DSPIC33EP256GM310-E/BG - 16-bit 60 MIPS DSC 256KB Flash | Microchip
N.º de pieza: DSPIC33EP256GM310-E/BG ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $8.95 | $8,95 |
| 10 | $8.15 | $81,50 |
| 100 | $7.35 | $735,00 |
| 500 | $6.65 | $3.325,00 |
| 1.000 | $6.05 | $6.050,00 |
DSPIC33EP256GM310-E/BG Descripción general
A digital signal controller combines the computational throughput of a digital signal processor with the peripheral integration and control architecture of a microcontroller. Within the power-management hierarchy of embedded systems, a DSC such as the dsPIC33EP sits above generic MCUs for control loops requiring fast math - motor FOC, digital power conversion, and sensor fusion - while remaining a single-chip solution with on-chip Flash, RAM, ADC, PWM, and communication peripherals.
Key features include the 16-bit dsPIC33E core with DSP engine supporting MAC and barrel shifter instructions, 256KB of self-programmable Flash with ECC, integrated peripherals per distributor listings (12 motor-control channels, 8 input capture and 8 output compare channels, 4 QEI modules, and 2 operational amplifiers), and AEC-Q100 automotive qualification. The -E suffix designates the extended temperature range of -40C to +125C, sunder harsh industrial and automotive environments.
Architecturally, the dsPIC33EP family uses an enhanced Harvard architecture with a 24-bit instruction word, enabling single-cycle DSP multiply-accumulate operations. The supply range is 3.0V to 3.6V with a 3.3V nominal rail, and the 121-TFBGA ball-grid package provides high I/O density in a 10x10 mm footprint suitable for space-constrained motor drives and digital power supplies.
Typical applications include precision brushless DC and PMSM motor control, digital SMU/SMPS power conversion, automotive body and powertrain auxiliary control, and industrial sensing and actuation nodes requiring deterministic DSP-grade loop closure.
Design consideration: the TFBGA package requires careful PCB fanout - use via-in-pad or 4-layer stackups with dedicated ground planes; and confirm ECC configuration of Flash for functional-safety designs.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para DSPIC33EP256GM310-E/BG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con DSPIC33EP256GM310-E/BG (mismo factor de forma y huella) — difiere en Core, Input Capture / Output Compare, Program Memory Size, Motor Control PWM Channels, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
DSPIC33EP512GM310-E/BG
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$5.95 / unidad
Ver hoja de datos →DSPIC33EP256GM310-I/BG
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
Consulte el precio
Ver hoja de datos →DSPIC33EP512GM310-I/BG
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$6.2 / unidad
Ver hoja de datos →DSPIC33EP256GM310-E/BG Valores máximos y características eléctricas
| Core Processor | dsPIC33EP 16-bit DSC |
| Core Size | 16-bit |
| Frecuencia de reloj máxima | 60 MHz |
| Performance | 60 MIPS |
| Program Memory Size | 256KB (85.5K x 24) Flash |
| RAM Size | 16KB |
| Supply Voltage Range | 3.0 V to 3.6 V |
| Supply Voltage Nominal | 3.3 V |
| Rango de temperatura de funcionamiento | -40C to +125C |
| Encapsulado | 121-TFBGA (10x10 mm) |
| Tipo de montaje | Surface Mount |
| Motor Control Channels | 12 MC |
| Input Capture / Output Compare | 8/8 IC/OC |
| Quadrature Encoder Interfaces | 4 QEI |
| Integrated Operational Amplifiers | 2 OpAmp |
| Qualification | Automotive, AEC-Q100 |
| Series | dsPIC 33EP |
| Packaging | Tray |
Guía de configuración de pines de DSPIC33EP256GM310-E/BG 121-tfbga (10x10 mm)
Configuración de pines para DSPIC33EP256GM310-E/BG (encapsulado 121-tfbga (10x10 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para DSPIC33EP256GM310-E/BG.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
DSPIC33EP256GM310-E/BG es adecuado para 6 aplicacións: Precision BLDC/PMSM Motor Control, Digital Power Conversion (SMPS/PFC), Automotive Auxiliary Motor and Body Control, Industrial Sensing and Condition Monitoring, Embedded Audio and Signal Generation, Robotics and Motion-Axis Control.
Precision BLDC/PMSM Motor Control
The DSPIC33EP256GM310-E/BG is purpose-built for field-oriented control (FOC) of brushless DC and permanent magnet synchronous motors. Its 60 MIPS DSP core executes single-cycle multiply-accumulate instructions for the Clarke/Park transforms and current-loop PI controllers, while 12 motor-control PWM channels drive three-phase inverters with complementary outputs and dead-time insertion. The four QEI modules interface directly with incremental encoders for position feedback, and the two on-chip op amps condition shunt-resistor current signals before the ADC, eliminating external amplifiers. In a 10x10 mm 121-TFBGA footprint, the entire controller fits under the inverter gate-driver array, shortening high-current gate loops and improving EMI performance in industrial drives and e-mobility auxiliary motors.
Recomendado
Digital Power Conversion (SMPS/PFC)
In digitally controlled switched-mode power supplies and power factor correction stages, the DSPIC33EP256GM310-E/BG closes current- and voltage-mode loops at switching frequencies of 100 kHz to several hundred kHz. The 60 MIPS core services control interrupts with sub-microsecond latency, high-resolution PWM outputs adjust duty cycles with fine granularity, and the fast 16-bit ADC synchronized to the PWM trigger samples inductor current at the optimal point in each switching cycle, minimizing switching-noise corruption. The -40C to +125C extended temperature rating keeps loop components in specification inside sealed telecom rectifiers and server power shelves. Firmware-based control also enables adaptive mode switching between buck, boost, and LLC operating regions without hardware changes.
Recomendado
Automotive Auxiliary Motor and Body Control
With AEC-Q100 qualification and a -40C to +125C operating range, the DSPIC33EP256GM310-E/BG targets automotive auxiliary actuators: electric water pumps, turbocharger actuators, HVAC blowers, throttle bodies, and cooling fans. The 121-ball TFBGA conserves board area in compact actuator electronics, while integrated QEI modules read positional feedback from brushed or brushless actuator encoders. On-chip op amps reduce BOM cost in current-sense paths, and the 256KB Flash accommodates diagnostic stacks and OEM-specific firmware with room for field updates. Functional behavior remains deterministic across the full automotive voltage and temperature envelope, which is essential for modules placed near the engine or inside the passenger compartment under solar load.
Recomendado
Industrial Sensing and Condition Monitoring
The DSPIC33EP256GM310-E/BG serves as the compute node in industrial condition-monitoring and precision sensing equipment. Its DSP engine performs real-time FFT and digital filtering on vibration or acoustic sensor streams, while 16KB of RAM buffers spectral windows for burst analysis. Multiple IC/OC channels timestamp external events such as proximity-switch pulses, and the extended -125C rating supports monitoring inside enclosures mounted on motors, gearboxes, or injection-molding machines. The 3.3V rail simplifies interfacing with standard industrial analog front ends and isolation barriers. Firmware-based DSP avoids a second DSP chip, reducing BOM count and qualification effort in modular sensor designs deployed across large machinery fleets.
Recomendado
Embedded Audio and Signal Generation
The dsPIC33EP DSP engine supports audio-band processing such as active noise cancellation feed-forward filters, tone generation, and test-signal synthesis. The 60 MIPS core sustains multiple biquad IIR filter sections per sample period at 48 kHz sampling, and the 256KB Flash stores large wavetable and coefficient sets. The eight output-compare channels can generate precisely timed PWM-based analog outputs for actuators or alerting devices, while the on-chip op amps buffer DAC-derived signals to drive low-impedance loads. In the -40C to +125C grade, the part operates in outdoor kiosks, industrial intercoms, and heavy-equipment alarm systems where consumer audio processors would exceed their temperature ratings.
Recomendado
Robotics and Motion-Axis Control
In multi-axis robotic and motion-control systems, the DSPIC33EP256GM310-E/BG controls individual servo axes with encoder feedback via its four QEI modules. Each axis closes a current loop at tens of kilohertz and a velocity/position loop on top, using the DSP MAC unit for cascade PID with anti-windup. Twelve motor-control PWM channels allow dual three-phase bridges from a single device, enabling two-axis boards with one controller. The 121-TFBGA's dense ball array keeps I/O routing compact on 4-layer servo boards, and the AEC-Q100 rating permits deployment in collaborative robots and automated guided vehicles subject to automotive-reliability procurement standards. 256KB Flash holds trajectory profiles locally, reducing bus traffic in distributed motion architectures.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para DSPIC33EP256GM310-E/BG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | DSPIC33EP512GM310-E/BG | DSPIC33EP256GM310-I/BG | DSPIC33EP512GM310-I/BG |
|---|---|---|---|---|
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 256KB (85.5K x 24) | 512KB | 256KB | 512KB |
| RAM | 16KB | 16KB | 16KB | 16KB |
| Core Performance | 60 MIPS, 16-bit dsPIC33EP | 60 MIPS, 16-bit | 60 MIPS, 16-bit | 60 MIPS, 16-bit |
| Operating Temperature | -40C to +125C (Extended, -E) | -40C to +125C | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Peripheral Set (MC/IC/OC/QEI/OpAmp) | 12 MC, 8/8 IC/OC, 4 QEI, 2 OpAmp | Same peripheral set | Same peripheral set | Same peripheral set |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
Diferenciadores clave
- Extended -40C to +125C temperature grade in standard ordering code (frente a DSPIC33EP256GM310-I/BG)
- AEC-Q100 automotive qualification (frente a Generic industrial 16-bit MCUs)
- Dense 121-TFBGA integration versus smaller family members (frente a DSPIC33EP256GM306)
Notas de diseño
The 121-TFBGA (10x10 mm, 0.8 mm ball pitch typical for this family) requires a fanout-aware layout: plan a 4-layer stackup with a dedicated unbroken ground plane, use via-in-pad or dog-bone fanout, and keep the BGA escape region free of other tall components to allow inspection and rework. Follow IPC BGA land-pattern guidance and verify the exact ball pitch and land diameter in the Microchip package outline drawing before generating the footprint - do not copy footprints from other BGA families.
Decouple each VDD/VSS ball pair with 0.1 uF ceramics placed as close to the balls as the fanout allows, plus bulk 10 uF near the package. The 3.0V to 3.6V supply must remain within tolerance under peak core current during 60 MIPS DSP operation - size the regulator for the datasheet maximum IDD plus peripheral loads. Provide independent, quiet analog supply routing for the ADC and on-chip op amps; motor-control PWM switching noise coupled into analog supplies degrades current-sense accuracy.
Estimated: a 121-ball BGA at 60 MIPS with heavy motor-control activity dissipates on the order of a few hundred milliwatts. For an approximate junction rise, use theta-JA from the Microchip package thermal appendix (value depends on board stackup) with your actual measured supply current; e.g., 300 mW at 40 C/W yields roughly a 12C rise. Ensure ambient plus rise stays below 125C for the -E grade, derating for solar load or enclosure stagnation in automotive pump and blower installations.
Do not assume the 256KB Flash is fully available for code: configuration words, the boot segment, and EEPROM emulation reserve portions of the address map. Write-protect and code-protect configuration must be set deliberately, since defaults permit external reads. Also confirm that the -E temperature variant is ordered when the system must operate above +85C - the industrial -I variant is footprint-identical and a common mis-BOM error that causes field failures in under-hood-adjacent modules.
Información de cumplimiento
Automotive AEC-Q100 qualification explicitly listed in distributor data (Hotenda/Octopart). RoHS and lead-free status per standard Microchip commercial environmental policy for active dsPIC33EP parts; REACH/halogen-free/conflict-minerals declarations should be obtained from Microchip product environmental documentation.
