DSPIC33EP256MU810T-E/BG - 16-bit 60MIPS DSC 256KB Flash | Microchip
N.º de pieza: DSPIC33EP256MU810T-E/BG ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $7.95 | $7,95 |
| 10 | $7.15 | $71,50 |
| 100 | $6.4 | $640,00 |
| 500 | $5.75 | $2.875,00 |
| 1.000 | $5.2 | $5.200,00 |
DSPIC33EP256MU810T-E/BG Descripción general
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and ease of use of a microcontroller. Within the power-management hierarchy of embedded systems, a DSC sits between a general-purpose MCU and a dedicated DSP, making the dsPIC33E family a common choice for closed-loop control systems such as field-oriented motor control, digital power conversion, and sensor signal conditioning.
Key features include the dsPIC33E core running at up to 60 MIPS, integrated USB connectivity, a high-speed PWM module for power conversion and motor drive, advanced analog peripherals, and an extended automotive temperature range (-40C to +125C) denoted by the E suffix. The Tape-and-Reel (T) suffix supports automated pick-and-place assembly in volume production.
Architecturally, the device uses a 16-bit modified Harvard architecture with DSP engine instructions (MAC, DSP multiply) and a wide 24-bit instruction word. The 121-TFBGA footprint conserves board area versus TQFP equivalents while providing up to 51 I/O ports, enabling dense, high-channel-count designs.
Typical applications include brushless DC and PMSM motor control for automotive auxiliaries, USB-connected industrial sensors, digital LED drivers, and power-factor-correction converters where the high-speed PWM and DSP capability are directly exploited.
Design consideration: because the E/BG variant is AEC-Q100 qualified but rated to +125C, verify junction temperature margins with your thermal solution; the 10x10 mm BGA requires careful PCB ball-mapping and X-ray-capable assembly processes.
This page synthesizes distributor data, drop-in family alternatives, and practical design notes beyond the manufacturer datasheet to support sourcing and design decisions.
Alternativas directas para DSPIC33EP256MU810T-E/BG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con DSPIC33EP256MU810T-E/BG (mismo factor de forma y huella) — difiere en Mounting Type, Package, Packaging, Core, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
DSPIC33EP256MU810-E/BG
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
DSPIC33EP256MU810T-I/BG
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$5.25 / unidad
Ver hoja de datos →DSPIC33EP512MU810T-E/BG
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
DSPIC33EP256MU810T-E/PT
✅ Sustitución directa✓ En stock
$4.62 / unidad
Ver hoja de datos →DSPIC33EP256MU810T-E/BG Valores máximos y características eléctricas
| Core | dsPIC33E 16-bit |
| Ancho del bus de datos | 16 bit |
| Maximum Clock / Performance | 60 MIPs |
| Program Memory Size | 256 KB (85.5K x 24) Flash |
| RAM Size | 12K x 16 (24 KB) |
| Supply Voltage Range | 3 V to 3.6 V |
| I/O Ports | 51 |
| Encapsulado | 121-TFBGA (10x10 mm) |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40C to +125C (E grade) |
| Automotive Qualification | AEC-Q100 qualified |
| USB | Yes (integrated USB) |
| High-Speed PWM | Yes |
| Advanced Analog | Yes (per dsPIC33EP MU810 family) |
| Life Cycle Stage | ACTIVE |
| Packaging | Tape & Reel (T suffix) |
Guía de configuración de pines de DSPIC33EP256MU810T-E/BG 121-tfbga (10x10 mm)
Configuración de pines para DSPIC33EP256MU810T-E/BG (encapsulado 121-tfbga (10x10 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para DSPIC33EP256MU810T-E/BG.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
DSPIC33EP256MU810T-E/BG es adecuado para 6 aplicacións: Automotive BLDC/PMSM Motor Control, Digital Power Conversion, USB-Connected Industrial Sensors, Audio Signal Processing, Smart Lighting and LED Drivers, Portable and Battery-Powered Instrumentation.
Automotive BLDC/PMSM Motor Control
The DSPIC33EP256MU810T-E/BG fits automotive motor control because its 60 MIPs dsPIC33E core executes field-oriented control loops fast enough for 16-20 kHz PWM frequencies, while the high-speed PWM module provides complementary outputs with dead-time insertion. AEC-Q100 qualification and the E temperature grade (-40C to +125C) satisfy automotive auxiliary drive requirements for pumps, fans, and actuators. In use, the device runs the current loop with its DSP MAC instructions, reads phase currents through integrated analog peripherals, and drives a three-phase inverter directly. The trade-off versus a dedicated C2000 DSP is lower raw FPU throughput, but the single-chip integration of USB, CAN-friendly peripherals, and control PWM reduces BOM count and board area in cost-sensitive 12V automotive nodes.
Recomendado
Digital Power Conversion
Digital SMPS, power-factor-correction, and DC-DC converters benefit from this DSC's high-speed PWM with fine duty-cycle resolution and the 60 MIPs core that closes voltage and current loops in software. The 256KB Flash accommodates compensator code, soft-start sequencing, and fault diagnostics, while the 12K x 16 RAM buffers transient logs. The integrated advanced analog block digitizes feedback signals without an external ADC, reducing loop latency and component count. Implementing peak-current-mode or average-current-mode control in firmware lets one hardware platform serve multiple power ratings via firmware changes. The key consideration is PWM resolution at high switching frequency: verify effective duty-cycle resolution at your target frequency against the datasheet PWM module specification before committing to frequencies above roughly 500 kHz.
Recomendado
USB-Connected Industrial Sensors
With integrated USB device peripheral and 51 I/O, the DSPIC33EP256MU810T-E/BG serves industrial sensor nodes that stream conditioned measurement data to PCs, PLCs, or gateways over USB. The DSP engine handles filtering (FIR/IIR), FFT-based spectral analysis, and calibration math locally at 60 MIPs, offloading the host. The 3V to 3.6V supply matches common industrial 3.3V rails, and the industrial or extended temperature grades cover cabinet and floor environments. Firmware uses the Microchip USB stack for CDC/HID classes, so the sensor appears as a virtual COM port without custom drivers. The BGA package suits compact probe housings; ensure your enclosure design accounts for the 10x10 mm footprint and reflow-only assembly, as BGA rework in the field is impractical.
Recomendado
Audio Signal Processing
The dsPIC33E DSP engine with single-cycle MAC and dual operand fetch enables real-time audio effects, active noise cancellation, and acoustic diagnostic processing. At 60 MIPs the device sustains several concurrent biquad IIR filters or moderate-length FIR filters at 48 kHz sampling with headroom for control tasks. The 256KB Flash stores algorithms plus tables, and 12K x 16 RAM provides delay-line memory for echo and reverb effects up to moderate buffer lengths. MU-family devices add codec-friendly peripheral configurations for I2S-style interfaces where supported. For professional low-noise applications, pair the DSC with a dedicated codec IC; the DSC handles the DSP workload while the codec manages the analog domain, keeping total system noise dominated by the analog front end rather than the controller.
Recomendado
Smart Lighting and LED Drivers
High-speed PWM on the dsPIC33EP256MU810 drives switched-mode LED drivers with precise dimming resolution, and the 60 MIPs core implements color mixing, thermal derating, and communication protocols in firmware. The 256KB Flash supports DALI/DMX-style protocol stacks alongside the control loop, letting one DSC manage driver power stage and network interface simultaneously. Integrated analog channels monitor LED current and board temperature for closed-loop current regulation and fault shutdown, improving reliability in sealed luminaires where access is difficult. The automotive E-grade option also suits exterior vehicle lighting exposed to -40C to +125C. Design the PWM frequency to sit above audible range (typically above 20 kHz) and confirm dimming resolution remains adequate at that frequency, as PWM resolution decreases linearly as switching frequency rises.
Recomendado
Portable and Battery-Powered Instrumentation
Handheld instruments benefit from the single-chip integration of USB, control PWM, and analog peripherals on the DSPIC33EP256MU810T-E/BG, shrinking the bill of materials and the 10x10 mm TFBGA footprint conserves PCB area inside enclosures. The 3V to 3.6V operating range connects directly to a single lithium-ion cell through a small LDO, and firmware-driven power modes allow duty-cycled sampling to extend battery life in data-logging modes. Typical builds include battery testers, environmental monitors, and field diagnostic tools that log data to Flash and offload via USB CDC to a laptop. The main trade-off is BGA assembly cost for low-volume portable products; if volumes are small, the TQFP /PT variant of the same die may be more practical despite its larger footprint.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para DSPIC33EP256MU810T-E/BG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | DSPIC33EP256MU810-E/BG | DSPIC33EP256MU810T-I/BG | DSPIC33EP512MU810T-E/BG | DSPIC33EP256MU810T-E/PT |
|---|---|---|---|---|---|
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | TQFP-100 (different footprint) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Performance | 60 MIPs, 16-bit dsPIC33E | 60 MIPs | 60 MIPs | 60 MIPs | 60 MIPs |
| Flash Program Memory | 256 KB (85.5K x 24) | 256 KB | 256 KB | 512 KB | 256 KB |
| Operating Temperature | -40C to +125C (E) | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) |
| AEC-Q100 | Qualified | Qualified | Not qualified (I grade) | Qualified | Qualified |
| Packaging Format | Tape & Reel (T) | Tray | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) |
Diferenciadores clave
- AEC-Q100 automotive qualification in a compact BGA (frente a DSPIC33EP256MU810T-I/BG)
- Space-efficient 121-ball TFBGA footprint (frente a DSPIC33EP256MU810T-E/PT)
- Cost-optimized 256KB Flash point (frente a DSPIC33EP512MU810T-E/BG)
Notas de diseño
The 121-TFBGA package uses a fine-pitch ball grid that requires reflow assembly and X-ray or acoustic inspection for solder-joint quality - standard AOI cannot see under the die. Follow Microchip's package outline drawing for ball land pattern dimensions, and route the ball fan-out per the datasheet multiplexing table before locking your schematic symbol. Escape routing typically requires via-in-pad or 0.2 mm trace/space on at least the two outermost ball rows; plan board stackup accordingly.
Supply the device from a clean 3.0V to 3.6V rail; use a low-ESR LDO such as the MCP1700 family or a buck converter followed by an LDO if source efficiency matters. Decouple every VDD/VSS ball pair with 100 nF ceramics placed as close as the ball-out allows, plus bulk 10 uF near the supply entry. Add a dedicated ferrite or RC filter for the analog supply if the advanced analog peripherals are used, since digital core switching noise couples through shared supply impedance and degrades ADC accuracy.
Estimated: the E-grade rating guarantees operation to +125C ambient, so budget junction temperature early. With theta-JA for a 10x10 mm TFBGA typically in the 40-60 C/W range over a standard 4-layer JEDEC board (verify the exact value in the datasheet thermal tables), a worst-case core plus peripheral current in the tens-of-mA range produces only a few degrees of rise; the real thermal risk is board-level heat soak from adjacent motor-driver or LED power stages, so keep the DSC away from hot spots or add thermal vias.
The /BG (BGA) and /PT (TQFP) variants are the same die but are NOT interchangeable on the same PCB - do not treat them as drop-ins across footprints. Also note the T suffix is a packaging indicator (Tape & Reel), not an electrical variant. Finally, some third-party aggregator pages list conflicting data (one lists the part as '8-bit'); trust the DigiKey and Microchip sources confirming a 16-bit dsPIC33E core at 60 MIPs, and always validate register-level details against the official Microchip datasheet rather than aggregators.
Información de cumplimiento
AEC-Q100 qualification explicitly stated by Microchip USA and findic product listings. RoHS/REACH/lead-free statements not present in the provided verified data - confirm on the Microchip product page compliance documents.
