DSPIC33EP512GP504T-E/TL - 16-bit 60 MIPS DSC 512KB | Microchip
N.º de pieza: DSPIC33EP512GP504T-E/TL ✓ Activo| Cant. | Precio unitario | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
DSPIC33EP512GP504T-E/TL Descripción general
A digital signal controller is a hybrid device that merges the deterministic control of a microcontroller with the math throughput of a DSP. Within the power-management hierarchy, the dsPIC33EP family sits alongside 16-bit MCUs in the broader microcontroller and embedded processor category, and is commonly deployed as the main control IC in motor drives, digital power supplies, and sensing systems.
Key features include the 16-bit dsPIC core delivering up to 60 MIPS in this speed grade, 512KB of self-programmable FLASH with ECC-style endurance, and rich analog and connectivity peripherals: CAN 2.0B, multiple UARTs, SPI and I2C ports, op amps, comparators, and a CTMU charge-time-measurement unit. A Peripheral Trigger Generator (PTG) automates peripheral sequencing to offload the CPU. Four DMA channels accelerate data movement between peripherals and the 24K x 16 RAM block.
Architecturally, the dsPIC33EP uses a modified Harvard pipeline with DSP multiply-accumulate instructions, hardware division support, and flexible clocking via PLL from an internal or external source. Supply voltage range is 3.0V to 3.6V with a maximum supply current around 55 mA, and the E-grade temperature rating supports extended industrial environments.
Typical applications include automotive body and powertrain subsystems (leveraging AEC-Q100 qualification and CAN), industrial motor control using the DSP MAC engine, and digital power conversion where the ADC plus PTG closes control loops deterministically.
Design consideration: this T-suffix tape-and-reel ordering code targets automated assembly; verify the 44-VTLA footprint land pattern and exposed-pad thermal design before layout, since the 6x6 mm QFN-family package dissipates heat primarily through the PCB.
This page synthesizes distributor pricing context, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para DSPIC33EP512GP504T-E/TL — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con DSPIC33EP512GP504T-E/TL (mismo factor de forma y huella) — difiere en Package, Operating Temperature, RAM, Connectivity, Core Architecture.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
DSPIC33EP256MC504T-I/TL
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$3.32 / unidad
Ver hoja de datos →DSPIC33EP512MC504-E/TL
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$4.98 / unidad
Ver hoja de datos →DSPIC33EP512GM304-I/ML
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
Consulte el precio
Ver hoja de datos →DSPIC33EP512GP504T-E/TL Valores máximos y características eléctricas
| Core | dsPIC 33EP 16-bit |
| Maximum Speed | 60 MIPs |
| Program Memory Size | 512KB (170K x 24) FLASH |
| RAM Size | 24K x 16 |
| Supply Voltage Range | 3.0 V to 3.6 V |
| Maximum Supply Current | 55 mA |
| Connectivity | CANbus, I2C, IrDA, LINbus, SPI, UART/USART |
| DMA Channels | 4 |
| Timers | 5 |
| Encapsulado | 44-VTLA (6x6 mm) |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40C to +125C (E grade) |
| Qualification | AEC-Q100 qualified |
| Technology | CMOS |
| Peripheral Features | Op amps, comparators, CTMU, PTG |
| Packaging | Tape & Reel (T suffix) |
Guía de configuración de pines de DSPIC33EP512GP504T-E/TL 44-vtla (6x6 mm)
Configuración de pines para DSPIC33EP512GP504T-E/TL (encapsulado 44-vtla (6x6 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para DSPIC33EP512GP504T-E/TL.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
DSPIC33EP512GP504T-E/TL es adecuado para 6 aplicacións: Automotive Body and Powertrain Nodes, Industrial Motor Control, Digital Power Conversion, Sensor Acquisition and Conditioning, Industrial Networking and Gateways, Test and Measurement Instrumentation.
Automotive Body and Powertrain Nodes
The AEC-Q100 qualification and -40C to +125C E-grade rating of the DSPIC33EP512GP504T-E/TL make it a natural fit for automotive electronic control units. The integrated CAN 2.0B module handles in-vehicle networking at up to 1 Mbps while the 60 MIPs DSP core executes control loops and diagnostic routines concurrently. With 512KB of FLASH, the device accommodates fault-logging, bootloaders, and dual-bank firmware schemes. The CTMU supports capacitive touch or time-of-flight sensing for switch panels and level sensors, and the 3.0V-3.6V supply range matches standard automotive 3.3V logic rails with load-dump-conditioned regulation.
Recomendado
Industrial Motor Control
The dsPIC33EP core's hardware DSP multiply-accumulate engine executes field-oriented control (FOC) and PI loops deterministically at 60 MIPs, while the PTG (Peripheral Trigger Generator) sequences ADC sampling and PWM updates without CPU intervention, reducing loop jitter. Although the GP variant lacks the MC family's dedicated motor-control PWM, its 5 timers and DMA channels still support complementary PWM generation for BLDC and PMSM drives. The 24K x 16 RAM holds current-loop state variables and lookup tables, and on-chip comparators can implement hardware overcurrent shutdown with sub-microsecond response independent of firmware latency.
Recomendado
Digital Power Conversion
In digital AC-DC and DC-DC converters, the DSPIC33EP512GP504T-E/TL closes voltage and current loops using its high-speed ADC triggered by the PTG, achieving deterministic sampling aligned to the switching period. The DSP MAC instructions compute compensator equations each cycle, and 512KB FLASH leaves room for adaptive control algorithms, power-metering code, and communication stacks on one chip. The on-chip op amps can buffer current-shunt signals, reducing external component count. At a 3.0V-3.6V supply with 55 mA maximum current, the controller fits efficiently into the housekeeping power budget of a switching converter.
Recomendado
Sensor Acquisition and Conditioning
The CTMU (Charge Time Measurement Unit) enables capacitive sensing and ultra-low-current time-domain measurements, while the on-chip op amps and comparators condition analog signals before the internal ADC. Four DMA channels stream conversion results into the 24K x 16 RAM without CPU overhead, sustaining high sample-rate acquisition. With 512KB of FLASH, calibration tables, linearization curves for thermistors or pressure sensors, and a UART or I2C report stack coexist in one device. The 60 MIPs headroom supports real-time digital filtering (IIR/FIR) on the raw stream before transmission over SPI or UART to a host.
Recomendado
Industrial Networking and Gateways
With simultaneous CAN, SPI, multiple UART/USART, I2C, LINbus, and IrDA interfaces, the DSPIC33EP512GP504T-E/TL serves as a protocol converter or gateway between dissimilar industrial buses. The 60 MIPs core sustains concurrent stack processing - for example CAN-to-UART bridging with framing and CRC - while DMA offloads byte transfers. The extended temperature rating allows deployment in unconditioned factory enclosures, and AEC-Q100 qualification provides an additional reliability margin. 512KB FLASH stores multiple protocol stacks and firmware-update capability via a CAN or UART bootloader implemented in self-programmable memory.
Recomendado
Test and Measurement Instrumentation
Bench and portable instruments benefit from the device's deterministic 60 MIPs control, PTG-driven ADC sequencing, and DSP math for waveform processing such as RMS computation and FFT pre-processing. The CTMU provides precision timing measurement for time-interval applications, and the 512KB FLASH supports rich UI code, multiple measurement profiles, and logging. Multiple UART/SPI/I2C ports interface displays, front-panel encoders, and PC connectivity simultaneously. The 44-VTLA 6x6 mm package keeps board area small in handheld formats, while the -40C to +125C range suits industrial field instruments exposed to temperature extremes.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para DSPIC33EP512GP504T-E/TL — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | DSPIC33EP256MC504T-I/TL | DSPIC33EP512MC504-E/TL | DSPIC33EP512GM304-I/ML |
|---|---|---|---|---|
| Package | 44-VTLA (6x6) | 44-VTLA (6x6) - same | 44-VTLA (6x6) - same | 44-QFN 6x6 (ML) - same footprint family |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 60 MIPs | 60 MIPs | 60 MIPs | 60 MIPs |
| FLASH Program Memory | 512KB (170K x 24) | 256KB (85K x 24) | 512KB (170K x 24) | 512KB (170K x 24) |
| Peripheral Family | GP (General Purpose) | MC (Motor Control) | MC (Motor Control) | GM (General + dual CAN) |
| Temperature Range | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) |
Diferenciadores clave
- Doubled program memory versus halved-cost variant (frente a DSPIC33EP256MC504T-I/TL)
- Extended -40C to +125C E-grade rating (frente a DSPIC33EP256MC504T-I/TL)
- General Purpose peripheral set vs Motor Control set (frente a DSPIC33EP512MC504-E/TL)
Notas de diseño
The 44-VTLA 6x6 mm QFN-family package dissipates heat primarily through its exposed pad and the PCB. Estimated: at 55 mA maximum supply current on a 3.3V rail, core power is about 0.18W, which is modest, but I/O drive current adds to this. Provide a solid via array (minimum 4-6 vias) from the exposed pad to a ground plane of at least 2 square cm to keep junction temperature within the E-grade envelope at 125C ambient. Follow Microchip's QFN land-pattern recommendations for solder paste stencil design.
Design the 3.3V rail for the full 55 mA maximum supply current plus I/O source/sink current, then add margin for FLASH programming current during self-write operations. Decouple each VDD pin with 0.1uF ceramic capacitors placed within 2 mm of the pin, plus one 4.7uF-10uF bulk capacitor. If the on-chip regulator (VCAP) is used per the family reference manual, fit the specified low-ESR capacitor on VCAP - omitting or undersizing it is a common cause of erratic reset behavior.
Do not treat the /TL (VQFN) and /PT (TQFP) variants as interchangeable on the same board - they share the die but not the footprint. Also note the family documentation may state RAM as 48KB (byte-oriented view) versus 24K x 16 (word-oriented view); both describe the same physical memory, so size your linker script against the word-oriented figure. For PP (in-circuit) programming, reserve the ICSP pins and keep trace stubs short to maintain programming reliability with inductance in circuit.
Información de cumplimiento
AEC-Q100 qualification explicitly stated by Microchip USA product data. RoHS/REACH/lead-free status not stated in the provided verified data.
