DSPIC33EP128MC502-H/SO - 70 MIPS 16-bit DSC 128KB Flash | Microchip
N.º de pieza: DSPIC33EP128MC502-H/SO ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $5.62 | $5,62 |
| 10 | $5.06 | $50,60 |
| 100 | $4.44 | $444,00 |
| 500 | $3.92 | $1.960,00 |
| 1.000 | $3.55 | $3.550,00 |
DSPIC33EP128MC502-H/SO Descripción general
A digital signal controller combines the computational capability of a digital signal processor (DSP) with the integrated peripherals and deterministic control of a microcontroller (MCU). Within the power-management hierarchy of embedded systems, the dsPIC33EP family sits at the intersection of motor-control MCUs and DSP engines, providing a single-chip solution for real-time, closed-loop control applications.
Key features include the 70 MIPS dsPIC DSC core with integrated DSP multiply-accumulate (MAC) instructions, high-speed PWM peripherals with dead-time control for motor drive, and enhanced on-chip peripherals that enable energy-efficient, quieter, longer-range motor-control systems. In-circuit serial programming (ICSP) with multiple PGECx/PGEDx pairs simplifies production programming and debugging.
Architecturally, the dsPIC33EP core executes most instructions in a single cycle at 70 MIPS, combining a 16-bit modified Harvard architecture with DSP-class addressing modes. The MC (motor control) variant specifically integrates the high-speed PWM module required for brushless DC (BLDC), permanent-magnet synchronous (PMSM), and AC induction motor control, alongside digital power conversion topologies.
Typical applications include BLDC and PMSM motor control for industrial drives, digital power supplies and LED drivers, automotive electromechanical actuators, and sensor-driven embedded systems requiring DSP filtering on-chip.
A key design consideration: the -H temperature variant and the SOIC package impose thermal constraints at full 70 MIPS operation, so supply decoupling and PCB copper area around the VDD/VSS pins should follow the manufacturer datasheet layout guidance.
This page synthesizes verified distributor data, same-family drop-in alternatives, and practical design notes beyond what the manufacturer product page provides. Pricing shown as of 2026-09-24; specifications per Microchip product page and dsPIC33EP family datasheet (526 pages).
Alternativas directas para DSPIC33EP128MC502-H/SO — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con DSPIC33EP128MC502-H/SO (mismo factor de forma y huella) — difiere en Series, Package, Core Architecture, Debug/Programming, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
DSPIC33EP128MC502-I/SO
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$3.29 / unidad
Ver hoja de datos →DSPIC33EP128MC502-E/SO
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
DSPIC33EP64MC502-I/SO
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
DSPIC33EP256MC502-I/SO
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
DSPIC33EP128GP502-H/SO
✅ Sustitución directa✓ En stock
$3.36 / unidad
Ver hoja de datos →DSPIC33EP128MC502-H/SO Valores máximos y características eléctricas
| Core | dsPIC33EP 16-bit DSC core |
| Maximum Operating Frequency | 70 MHz (70 MIPS) |
| Flash Program Memory | 128 KB (43K x 24) |
| Ancho del bus de datos | 16 bit |
| Encapsulado | 28-SOIC (0.295 in, 7.50 mm width) |
| Tipo de montaje | Surface Mount |
| Rango de temperatura de funcionamiento | -40C to +125C (H variant, per AEC-Q100 grade) |
| Qualification | AEC-Q100 (Automotive) |
| Series | dsPIC 33EP Series |
| Product Family Application | Automotive, Motor Control, Digital Power |
| PWM Peripherals | High-Speed PWM (MC variant) |
| Debug/Programming | ICSP with multiple PGECx/PGEDx pairs |
| Motor Types Supported | Brushless DC (BLDC), permanent magnet (PMSM), AC induction |
| Estado RoHS | unknown |
| Instruction Set | 16-bit MCU + DSP (MAC) instructions |
Guía de configuración de pines de DSPIC33EP128MC502-H/SO 28-soic (0.295 in, 7.50 mm width)
Configuración de pines para DSPIC33EP128MC502-H/SO (encapsulado 28-soic (0.295 in, 7.50 mm width)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para DSPIC33EP128MC502-H/SO.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
DSPIC33EP128MC502-H/SO es adecuado para 6 aplicacións: BLDC Motor Control, PMSM Field-Oriented Control, Digital Power Supplies, Automotive Electromechanical Actuators, Industrial Automation and Robotics, Sensor Signal Processing and DSP Filtering.
BLDC Motor Control
The DSPIC33EP128MC502-H/SO fits brushless DC motor control because its MC variant integrates the high-speed PWM module with dead-time insertion and its 70 MIPS core executes commutation and current-loop code with ample headroom. According to Microchip, the dsPIC33E family enables BLDC drive systems that are more energy efficient, quieter, and have extended range and life. In a typical three-phase drive, the DSC reads hall or sensorless back-EMF signals, runs the commutation algorithm, and drives six PWM outputs through a gate driver. The 43K x 24 instruction-word Flash holds sensorless observers and protection state machines. Using the -H variant brings AEC-Q100 qualification for automotive-grade BLDC applications such as pumps and actuators.
Recomendado
PMSM Field-Oriented Control
For permanent magnet synchronous motor (PMSM) field-oriented control (FOC), the DSPIC33EP128MC502-H/SO provides the DSP multiply-accumulate instructions and 70 MIPS single-cycle execution needed to close current loops at PWM frequencies of tens of kilohertz. The MC peripheral set supplies high-speed PWM with complementary outputs and dead-time control required by three-phase inverters. The 128 KB Flash accommodates the FOC mathematics, speed loops, and parameter estimation simultaneously. In an inverter design, the DSC samples phase currents with its ADC, executes Clarke/Park transforms and PI loops, and updates the PWM duty registers within one PWM period. AEC-Q100 qualification supports automotive PMSM traction-adjacent and actuator subsystems.
Recomendado
Digital Power Supplies
The DSPIC33EP128MC502-H/SO serves digital power conversion - LLC, buck, boost, PFC, and LED drivers - because the MC-variant high-speed PWM supports complementary outputs, phase shifting, and fast fault Trip outputs, while the 70 MIPS core closes voltage and current loops digitally. A 526-page family datasheet covers the PWM module's control-loop coordination features. In a typical digital power supply, the DSC samples output voltage and current, executes a PI or PID compensator, and updates PWM duty each switching cycle, replacing analog error amplifiers with software for programmable response and telemetry. The 28-pin SOIC suits compact auxiliary and single-rail converters, and AEC-Q100 qualification covers automotive onboard-charger and DC-DC subfunctions.
Recomendado
Automotive Electromechanical Actuators
The AEC-Q100 qualification of the DSPIC33EP128MC502 family makes the -H/SO ordering code appropriate for automotive electromechanical actuator control: throttle-by-wire auxiliaries, headlamp leveling, HVAC dampers, pumps, and latching mechanisms. The 70 MIPS core handles DC or BLDC motor commutation, position feedback processing, and diagnostic routines such as stall detection and over-current protection in firmware. The 28-SOIC 7.50 mm package is hand-inspectable and thermally adequate for gate-driver-level control loads. According to distributor data (Hotenda), the family is explicitly classified as Automotive, AEC-Q100, dsPIC 33EP Series. Designs requiring extended temperature margins should cross-check the -E variant ordering codes within the same footprint.
Recomendado
Industrial Automation and Robotics
In industrial automation, the DSPIC33EP128MC502-H/SO drives servo stages, conveyor motors, and robotic joint actuators where deterministic 70 MIPS control-loop execution and DSP instruction support enable smooth torque control. The device's multiple PGECx/PGEDx ICSP pairs simplify in-field firmware updates on production fixtures, a practical benefit noted in NSDSP programming documentation. The 128 KB Flash supports protocol handling alongside the control loop, and the SOIC-28 package offers reliable solder joints for vibration-prone factory environments. Typical implementations pair the DSC with a three-phase gate driver and current-sense amplifiers, closing torque and velocity loops at kilohertz rates while a host PLC issues trajectory commands.
Recomendado
Sensor Signal Processing and DSP Filtering
The integrated DSP multiply-accumulate engine of the DSPIC33EP128MC502-H/SO makes it effective as a local signal-processing node for sensor arrays: FIR/IIR filtering, FFT-based vibration analysis, and RMS metering run efficiently at 70 MIPS without a separate DSP. The 43K x 24 instruction-word Flash stores coefficient tables and acquisition firmware, while the MCU-style peripherals handle serial communication to higher-level controllers. Embedded at the sensing point, the DSC can digitize analog sensor outputs, apply band-pass or notch filtering, and transmit processed features, reducing host CPU load and bus traffic. The AEC-Q100 qualification and SOIC-28 footprint suit both industrial and automotive sensing modules requiring long-term availability.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para DSPIC33EP128MC502-H/SO — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | DSPIC33EP128MC502-I/SO | DSPIC33EP64MC502-I/SO | DSPIC33EP256MC502-I/SO | DSPIC33EP128GP502-H/SO |
|---|---|---|---|---|---|
| Package | 28-SOIC (7.50 mm) | 28-SOIC (7.50 mm) - same | 28-SOIC (7.50 mm) - same | 28-SOIC (7.50 mm) - same | 28-SOIC (7.50 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Performance | 70 MIPS 16-bit DSC | 70 MIPS 16-bit DSC | 70 MIPS 16-bit DSC | 70 MIPS 16-bit DSC | 70 MIPS 16-bit DSC |
| Flash Program Memory | 128 KB (43K x 24) | 128 KB (43K x 24) | 64 KB | 256 KB | 128 KB (43K x 24) |
| Motor-Control Peripherals (MC) | Yes - high-speed PWM | Yes - high-speed PWM | Yes - high-speed PWM | Yes - high-speed PWM | No - GP peripherals |
| Programming/Debug | ICSP, multiple PGECx/PGEDx pairs | ICSP, multiple PGECx/PGEDx pairs | ICSP | ICSP | ICSP |
| Primary Application Fit | BLDC/PMSM motor control, digital power | Identical fit (same die) | Motor control with smaller firmware | Motor control with large firmware | General-purpose DSP/embedded control |
Diferenciadores clave
- Integrated motor-control PWM in the same footprint as GP variants (frente a DSPIC33EP128GP502-H/SO)
- Memory-size scalability without PCB change (frente a DSPIC33EP64MC502-I/SO)
- AEC-Q100 automotive qualification path (frente a DSPIC33EP256MC502-I/SO)
- 70 MIPS single-chip DSP + MCU control (frente a Two-chip MCU+DSP solutions)
Notas de diseño
ICSP programming requires PGECx and PGEDx pins to be used as matched pairs. Per NSDSP documentation for dsPIC33EP128MC502, the device has multiple pairs (for example PGEC2 must pair with PGED2 for ICSPCLK/ICSPDAT). Design the programming header so the selected pair routes directly to the connector, and do not multiplex either pin with a critical PWM output during development. All VSS and VDD pins must be connected during programming and debug.
Place 100 nF ceramic decoupling capacitors at every VDD/VSS pin pair, as close to the device as possible, following the layout guidance in the dsPIC33EP family datasheet. At 70 MIPS, the core switching current has fast edges, and the SOIC-28 package has limited on-package decoupling capability. Route the high-speed PWM outputs away from analog sensor inputs used for current feedback to preserve ADC accuracy in motor-control loops.
Estimated: the SOIC-28 (7.50 mm) package has a higher junction-to-ambient thermal resistance than the QFN/SSOP variants of the same die. When the core runs continuously at 70 MIPS with active PWM peripherals, keep ambient temperature within the -H variant rating and provide copper pour on the PCB to spread heat. Verify theta_JA from the datasheet and derate the operating frequency in enclosed, high-ambient-temperature enclosures if junction temperature approaches the maximum rating.
Power the device from a clean 3.3 V rail per dsPIC33EP family requirements; verify the exact VDD range from the datasheet ordering/electrical characteristics tables. In motor-drive systems, keep the DSC supply on a separate regulator or filtered rail from the gate-driver supply, since PWM switching transients can couple onto VDD and cause ADC noise or spurious resets. Use a bulk capacitor plus local 100 nF ceramic per pin pair.
Información de cumplimiento
Distributor listing (Hotenda) explicitly classifies the family as 'Automotive, AEC-Q100, dsPIC 33EP Series'. RoHS/REACH/lead-free status was not stated in the retrieved data and must be confirmed on the Microchip product page.
