DSPIC33EV256GM003-E/M5 - 16-bit 60MIPS 5V DSC 256KB | Microchip
N.º de pieza: DSPIC33EV256GM003-E/M5 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $5.37 | $5,37 |
| 10 | $4.85 | $48,50 |
| 100 | $4.36 | $436,00 |
| 500 | $3.95 | $1.975,00 |
| 1.000 | $3.58 | $3.580,00 |
DSPIC33EV256GM003-E/M5 Descripción general
A digital signal controller combines the computational throughput of a DSP engine with the peripheral integration and deterministic control flow of a microcontroller, sitting within the broader hierarchy of semiconductor devices: DSC -> microcontroller -> embedded processor -> integrated circuit. The dsPIC33EV family extends this concept with a 5V-tolerant core, reducing component count in harsh electrical environments where 3.3V-only MCUs require level shifting and protection circuitry.
Key features include the 5V operating core that directly interfaces with automotive sensors and industrial 5V logic, six motor control PWM channels with dead-time insertion for inverter and BLDC control, three on-chip operational amplifiers that offload external signal conditioning, a Charge Time Measurement Unit (CTMU) for capacitive touch and time-domain measurements, and a SENT peripheral for automotive sensor networks. The 256KB ECC Flash provides single-bit error correction for functional-safety designs, and the device is designated for Microchip's Functional Safety (FuSa) support ecosystem.
Architecturally, the dsPIC DSC core pairs a 16-bit modified Harvard pipeline with a DSP multiply-accumulate engine, 40-bit wide accumulators, and single-cycle MAC operation, enabling control-loop execution at deterministic timing margins suitable for field-oriented motor control and digital power conversion.
Typical applications include automotive sensor and touch control units, BLDC/PMSM motor drives, industrial appliances exposed to electrical noise, and battery-management or power-conversion nodes where 5V noise immunity is a differentiator.
Design consideration: the 36-UQFN exposed-pad package requires a solid ground via array on the PCB land pattern for thermal dissipation and signal-integrity; budget decoupling capacitors within 2 mm of the VDD pins.
This page synthesizes distributor pricing, pin-compatible family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas directas para DSPIC33EV256GM003-E/M5 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con DSPIC33EV256GM003-E/M5 (mismo factor de forma y huella) — difiere en Motor Control PWM, Supply Voltage, Core, Operating Temperature, Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
DSPIC33EV256GM003-I/M5
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$3.35 / unidad
Ver hoja de datos →DSPIC33EV128GM103T-I/M5
✅ Sustitución directa✓ En stock
$3.52 / unidad
Ver hoja de datos →DSPIC33EV128GM103-E/M5
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
DSPIC33EV64GM103-I/M5
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$3.1 / unidad
Ver hoja de datos →DSPIC33EV256GM003-E/M5 Valores máximos y características eléctricas
| Core | dsPIC 33EV 16-bit |
| Core Speed | 60 MIPS (120 MHz internal) |
| Tensión de alimentación | 5 V |
| Flash Memory | 256 KB (85.5K x 24), ECC |
| RAM | 16 KB |
| Encapsulado | 36-UQFN (5x5 mm) exposed pad |
| Temperatura de funcionamiento | -40C to +125C (E grade) |
| Motor Control PWM | 6 channels (MC PWM) |
| On-chip Op Amps | 3 |
| CTMU | Yes (Charge Time Measurement Unit) |
| SENT Peripheral | Yes |
| Qualification | AEC-Q100 automotive, Functional Safety (FuSa) |
| Application Class | Automotive, Industrial, Appliance |
| Tipo de montaje | Surface Mount |
| Terminal Form | No lead (HVQCCN, square) |
| Number of Terminals | 36 |
Guía de configuración de pines de DSPIC33EV256GM003-E/M5 36-uqfn (5x5 mm) exposed pad
Configuración de pines para DSPIC33EV256GM003-E/M5 (encapsulado 36-uqfn (5x5 mm) exposed pad). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para DSPIC33EV256GM003-E/M5.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
DSPIC33EV256GM003-E/M5 es adecuado para 6 aplicacións: Automotive Sensor and Touch Control Units, BLDC and PMSM Motor Drives, Industrial Appliances in Harsh Environments, Digital Power Conversion, On-Board Chargers and Battery Management, Capacitive Touch Human-Machine Interfaces.
Automotive Sensor and Touch Control Units
The DSPIC33EV256GM003-E/M5 fits automotive sensor and touch control nodes because it is AEC-Q100 qualified, rated -40C to +125C, and its 5V core talks directly to ratiometric automotive sensors without level-shifting stages. The integrated CTMU provides charge-time measurement for capacitive touch interfaces tolerant of glove and moisture conditions, while the SENT peripheral implements the single-edge-nibble transmission protocol used by modern automotive sensor links, offloading the main control loop. Typical deployments include seat-occupation modules, HVAC touch panels, and rotary-encoder interfaces exposed to vibration and conducted transients. The 256KB ECC Flash protects firmware integrity against single-bit upsets, and Microchip's Functional Safety ecosystem provides documentation for ISO 26262-aligned development. Cost benefit: the three on-chip op amps and rich analog mix remove several external components per node.
Recomendado
BLDC and PMSM Motor Drives
Motor control is the flagship application for the dsPIC33EV family; Microchip titles the datasheet "5V Robust DSC with Safety Motor Control." The DSPIC33EV256GM003-E/M5 delivers six motor-control PWM channels with complementary outputs and dead-time insertion for three-phase inverters, while the 60 MIPS DSP MAC engine executes field-oriented control loops with single-cycle multiply-accumulate and 40-bit accumulators, keeping FOC cycle times deterministic. The three integrated op amps buffer low-side current-shunt signals directly, cutting an external quad op-amp from the BOM, and the 5V rail improves ADC noise margin in electrically noisy drive enclosures. The 256KB ECC Flash stores sensorless algorithms plus bootloader and diagnostics with margin to spare. Design attention should focus on PWM-to-ADC trigger synchronization and proper dead-time calibration for the chosen power stage.
Recomendado
Industrial Appliances in Harsh Environments
Microchip explicitly positions the 5V dsPIC33EV family for harsh-environment appliances such as dishwashers, cooktops, and power tools, where motor commutation noise, mains coupling, and vibration stress conventional 3.3V controllers. The DSPIC33EV256GM003-E/M5's 5V supply rides through noisy ground environments with larger noise margins, and the -40C to +125C E-grade envelope covers proximity to heating elements and motor windings. On-chip peripherals handle the full appliance control stack: MC PWM for universal-motor or inverter drives, CTMU for capacitive touch user interfaces that work through wet or gloved fingers, and op amps for temperature and current conditioning. The 36-UQFN 5x5 mm footprint suits compact main-control PCBs. ECC Flash plus Microchip FuSa support lets appliance makers pursue safety-standard certification on the control electronics.
Recomendado
Digital Power Conversion
In digital power supplies, LLC converters, PFC stages, and solar micro-inverters, the DSPIC33EV256GM003-E/M5 acts as the digital compensator and PWM sequencer. High-resolution MC PWM edges enable precise duty-cycle and phase-shift control with dead-time windows accurate to nanoseconds, while the DSP engine executes the control-law arithmetic - proportional-integral compensators with feedforward - inside switching-period deadlines at 60 MIPS. The 5V I/O simplifies interface to gate-driver logic levels common in power designs, and the ADCs can be triggered by PWM events for cycle-by-cycle current limiting. The 256KB ECC Flash accommodates complex firmware including state machines, communication stacks, and datalogging for field diagnostics. Thermal layout and high-frequency grounding are the dominant design concerns; the exposed pad must bond to a quiet power-ground plane.
Recomendado
On-Board Chargers and Battery Management
Automotive and industrial battery systems benefit from the DSPIC33EV256GM003-E/M5's combination of AEC-Q100 qualification, 5V noise robustness, and analog integration. The three op amps condition cell-voltage or shunt-current signals, the high-resolution MC PWM drives the charger power stage with synchronized rectification, and SENT support interfaces with battery-pack sensor nodes reporting pack state over the automotive SENT bus. The CTMU can perform precise time-domain measurements used in some impedance-estimation schemes for state-of-health monitoring. With 60 MIPS of DSP throughput, real-time pack balancing and charging-profile state machines execute comfortably, and the 256KB ECC Flash leaves room for OTA bootloader images and datalogging buffers. The -40C to +125C range covers under-hood and underbody mounting locations without derating the 60 MIPS performance ceiling.
Recomendado
Capacitive Touch Human-Machine Interfaces
The DSPIC33EV256GM003-E/M5 serves touch-driven HMI panels in appliances, industrial equipment, and automotive interiors. Its CTMU (Charge Time Measurement Unit) measures capacitance changes on electrode pads with sub-picofarad resolution, and Microchip's touch libraries implement self-capacitance and mutual-capacitance scanning with drift compensation, water-tolerance algorithms, and glove-mode thresholds. Because scanning runs on the 60 MIPS core while a host control loop executes concurrently, one chip replaces a separate touch controller in cost-sensitive designs. The 5V environment - common in appliance panels - and the -40C to +125C E-grade rating allow the same device to drive relays or LEDs behind the touch UI. The 256KB Flash stores tuning tables, multi-language graphics strings, and communication firmware with substantial headroom for product variants on one PCB.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para DSPIC33EV256GM003-E/M5 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | DSPIC33EV256GM003-I/M5 | DSPIC33EV128GM103T-I/M5 | DSPIC33EV128GM103-E/M5 | DSPIC33EV64GM103-I/M5 |
|---|---|---|---|---|---|
| Package | 36-UQFN (5x5) | 36-UQFN (5x5) - same | 36-UQFN (5x5) - same | 36-UQFN (5x5) - same | 36-UQFN (5x5) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256 KB ECC | 256 KB ECC | 128 KB ECC | 128 KB ECC | 64 KB ECC |
| RAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Core Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +85C (I grade) |
| Analog Peripherals | 3 op amps, CTMU, SENT | 3 op amps, CTMU, SENT | 3 op amps, CTMU, SENT | 3 op amps, CTMU, SENT | 3 op amps, CTMU, SENT |
Diferenciadores clave
- 256KB ECC Flash with functional-safety support (frente a DSPIC33EV128GM103T-I/M5)
- Extended +125C automotive rating (frente a DSPIC33EV256GM003-I/M5)
- 5V direct sensor interface with integrated analog (frente a DSPIC33EV64GM103-I/M5)
Notas de diseño
The 36-UQFN 5x5 mm exposed-pad package requires the thermal pad land pattern to be connected to the ground plane through a 3x3 (or denser) via array, per Microchip UQFN layout guidelines. The exposed pad is the primary ground return for the die; leaving it unconnected causes ground bounce during simultaneous PWM switching and degrades ADC accuracy. Use non-solder-mask-defined (NSMD) pads with solder paste aperture ratios of 80-90% per pad, and verify stencil thickness (typically 0.1-0.125 mm) to avoid bridging the 0.5 mm pin pitch.
Estimated: the dsPIC33EV core at 60 MIPS draws on the order of tens of milliamps at 5V (per family datasheet current-consumption tables) - meaning roughly 100-200 mW of internal dissipation, well within the UQFN package capability at +125C ambient. The greater thermal risk comes from I/O pin current driving LEDs or gate transformers; keep total package power within the datasheet theta-JA derating curve for your PCB copper area. Budget at least 2x2 cm of continuous copper for worst-case +125C automotive deployments.
Do not mix temperature grades on the same board revision without re-verifying the firmware margin: the -E part is certified to +125C while -I parts top out at +85C, and mismatched grades in one production batch create field-failure modes. Additionally, since this MPN carries ECC Flash, remember that Flash erase/write endurance and ECC overhead differ from non-ECC dsPIC33E parts; verify configuration words and Flash programming routines against the dsPIC33EV family datasheet rather than copying from a dsPIC33EP project.
Place 0.1 uF ceramic decoupling capacitors within 2 mm of each VDD pin pair, plus one 4.7-10 uF bulk capacitor near the package. Route motor-control PWM outputs away from analog op-amp input traces on the 5x5 mm breakout fanout; use ground guard traces between the two. For SENT and CTMU lines, minimize stub length because CTMU charge-time accuracy is sensitive to parasitic capacitance on the measurement node.
Información de cumplimiento
AEC-Q100 automotive qualification and Functional Safety (FuSa) designation confirmed by DigiKey, Mouser, and Microchip listings. RoHS/REACH status not stated in the retrieved data - confirm on the Microchip product page or certificate of compliance.