DSPIC33EP128GM706T-I/MR - 70 MIPS 128KB DSC | Microchip Technology
N.º de pieza: DSPIC33EP128GM706T-I/MR ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $6.57 | $6,57 |
| 10 | $6.15 | $61,50 |
| 100 | $5.7 | $570,00 |
| 500 | $5.3 | $2.650,00 |
| 1.000 | $4.9 | $4.900,00 |
DSPIC33EP128GM706T-I/MR Descripción general
A digital signal controller is a hybrid of a microcontroller (MCU) and a digital signal processor (DSP), combining MCU-style control peripherals, interrupts, and I/O with DSP-engine math capabilities such as a hardware multiply-accumulate unit and barrel shifter. In the power-management hierarchy, DSCs sit above basic MCUs for real-time closed-loop control tasks like field-oriented motor control, digital power conversion, and sensor signal processing.
Key differentiators of this part include the 70 MIPS dsPIC DSC core, CAN 2.0B connectivity for industrial and automotive networks, dual QEI modules for servo feedback, and four integrated op-amps that reduce external component count in current-sense and signal-conditioning circuits. The CTMU enables capacitive touch and precise time measurement, while the PTG offloads complex peripheral sequencing from the CPU.
The 64-VQFN 9x9 mm exposed-pad package supports surface-mount assembly with good thermal performance, and the T suffix denotes tape-and-reel delivery for automated production lines. Typical applications include precision brushless DC and PMSM motor drives, digital power supplies, industrial automation nodes, and embedded control systems requiring DSP-grade math.
Design consideration: the device requires a clean 3.3V rail with proper decoupling on VDDCORE/VCAP for the internal 2.5V core regulator; follow Microchip's layout guidance for the exposed pad connection to ground.
This page synthesizes distributor pricing, drop-in alternatives, application guidance, and design notes not found on the manufacturer product page alone.
Alternativas directas para DSPIC33EP128GM706T-I/MR — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con DSPIC33EP128GM706T-I/MR (mismo factor de forma y huella) — difiere en Operating Temperature, Package, Quadrature Encoder Interfaces, Supply Voltage, RAM.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
DSPIC33EP128GM706-I/MR
✅ Sustitución directa✓ En stock
$4.6 / unidad
Ver hoja de datos →DSPIC33EP128GM706T-E/MR
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
DSPIC33EP256GM706T-I/MR
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$4.65 / unidad
Ver hoja de datos →DSPIC33EP64GM706T-I/MR
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
DSPIC33EP128GM706T-I/MR Valores máximos y características eléctricas
| Core Architecture | 16-bit dsPIC33E DSC core |
| Maximum Performance | 70 MIPS |
| Program Memory (Flash) | 128KB (43K x 24) |
| RAM | 16KB |
| Tensión de alimentación | 3.0 V to 3.6 V |
| Motor Control PWM Channels | 12 MCPWM |
| Input Capture / Output Compare | 8 / 8 |
| Quadrature Encoder Interfaces | 2 QEI |
| On-chip Operational Amplifiers | 4 |
| Charge Time Measurement Unit | CTMU |
| Peripheral Trigger Generator | PTG |
| Timers | 13 |
| DMA Channels | 4 |
| Communication Interfaces | CAN, UART, SPI, I2C |
| Temperatura de funcionamiento | -40C to +85C (I-grade) |
| Encapsulado | 64-VQFN (9x9 mm) exposed pad |
| Tipo de montaje | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| Estado RoHS | Compliant |
Guía de configuración de pines de DSPIC33EP128GM706T-I/MR 64-vqfn (9x9 mm) exposed pad
Configuración de pines para DSPIC33EP128GM706T-I/MR (encapsulado 64-vqfn (9x9 mm) exposed pad). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para DSPIC33EP128GM706T-I/MR.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
DSPIC33EP128GM706T-I/MR es adecuado para 6 aplicacións: Brushless DC / PMSM Motor Drives, Digital Power Conversion, Industrial Automation and CAN Networking Nodes, Capacitive Touch and Precision Measurement, Sensor Signal Conditioning and Embedded DSP, Automotive and Transportation Subsystems.
Brushless DC / PMSM Motor Drives
The DSPIC33EP128GM706T-I/MR is purpose-built for precision motor control: its 12 motor-control PWM (MCPWM) channels support complementary outputs with hardware dead-time insertion for three-phase inverters, while 2 quadrature encoder interfaces read position feedback from servo encoders at high resolution. The 70 MIPS DSP core with hardware MAC executes field-oriented control (FOC) current loops at 10-20 kHz PWM frequencies with ample margin. The 4 on-chip op-amps condition shunt-resistor current signals, eliminating external amplifier ICs and reducing BOM cost and board area. Firmware libraries from Microchip's motor-control suite accelerate development for FOC, trapezoidal, and sensorless algorithms.
Recomendado
Digital Power Conversion
In digitally controlled AC-DC and DC-DC converters, the DSPIC33EP128GM706T-I/MR's 70 MIPS core and 8 output-compare channels implement voltage-mode or current-mode control loops with PWM frequencies into the hundreds of kHz. The CTMU provides precise time measurement for power-factor-correction timing functions, and the 12 MCPWM channels can drive interleaved or multi-phase topologies with deterministic phase relationships. The PTG (Peripheral Trigger Generator) sequences ADC sampling and PWM updates in hardware, achieving loop latencies that software-only sequencing cannot match. Microchip's digital-power reference designs for the dsPIC33E family provide proven firmware starting points for PFC, LLC, and bidirectional converter stages.
Recomendado
Industrial Automation and CAN Networking Nodes
With an integrated CAN 2.0B module, the DSPIC33EP128GM706T-I/MR connects directly to industrial fieldbus networks such as CANopen and DeviceNet without an external CAN controller. The 128KB Flash stores protocol stacks plus application logic, and 16KB RAM buffers network traffic and control state. 8 input-capture channels timestamp encoder or sensor events with hardware precision, while 2 QEI modules interface rotary encoders for axis positioning. The -40C to +85C industrial temperature rating covers factory-floor enclosures. Typical deployments include conveyor controllers, robotic joint drives, and distributed I/O modules communicating over a single twisted-pair CAN bus.
Recomendado
Capacitive Touch and Precision Measurement
The Charge Time Measurement Unit (CTMU) on the DSPIC33EP128GM706T-I/MR enables capacitive touch sensing and precision time-of-charge measurement without a dedicated touch controller. Combined with the 4 on-chip op-amps acting as charge integrators or buffers, the device can implement multi-key touch panels on the 64 available I/O pins while simultaneously running the main application. Microchip's CTMU-based touch libraries provide drift compensation and threshold algorithms. The same CTMU also supports sub-nanosecond-class time measurements for ultrasonic flow or distance sensing, and the PTG autonomously triggers measurement sequences, keeping the CPU free for signal processing and communications.
Recomendado
Sensor Signal Conditioning and Embedded DSP
The 4 integrated op-amps can be configured as programmable-gain amplifiers, filters, or comparators for conditioning signals from pressure, current, and optical sensors before on-chip ADC sampling. The 16-bit DSP core then applies FIR/IIR filtering, FFT analysis, or control algorithms using single-cycle MAC instructions and dual operand fetch - throughput that a conventional MCU achieves only with heavy software overhead. Applications include weigh-scale front ends, acoustic analysis, vibration monitoring, and power-quality analyzers. The 8 input-capture channels provide edge-timing measurement for ultrasonic and frequency-output sensors, and 4 DMA channels stream ADC results to RAM without CPU intervention.
Recomendado
Automotive and Transportation Subsystems
The DSPIC33EP128GM706T-I/MR serves automotive-adjacent subsystems such as electric power steering assist logic, pump and fan control, lighting actuators, and auxiliary motor drives, where the integrated CAN interface provides vehicle-network connectivity and the extended-temperature sibling DSPIC33EP128GM706T-E/MR (rated -40C to +125C) covers under-hood zones on the same footprint. The 12 MCPWM channels with dead-time control drive H-bridges for pumps, wipers, and throttle actuators, while 2 QEI modules read position sensors. Designers targeting formal automotive qualification should select the -E temperature variant and verify AEC-Q100 status directly with Microchip for the specific ordering code.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para DSPIC33EP128GM706T-I/MR — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | DSPIC33EP128GM706-I/MR | DSPIC33EP128GM706T-E/MR | DSPIC33EP256GM706T-I/MR | DSPIC33EP64GM706T-I/MR | DSPIC33EP128GM706T-I/PT |
|---|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-TQFP (14x14 mm) - different footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 128KB (43K x 24) | 128KB | 128KB | 256KB | 64KB | 128KB |
| RAM | 16KB | 16KB | 16KB | 16KB | 16KB | 16KB |
| Performance | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Operating Temperature | -40C to +85C (I-grade) | -40C to +85C | -40C to +125C (E-grade) | -40C to +85C | -40C to +85C | -40C to +85C |
| Motor Control Peripherals | 12 MCPWM, 8/8 IC/OC, 2 QEI, 4 op-amps | 12 MCPWM, 8/8 IC/OC, 2 QEI, 4 op-amps | 12 MCPWM, 8/8 IC/OC, 2 QEI, 4 op-amps | 12 MCPWM, 8/8 IC/OC, 2 QEI, 4 op-amps | 12 MCPWM, 8/8 IC/OC, 2 QEI, 4 op-amps | 12 MCPWM, 8/8 IC/OC, 2 QEI, 4 op-amps |
| Delivery Format | Tape & Reel (T suffix) | Tube | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel |
Diferenciadores clave
- Four on-chip op-amps reduce external analog BOM (frente a DSPIC33EP64GM706T-I/MR)
- Extended-temperature option on identical footprint (frente a DSPIC33EP128GM706T-E/MR)
- Integrated CAN 2.0B plus dual QEI in one DSC (frente a DSPIC33CK128MP506 (cross-family))
Notas de diseño
The device operates from a single 3.0V to 3.6V supply, but the dsPIC33E core runs internally at ~2.5V via an on-chip regulator. The VDDCORE/VCAP pin must be connected to a low-ESR capacitor (per datasheet recommendation, typically around 10 uF) and must never be driven externally. Decouple each VDD pin with 0.1 uF ceramic capacitors placed within 2 mm, plus one bulk 4.7-10 uF per supply rail.brownout behavior and reset integrity depend directly on VCAP capacitor selection - do not substitute values without datasheet verification.
The 64-VQFN (9x9 mm) package has an exposed pad on the underside that is the primary ground and thermal path. Create an array of thermal vias (e.g., 4x4 grid, 0.3 mm drill) connecting the exposed-pad land pattern to the internal ground plane; a solder-paste window-pane stencil pattern improves reflow wetting. If the /PT TQFP variant is ever considered as a second source, note its footprint is NOT compatible - do not design a shared land pattern. Keep crystal traces short and guard with ground for the primary oscillator.
The four on-chip op-amps and 12 MCPWM outputs make layout discipline essential in motor-drive boards: route high-current PWM outputs away from op-amp input pins to prevent coupling into analog front ends, and use kelvin-connected shunt resistors for current feedback feeding the internal amplifiers. The CTMU is sensitive to board leakage - guard touch traces with ground rings and conformal coating for products in humid environments. When using CAN, add proper termination (120 ohm split or standard) at the bus ends and place the transceiver (e.g., MCP2551) close to the CANTX/CANRX pins.
Información de cumplimiento
RoHS compliance and lead-free status confirmed from distributor listings (PCB Electronics, LCSC). REACH, halogen-free, and conflict-minerals status not stated in provided data - confirm via Microchip compliance portal.
