendado
Motor Control Front-End (BLDC / FOC)
The ATSAM4SD32BA-AUR's Cortex-M4F core with single-precision FPU executes field-oriented-control (FOC) algorithms for BLDC and PMSM motors up to several kHz loop rates. Its 8-channel 10-bit ADC samples three-phase shunt currents simultaneously via the central DMA, while PWM outputs from timer/counter block 0 generate the complementary 6-step pattern with hardware dead-time insertion. 160 KB SRAM is sufficient for a complete FOC library including Park/Clarke transforms and SVPWM. The 2 MB Flash hosts multiple motor profiles (e.g., compressor, fan, pump) selectable at runtime.
Recomendado
Smart Home Sensor Hub / IoT Gateway
The ATSAM4SD32BA-AUR integrates USB, dual CAN, Ethernet MAC, I2C, SPI, and UART in a single 64-LQFP chip, making it ideal for smart-home gateways that aggregate Zigbee/Bluetooth/Thread radios over UART or SPI and publish to the cloud via Ethernet or Wi-Fi. The 120 MHz core runs MQTT-SN bridges comfortably with TLS 1.2 software stacks, and 160 KB SRAM accommodates TLS handshakes plus packet buffers. The 2 MB Flash stores a full RTOS plus encrypted credential vault, while the SAM-BA USB bootloader enables low-cost field provisioning.
Recomendado
HMI Touch Controller / White Goods Panel
The ATSAM4SD32BA-AUR drives small TFT HMI panels up to 320x240 with resistive or capacitive touch controllers connected via SPI, while its 2 MB Flash stores GUI bitmaps and 160 KB SRAM doubles as the framebuffer when using parallel 8080/6800 LCD interface. The Cortex-M4F executes emWin/MVGL graphical libraries efficiently, and the on-chip 12-bit DAC generates beeper tones for touch feedback. The 64-LQFP package survives the high-temperature environment inside dishwasher or oven front panels, supported by the -40C to +85C industrial rating.
Recomendado
Medical Patient-Monitor Auxiliary Processor
The ATSAM4SD32BA-AUR's DSP-extended Cortex-M4F efficiently runs DSP filter chains on multi-kHz biosignal streams (ECG, SpO2, respiration) when used as an auxiliary front-end to a higher-end application processor. The 8-channel ADC captures synchronized lead data while DMA-to-USB streams to the host. The 2 MB Flash stores firmware plus clinical algorithm libraries, and the industrial temperature rating meets IEC 60601-1 collateral temperature requirements for bedside equipment. Note: this part is NOT IEC 60601-1-8 certified by Microchip and requires the integrator to validate the full system compliance.
Recomendado
Audio Mixer / USB Digital Audio Bridge
The ATSAM4SD32BA-AUR's HS-USB port supports USB Audio Class 1.0 device mode for up to 96 kHz stereo streaming into an I2S codec, while the Cortex-M4F applies 32-bit digital mixing and EQ effects with no audible artifacts. The 2 MB Flash stores preset banks, and 160 KB SRAM acts as a delay/ring-buffer for live effects. Three SPI ports support external DAC/ADC codecs, and two I2S TDM slots can drive multiple channels simultaneously. The 64-LQFP footprint fits compact desktop audio interfaces.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para ATSAM4SD32BA-AUR — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | ATSAM4SD32BA-AU | ATSAM4SD32BB-AUR | ATSAM4SD32BA-ANR | ATSAM4S16BA-AU | ATSAM4SA16BA-AU |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-LQFP (10x10) | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same |
| Core Frequency | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB | 1 MB |
| SRAM | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB | 80 KB |
| USB 2.0 HS OTG | Yes | Yes | Yes | Yes | Yes | No (FS only) |
| Packaging Form | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tray | Tray |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Diferenciadores clave
- Highest-density Flash option in the SAM4S LQFP-64 family (frente a ATSAM4S16BA-AU)
- Revision B silicon offers better ESD immunity (frente a ATSAM4SD32BA-AUR (Rev A vs Rev B))
- Full 160 KB SRAM vs reduced 80 KB (frente a ATSAM4SA16BA-AU)
- Built-in USB 2.0 High-Speed OTG with on-chip PHY (frente a ATSAM4SA16BA-AU)
- Tape-and-reel packaging enables SMT line assembly (frente a ATSAM4SD32BA-AU)
Notas de diseño
Place a 4.7 uF X7R ceramic plus a 0.1 uF X7R ceramic on VDDOUT (pin 5) within 5 mm of the pin. VDDIN (pin 6) must be tied to the same 3.3V rail as VDDIO with a 10 ohm ferrite bead for noise isolation per the SAM4S reference schematic. Each VDDCORE/VDDIO pair requires its own 0.1 uF decoupling cap placed as close to the pin as possible. Estimated: at 120 MHz CPU active, IDDCORE ~70 mA and IDDIO ~30 mA per datasheet typical curves - design the 3.3V regulator to source at least 250 mA to handle inrush on Flash programming.
Route the HS-USB DP/DM pair (pins 31/32) as a 90-ohm differential pair with no splits, max length 25 mm, and keep them at least 5 mm away from any high-speed digital switching signals. The XIN/XOUT crystal traces should be <5 mm, guarded by GND, and the crystal placed <8 mm from the MCU. NRST (pin 56) requires a 100 kohm pullup to VDDIO and a 10 nF capacitor to GND for EMC robustness; place this network within 5 mm of the pin. Estimated: with proper layout, the HS-USB port passes USB-IF compliance on the first iteration.
Do not leave the TST pin (pin 57) floating - tie it directly to GND. Otherwise the part enters SAM-BA ROM bootloader on every reset instead of booting from Flash. Similarly, do not leave NRST floating during power-up; use a proper reset supervisor (e.g., MCP130T) or the internal POR. The FWUP pin (pin 55/ERASE) must be tied to GND via 10 kohm for normal operation. Forgetting to connect VDDOUT decoupling is the #1 reason for POR instability in field units.
Estimated: at 120 MHz active CPU, the 64-LQFP package dissipates approximately 250 mW (3.3V x 75 mA), giving a junction-to-ambient rise of ~30C with 1 oz copper pours on a 4-layer FR-4 board (theta_JA ~50 C/W per SAM4S datasheet thermal table). For sealed enclosures with no airflow, ensure ambient stays below +60C to keep Tj under +100C. The LQFP exposed thermal pad is optional on this package (unlike the 64-QFN), so copper area on inner layers provides the primary heat-spreading path.
The PA21/PA22 HS-USB DM/DP lines require 45-ohm series impedance matching (typically 27-33 ohm at the source) plus a 50 mil keep-out on the differential pair. Do not place test points or other signals within 5 mm of the DP/DM traces. The 12-bit DAC outputs (PA3, PA4 alternate) should be buffered with an op-amp (e.g., MCP6002) for low-impedance drive; the DAC output impedance is approximately 5 kohm per the datasheet. Estimated: with proper DAC buffering, total harmonic distortion improves from 1% to <0.05% in audio playback.
Información de cumplimiento
RoHS and REACH compliant per Microchip product page. Pb-free LQFP package. Halogen-free per Microchip material declaration. MSL3 moisture sensitivity. Not AEC-Q100 qualified - this is an industrial-grade MCU. For automotive applications use the SAM V71/V7x1 family or SAM E70 instead.
