DSPIC33CK128MP506-I/MR - 100MHz 16-bit DSC, CAN-FD | Microchip
N.º de pieza: DSPIC33CK128MP506-I/MR ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $6.85 | $6,85 |
| 10 | $6.17 | $61,70 |
| 100 | $5.48 | $548,00 |
| 500 | $4.89 | $2.445,00 |
| 1.000 | $4.35 | $4.350,00 |
DSPIC33CK128MP506-I/MR Descripción general
A digital signal controller is a hybrid of a microcontroller (MCU) and a digital signal processor (DSP): it combines the interrupt-driven control flow, peripherals, and ease of use of an MCU with the multiply-accumulate (MAC) and fast loop execution of a DSP engine. Within the power-management hierarchy, DSCs sit between general-purpose MCUs and dedicated DSPs, and the dsPIC33C family is Microchip's current-generation single-core DSC platform for real-time control.
Key features include operation from DC to 100 MIPS (100 MHz core) at 3.0V to 3.6V, a modified Harvard architecture, dual-partition Flash supporting live firmware update, high-resolution PWM for switching power stages, and functional safety (FuSa) documentation support. Integrated analog includes 3 op-amps, 3 comparators, and PTG (Peripheral Trigger Generator) for deterministic peripheral-to-peripheral triggering without CPU intervention.
The dsPIC33CK core executes DSP instructions such as MAC, plus dedicated motor-control and digital-power peripherals, achieving deterministic control-loop latencies needed for field-oriented control (FOC) of motors and peak-current-mode power converters at loop rates above 100 kHz.
Typical applications include brushless DC and PMSM motor drives, digital power supplies and LLC/PFC converters, automotive-adjacent CAN FD industrial nodes, and advanced sensing systems.
Design consideration: plan the dual-partition Flash layout early, and place PGECx/PGEDx ICSP pairs as matched pairs when routing programming headers.
This page synthesizes distributor data, drop-in family alternatives, and design guidance not consolidated in the manufacturer datasheet.
Alternativas directas para DSPIC33CK128MP506-I/MR — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con DSPIC33CK128MP506-I/MR (mismo factor de forma y huella) — difiere en Operating Temperature, Program Memory (Flash), Core, PWM, Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
DSPIC33CK128MP506-E/MR
✅ Sustitución directa✓ En stock
$4.42 / unidad
Ver hoja de datos →DSPIC33CK256MP506-I/MR
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$2.3 / unidad
Ver hoja de datos →DSPIC33CK64MP506-I/MR
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$1.58 / unidad
Ver hoja de datos →DSPIC33CK128MP506-I/MR Valores máximos y características eléctricas
| Core | dsPIC33CK 16-bit DSC core |
| CPU Speed | 100 MHz (100 MIPS) |
| Program Flash | 128 KB (128K x 8) with ECC and live update |
| Data SRAM | 16 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| Temperatura de funcionamiento | -40C to +85C (Industrial, I-grade) |
| Encapsulado | 64-QFN (9x9 mm) |
| CAN Interface | CAN FD |
| Op-Amps (Integrated) | 3 |
| Comparators | 3 |
| Peripheral Trigger Generator | PTG |
| PWM | High-Resolution PWM |
| Architecture | Modified Harvard, single core |
| In-Circuit Serial Programming | ICSP (matched PGECx/PGEDx pairs) |
| Tipo de montaje | Surface Mount |
Guía de configuración de pines de DSPIC33CK128MP506-I/MR 64-qfn (9x9 mm)
Configuración de pines para DSPIC33CK128MP506-I/MR (encapsulado 64-qfn (9x9 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para DSPIC33CK128MP506-I/MR.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
DSPIC33CK128MP506-I/MR es adecuado para 6 aplicacións: Brushless DC / PMSM Motor Control, Digital Power Supplies (PFC, LLC, Totem-Pole), CAN FD Industrial Automation Nodes, Advanced Sensing and Control Systems, Automotive-Adjacent and Functional Safety Designs, Server and Telecom Power Shelf Subsystems.
Brushless DC / PMSM Motor Control
The DSPIC33CK128MP506-I/MR fits field-oriented control (FOC) of BLDC and PMSM motors because its 100 MHz dsPIC33CK core executes the current-loop MAC-heavy mathematics with deterministic latency, while high-resolution PWM delivers the fine duty-cycle resolution needed for low-torque-ripple commutation above 20 kHz switching frequencies. The three integrated op-amps can be configured as current-sense amplifiers feeding internal ADCs, removing external amplifier stages and reducing BOM cost in 48V and lower-voltage drives. In a typical topology, the DSC reads three shunt currents each PWM cycle, runs the Clarke/Park transforms and PI loops, and updates PWM compare registers within one control period; the Peripheral Trigger Generator chains ADC sampling to PWM events without CPU overhead. Microchip's DM330031 low-voltage motor-control board and FOC reference software shorten development cycles.
Recomendado
Digital Power Supplies (PFC, LLC, Totem-Pole)
For switch-mode power conversion, the DSPIC33CK128MP506-I/MR provides the high-resolution PWM needed to regulate PFC stages, LLC converters, and totem-pole PFC at 100 kHz-1 MHz switching frequencies, where coarse PWM resolution would otherwise cause output jitter and audible or subharmonic instability. The 3.0V-3.6V industrial-grade controller runs peak-current-mode or voltage-mode loops at sample rates tied directly to the PWM period through the Peripheral Trigger Generator, keeping control-loop delay minimal and predictable - a key advantage over generic MCUs for achieving high bandwidth. Its three comparators enable fast cycle-by-cycle overcurrent protection independent of software. CAN FD support allows the converter to report telemetry and accept setpoints on industrial buses. Dual-partition Flash with ECC permits field firmware updates without a service visit.
Recomendado
CAN FD Industrial Automation Nodes
The DSPIC33CK128MP506-I/MR serves as an intelligent CAN FD node in factory automation, HVAC, and building-control networks, bridging sensor and actuator I/O to higher-level controllers. CAN FD raises payloads to 64 bytes and supports faster arbitration and data phases than classical CAN, letting this 100 MHz DSC exchange richer telemetry and control frames on modern industrial buses. Its integrated 3 op-amps and 3 comparators condition local analog signals such as pressure, current, or position feedback without extra signal-conditioning ICs, while the 16 KB SRAM buffers messaging and protocol stacks. The Peripheral Trigger Generator provides deterministic timing for periodic transmission tasks independent of software jitter. The -40C to +85C industrial rating covers unconditioned factory-floor and rooftop environments.
Recomendado
Advanced Sensing and Control Systems
In advanced sensing platforms - vibration analyzers, ultrasonic flow meters, and adaptive lighting controls - the DSPIC33CK128MP506-I/MR combines DSP-class signal processing with MCU-style peripheral integration. The 100 MHz core executes filtering (FIR/IIR), FFT preprocessing, and compensation algorithms on data streamed through the high-resolution PWM and ADC subsystems, while the PTG orchestrates stimulus generation and sampling sequences autonomously for consistent timing. The three on-chip op-amps front-end bridge or shunt signals, reducing component count versus a discrete analog chain. With 128 KB ECC-protected Flash, algorithms can be field-updated in the field using the dual-partition live-update feature - critical for deployed instruments. The 64-QFN (9x9) package balances I/O availability (64 pins) with a compact 9x9 mm footprint for dense sensing boards.
Recomendado
Automotive-Adjacent and Functional Safety Designs
While the industrial-grade -I/MR is not itself AEC-Q100 qualified, it sits within Microchip's dsPIC33CK family that is explicitly positioned for functional safety (FuSa) designs, with safety documentation packages supporting ISO-style development processes in automotive-adjacent and medical-adjacent systems. ECC on program Flash detects and corrects single-bit memory faults, MBIST memory self-test, and comparator- and PWM-coverage features reduce external safety monitoring cost. For applications requiring higher ambient temperature ratings, the same-die DSPIC33CK128MP506-E/MR in the identical 64-QFN footprint extends the operating range while preserving software compatibility. CAN FD connectivity aligns with the transport layers common in vehicle-adjacent industrial equipment such as off-highway machinery and agricultural control units. Choose the -E suffix part when ambient exceeds +85C.
Recomendado
Server and Telecom Power Shelf Subsystems
Within server power shelves, battery backup units, and telecom rectifiers, the DSPIC33CK128MP506-I/MR manages hot-swap PFC stages, digital LLC DC-DC bricks, and battery charge-control loops. The high-resolution PWM supports multiphase interleaving with phase shedding for high efficiency at light load, while 100 MHz control timing keeps transient response within server specification windows. CAN FD provides the in-shelf management bus used increasingly in place of slower SMBus/PMBus-only designs for higher-throughput telemetry. ECC Flash and brown-out supervision maintain integrity across 48V bus transients, and the live-update capability lets operators reflash control firmware during maintenance windows without powering down the shelf. The 9x9 mm QFN conserves board area in dense rectifier modules.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para DSPIC33CK128MP506-I/MR — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | DSPIC33CK128MP506-E/MR | DSPIC33CK256MP506-I/MR | DSPIC33CK64MP506-I/MR |
|---|---|---|---|---|
| Package | 64-QFN (9x9) | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Speed | dsPIC33CK, 100 MHz | dsPIC33CK, 100 MHz | dsPIC33CK, 100 MHz | dsPIC33CK, 100 MHz |
| Program Flash | 128 KB (ECC, live update) | 128 KB (ECC, live update) | 256 KB (ECC, live update) | 64 KB (ECC, live update) |
| CAN FD | Yes | Yes | Yes | Yes |
| Integrated Op-Amps / Comparators | 3 / 3 | 3 / 3 | 3 / 3 | 3 / 3 |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +125C/+150C (Extended, E-grade) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Relative Cost | Baseline | Higher (extended temp grade) | Higher (2x Flash) | Lower (half Flash) |
Diferenciadores clave
- Industrial temperature rating at standard cost (frente a DSPIC33CK128MP506-E/MR)
- Balanced 128 KB Flash / 16 KB SRAM (frente a DSPIC33CK64MP506-I/MR)
- Optimized memory sizing for cost (frente a DSPIC33CK256MP506-I/MR)
Notas de diseño
Use any PGECx/PGEDx pair for ICSP, but always as a matched pair - per Microchip documentation, if PGEC2 carries ICSPCLK then ICSPDAT must route to PGED2. Route these traces short and away from PWM or switch-node noise to keep in-circuit serial programming reliable during production and field updates. Reserve footprints for a programming header on all 64-QFN layouts, since the QFN pads are not probe-friendly.
The core runs from a 3.0V-3.6V rail at up to 100 MHz; decouple every VDD pin pair with 100 nF ceramics placed within 2 mm of the pads, plus bulk capacitance near the package. The QFN-64 exposed die paddle should be soldered to a grounded array of vias to lower thermal resistance and improve ground integrity for the analog front ends. Estimated: at typical 100 MHz operation core current is tens of mA, so a single LDO output stage sized for 150-200 mA covers logic plus I/O with margin.
Do not assume 128 KB of fully usable Flash when planning a dual-partition live-update scheme: the two partitions must each hold the image plus bootstrap, so per-partition code space is effectively half the total minus reserved areas. Also, QFN center thermal pads on un-soldered prototype boards can leave the die floating, causing intermittent analog and ground behavior. Finally, verify the exact SRAM allocation and peripheral-to-pin mapping against the latest Microchip datasheet revision before PCB release.
Keep high-resolution PWM outputs and ADC sense traces segregated on the 64-QFN breakout; switching edges from digital-power bridges couple easily into the integrated op-amp inputs. Use ground guard traces beneath op-amp feedback networks and route analog references on a quiet local area. Estimated: at 100 MHz core clock, harmonic content from I/O transitions extends well beyond 200 MHz, so series termination (22-33 ohm) on fast PWM lines reduces radiated emissions in EMC testing.
Información de cumplimiento
The provided verified web data does not include explicit RoHS/REACH/lead-free statements for this part; confirm via Microchip's product page compliance documents. -I grade denotes industrial temperature, not a compliance attribute.
