DSPIC33EV256GM003-I/M5 - 16-bit 70 MIPS DSC 256KB Flash | Microchip
MPN: DSPIC33EV256GM003-I/M5 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.2 | $5.20 |
| 10 | $4.68 | $46.80 |
| 100 | $4.16 | $416.00 |
| 500 | $3.74 | $1,870.00 |
| 1,000 | $3.35 | $3,350.00 |
DSPIC33EV256GM003-I/M5 Overview
A digital signal controller combines the computational throughput of a digital signal processor (DSP) with the peripheral integration and control architecture of a microcontroller (MCU). Within the power management hierarchy, the dsPIC33EV family sits in Microchip's 16-bit dsPIC33E line, positioned above general-purpose PIC16/PIC18 MCUs and optimized for closed-loop control loops and harsh-environment sensing.
Key features include a 5V-tolerant design rated for harsh environments, six motor control PWM channels (6 MC PWM), three integrated operational amplifiers, a Charge Time Measurement Unit (CTMU) for capacitive touch and time-domain measurements, and SENT protocol support for automotive sensor interfaces. ECC Flash provides single-bit error correction for functional-safety-oriented designs, which is why DigiKey classifies the part under Functional Safety (FuSa) microcontrollers.
Architecturally, the device executes the dsPIC33E 16-bit pipeline at up to 70 MIPS, with DSP multiply-accumulate (MAC) instructions and 4 DMA channels enabling efficient filtering, FOC motor control, and sensor-fusion workloads without CPU saturation. On-chip op amps can close current-sense loops internally, reducing external BOM count in motor drives.
Typical applications include brushless DC and PMSM motor control in appliances, automotive sensors and touch/control units, industrial power conversion, and noise/vibration-tolerant embedded control in harsh environments.
Design consideration: the 5V core supply simplifies noise immunity in electrically harsh automotive and appliance environments compared to 3.3V-only MCUs, but verify 5V peripheral signal levels against connected logic.
This page synthesizes distributor pricing, same-footprint alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EV256GM003-I/M5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EV256GM003-I/M5 (same form factor and footprint) — differing in Package, Core, Supply Voltage, Operating Temperature, RAM.
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Request AlternativesDSPIC33EV256GM003-I/M5 Maximum Ratings & Electrical Characteristics
| Core | dsPIC33E 16-bit |
| Max CPU Speed | 70 MIPS (60 MHz per Mouser listing) |
| Program Memory | 256KB (85.5K x 24) ECC Flash |
| RAM | 16 KB |
| Supply Voltage | 4.5 V to 5.5 V (5V DSC) |
| Motor Control PWM | 6 MC PWM |
| Integrated Op Amps | 3 |
| CTMU | Yes (Charge Time Measurement Unit) |
| SENT Support | Yes |
| DMA Channels | 4 |
| Timers | 7 |
| Functional Safety Class | FuSa (per DigiKey classification) |
| Operating Temperature | -40C to +85C (I-grade) |
| Package | 36-UQFN (5x5 mm) with exposed pad |
| Mounting Type | Surface Mount |
| Target Applications | Appliances, industrial, automotive |
DSPIC33EV256GM003-I/M5 36-uqfn (5x5 mm) with exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EV256GM003-I/M5 (36-uqfn (5x5 mm) with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EV256GM003-I/M5.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EV256GM003-I/M5 is suitable for 6 applications: BLDC/PMSM Motor Control, Automotive Sensors and Control Units, Home Appliances, Industrial Power Conversion, Capacitive Touch and HMI, Harsh-Environment Embedded Control.
BLDC/PMSM Motor Control
The DSPIC33EV256GM003-I/M5 is purpose-built for three-phase motor control: its 70 MIPS DSP core executes field-oriented control (FOC) inner loops at 10-20 kHz PWM frequencies with headroom for sensorless observers, while the 6 motor-control PWM channels provide complementary outputs with hardware dead-time for the three-phase inverter bridge. The 3 on-chip operational amplifiers amplify low-side shunt currents internally, eliminating external op amps and shrinking the BOM. Microchip markets this exact family as a '5V Robust DSC with Safety Motor Control'; ECC Flash protects the control firmware against single-bit upsets. Place the UQFN near the gate drivers with short PWM traces to limit ringing.
Recommended
Automotive Sensors and Control Units
Microchip explicitly targets dsPIC33EV GM devices at automotive sensors and touch/control units operating amid noise and vibration. The 4.5V-5.5V supply tolerates automotive load-dump-adjacent conditions better than 3.3V MCUs, and the SENT interface speaks the single-edge-nibble transport protocol common to automotive sensor links. The CTMU supports capacitive-touch HMI panels and precise ratiometric measurements, while the 36-UQFN 5x5 mm footprint fits compact sensor pods. For under-hood placement, pair this -I grade part with the -H/M5 variant rated to 150C. Use SENT and CRC-checked communication to meet diagnostics expectations in body and powertrain nodes.
Recommended
Home Appliances
Appliance motor drives - washing machines, refrigerators, dishwashers, and fans - benefit directly from the dsPIC33EV's 5V robustness, which withstands the conducted noise and voltage sag typical of appliance power electronics. The 70 MIPS core runs single-shunt or three-shunt FOC at 16 kHz PWM, the 3 integrated op amps condition shunt feedback, and ECC Flash preserves firmware integrity over years of compressor cycling. Microchip lists appliances as a flagship dsPIC33EV market. The 5x5 mm UQFN with exposed pad dumps roughly 0.5-1 W into the PCB; provide a solid ground-plane copper area under the exposed pad to keep junction temperatures well below the 125C industrial limit.
Recommended
Industrial Power Conversion
In industrial converters - PFC stages, small inverters, and digital power supplies - the DSPIC33EV256GM003-I/M5 provides deterministic ADC-triggered control loops: the 70 MIPS core and 4 DMA channels move samples without CPU stalls, and 6 MC PWM channels drive interleaved or phase-shifted topologies. The 5V I/O level interfaces cleanly with gate-driver logic and industrial sensors that still use 5V signaling, avoiding level shifters. The 256KB ECC Flash accommodates firmware with logging, diagnostics, and multiple operating profiles. Microchip's harsh-environment qualification covers factory floor vibration and temperature; derate junction temperature targets to 105C for long service life in enclosed industrial cabinets.
Recommended
Capacitive Touch and HMI
The on-chip CTMU (Charge Time Measurement Unit) turns the DSPIC33EV256GM003-I/M5 into a capacitive-touch controller without an external touch IC: charge-time measurements on sensor pads detect touches through glass or plastic overlays, and Microchip's touch libraries implement drift compensation and multi-key scanning. In appliance and automotive control units - where Microchip specifically positions the EV family for 'touch and control units' - the same DSC runs the HMI scan and the application logic, consolidating two chips into one. The 5V supply improves touch SNR in noisy motor-drive environments where 3.3V touch solutions struggle. Budget CPU load for touch scanning alongside control loops, or offload scanning to timer-triggered CTMU conversions.
Recommended
Harsh-Environment Embedded Control
General embedded control in harsh environments - pumps, compressors, agricultural equipment, and outdoor equipment controllers - leverages the dsPIC33EV's 5V noise immunity, -40C to +85C I-grade rating, and ECC Flash. The 70 MIPS core with DSP MAC instructions handles filtering, sensor fusion, and communication stacks concurrently, while 7 timers and 4 DMA channels manage PWM generation, quadrature decoding, and UART/SPI traffic without CPU overhead. The 36-UQFN 5x5 mm package with exposed pad provides low-inductance grounding for noisy power contexts. For extreme ambient locations such as engine bays, substitute the pin-identical -H/M5 variant rated to 150C without any PCB change.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EV256GM003-I/M5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EV256GM003-E/M5 | DSPIC33EV256GM003-H/M5 | DSPIC33EV128GM103T-I/M5 | DSPIC33EP64GP503-I/M5 |
|---|---|---|---|---|---|
| Package | 36-UQFN (5x5 mm) | 36-UQFN (5x5 mm) - same | 36-UQFN/PQCC (5x5 mm) - same | 36-UQFN (5x5 mm) - same | 36-UQFN (5x5 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 256 KB ECC | 256 KB ECC | 256 KB ECC | 128 KB | 64 KB |
| Operating Temperature | -40C to +85C (I) | -40C to +125C (E) | -40C to +150C (H) | -40C to +85C (I) | -40C to +85C (I) |
Key Differentiators
- 256KB ECC Flash in a 36-UQFN 5x5 mm footprint (vs DSPIC33EV128GM103T-I/M5)
- Full EV-family motor-control peripheral set (vs DSPIC33EP64GP503-I/M5)
- Temperature-grade scalability without redesign (vs DSPIC33EV256GM003-H/M5)
Design Notes
The 36-UQFN 5x5 mm package uses an exposed thermal pad that must be soldered to a grounded copper pour for both thermal dissipation and low-inductance grounding. Use a 5x5 array of thermal vias (0.3 mm drill, filled or tented) connecting the pad to inner ground planes. Per standard Microchip QFN layout guidance, keep decoupling capacitors (100 nF plus 10 uF per supply pin) within 2 mm of their pins and route PWM outputs on a layer adjacent to a solid ground plane to limit loop area and motor-drive ringing.
This device runs on 4.5V-5.5V, so all I/O signals swing at 5V logic levels. Do not connect I/O directly to 3.3V-only peripherals or sensor ICs without level shifting or verifying 5V tolerance - this is the most common migration mistake from 3.3V MCUs. Also confirm the exact flash size needed: if firmware plus bootloader approaches 128KB, select the 256KB part (this MPN) rather than the DSPIC33EV128GM103T-I/M5, since re-spinning the board for a larger die later is unnecessary given identical footprints.
Estimated: at 5V and typical DSC operating current of tens of mA (core plus peripherals at 60-70 MIPS, exact figure per datasheet DC characteristics), power dissipation is on the order of 0.2-0.5 W. With the exposed pad properly soldered, the UQFN keeps junction rise modest; verify with the datasheet theta_JA and your airflow condition. For motor-control designs, keep the analog supply (AVDD) filtered with an RC or ferrite from the digital 5V rail so the integrated op amps deliver clean current-sense feedback to the ADC during PWM switching events.
Compliance Information
Compliance statuses were not stated in the verified web data; confirm RoHS/REACH status on the Microchip product page or the distributor environmental datasheet before procurement.
