DSPIC33EV32GM104-I/ML - 16-bit 70 MIPS 5V DSC | Microchip Technology
N.º de pieza: DSPIC33EV32GM104-I/ML ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $4.62 | $4,62 |
| 10 | $4.18 | $41,80 |
| 100 | $3.72 | $372,00 |
| 500 | $3.38 | $1.690,00 |
| 1.000 | $3.05 | $3.050,00 |
DSPIC33EV32GM104-I/ML Descripción general
A digital signal controller combines the computational strengths of a microcontroller (MCU) with the DSP capabilities of a digital signal processor in a single chip. Within the power-management hierarchy of embedded systems, a DSC sits above general-purpose MCUs for control-loop-intensive tasks such as motor control and digital power conversion, offering deterministic interrupt latency, hardware multiply-accumulate (MAC) units, and barrel shifters alongside typical MCU peripherals like UART, SPI, I2C, and timers.
Key features of the DSPIC33EV32GM104 include operation from a single 5V supply (3.0V to 3.6V or 4.5V to 5.5V range per family data sheet), up to 70 MIPS performance at 60MHz, a CAN 2.0B module for automotive and industrial networking, six motor-control PWM channels, three on-chip operational amplifiers, a Charge Time Measurement Unit (CTMU), and SENT peripheral support for automotive sensor interfaces. Error-correcting code (ECC) on Flash enhances reliability in harsh environments, and the device is positioned for Functional Safety (FuSa) development.
Architecturally, the dsPIC33EV core provides a modified Harvard architecture with 16-bit data path and DSP engine, four DMA channels, and seven timers. The 5V tolerant I/O eliminates the need for level shifting against 5V sensors and actuators common in automotive and industrial systems, reducing component count and improving noise immunity.
Typical applications include BLDC and PMSM motor control, automotive body and powertrain adjunct modules, digital power supplies, appliances, and industrial automation nodes that require CAN connectivity and DSP-grade math throughput.
A key design consideration: the 44-QFN exposed pad must be soldered to a grounded copper pour to achieve proper thermal and electrical performance; layout the VDD/VDDCORE decoupling capacitors within 2mm of the pins.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, with pricing verified as of 2026-09-26.
Alternativas directas para DSPIC33EV32GM104-I/ML — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con DSPIC33EV32GM104-I/ML (mismo factor de forma y huella) — difiere en Package, On-chip Op Amps, Operating Temperature, Barrel Shifter, CTMU.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
DSPIC33EV32GM104-E/ML
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
DSPIC33EV32GM104-H/ML
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
DSPIC33EV32GM102-I/ML
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
DSPIC33EV64GM104-I/ML
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$3.11 / unidad
Ver hoja de datos →DSPIC33EV128GM104-E/ML
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →DSPIC33EV256GM104-E/ML
✅ Sustitución directa✓ En stock
$3.9 / unidad
Ver hoja de datos →DSPIC33EV32GM104-I/ML Valores máximos y características eléctricas
| Core | dsPIC33EV 16-bit DSC core |
| Max CPU Speed | 70 MIPS |
| Core Clock | 60 MHz |
| Tensión de alimentación | 5 V (family supports 3.0 V to 3.6 V and 4.5 V to 5.5 V) |
| Flash Program Memory | 32 KB (11K x 24) with ECC |
| RAM | 4 KB |
| CAN | CAN 2.0B module |
| Motor Control PWM | 6 channels (MC PWM) |
| On-chip Op Amps | 3 |
| CTMU | Charge Time Measurement Unit included |
| SENT Peripheral | Yes (automotive sensor interface) |
| DMA Channels | 4 |
| Timers | 7 |
| Barrel Shifter | Yes (DSP engine) |
| Encapsulado | 44-QFN (8x8 mm), exposed pad |
| Tipo de montaje | Surface Mount |
| Terminal Pitch | 0.65 mm |
| Temperatura de funcionamiento | -40C to +85C (I grade) |
| Functional Safety | FuSa-supported part per Microchip |
| Low Power Modes | Supported |
Guía de configuración de pines de DSPIC33EV32GM104-I/ML 44-qfn (8x8 mm), exposed pad
Configuración de pines para DSPIC33EV32GM104-I/ML (encapsulado 44-qfn (8x8 mm), exposed pad). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para DSPIC33EV32GM104-I/ML.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
DSPIC33EV32GM104-I/ML es adecuado para 6 aplicacións: BLDC/PMSM Motor Control, Automotive Body and Sensor Nodes, Digital Power Supplies, Home Appliance Control, Industrial Automation and CAN Nodes, Sensor Signal Conditioning and Measurement.
BLDC/PMSM Motor Control
The DSPIC33EV32GM104-I/ML is a strong fit for brushless DC and permanent-magnet synchronous motor control because it combines a 70 MIPS 16-bit DSP core with six dedicated motor-control PWM channels and three on-chip operational amplifiers for low-cost current-sense amplification. The DSP engine (MAC unit, barrel shifter) executes field-oriented control (FOC) loops deterministically, while the 5V I/O drives gate-driver inputs directly without level shifting. In a typical topology the op amps amplify shunt voltages into the internal 10/12-bit ADC, the MC PWMs stage-commutate the inverter, and CAN 2.0B links the drive to a supervisory bus. The main trade-off versus a dedicated gate-driver-integrated solution is firmware effort, offset by full algorithm flexibility and code portability across the dsPIC33EV memory family.
Recomendado
Automotive Body and Sensor Nodes
This device suits automotive body electronics and sensor-interface nodes because it integrates a CAN 2.0B controller, a SENT peripheral for SAE J2716-style sensor data, and a CTMU for capacitive touch or time-domain measurements - all in a single 5V chip rated -40C to +85C, matching typical in-cabin and body-zone environments. According to Microchip, the dsPIC33EV family is explicitly targeted at harsh automotive and appliance environments. In a typical design the MCU reads SENT-encoded position or pressure sensors, performs filtering and diagnostics on the DSP core, and reports over CAN to the vehicle network. For underhood or extended-temperature zones, select the DSPIC33EV32GM104-E/ML variant rated to +125C while retaining the identical 44-QFN footprint.
Recomendado
Digital Power Supplies
For digitally controlled AC-DC and DC-DC converters, the DSPIC33EV32GM104-I/ML offers the fast 70 MIPS core, deterministic interrupts, and high-resolution control needed to close voltage and current loops at switching frequencies of 100kHz to several hundred kHz. The six MC PWM channels support complementary outputs with dead-time insertion for half-bridge and full-bridge topologies, and the DSP engine executes PID or predictive control kernels efficiently. The 5V domain simplifies interface to feedback dividers and fault flags commonly referenced to 5V logic. On-chip ECC Flash protects control firmware against bit upsets, important for always-on power stages. Layout the control ground and ADC references carefully to keep switching noise out of feedback measurements, and use DMA to stream ADC results without CPU overhead.
Recomendado
Home Appliance Control
Appliance designs - washing machines, refrigerators, compressors, and fans - benefit from this DSC's combination of 5V robustness, DSP-grade motor control, and CAN or UART connectivity for module networking. Microchip positions the dsPIC33EV family specifically for appliances operating in harsh electrical environments, where motor start-up transients and mains noise challenge 3.3V controllers. The three on-chip op amps reduce bill-of-material cost in current-sense front ends, and the CTMU supports capacitive touch user interfaces without dedicated touch ICs. ECC Flash maintains program integrity over years of continuous operation. A single DSPIC33EV32GM104 can run the compressor FOC loop, user-interface scanning, and CAN communication concurrently at 70 MIPS, replacing an MCU-plus-ASIC two-chip approach.
Recomendado
Industrial Automation and CAN Nodes
In factory automation, the DSPIC33EV32GM104-I/ML serves as a CAN 2.0B-connected sensor or actuator node: it digitizes analog inputs through its ADC (optionally buffered by the three op amps), executes local DSP filtering or closed-loop control, and communicates deterministic status over the industrial CAN bus. The 5V supply matches legacy industrial I/O standards, and the -40C to +85C rating covers unconditioned cabinets and rooftop equipment. Peripheral Pin Select lets designers map UART/SPI/I2C to convenient pins for local HMI or configuration links. Seven timers and four DMA channels support precise event sequencing and background data movement. For nodes demanding larger firmware (protocol stacks, logging), the same footprint accepts DSPIC33EV128GM104 or 256KB variants without PCB change.
Recomendado
Sensor Signal Conditioning and Measurement
The integrated Charge Time Measurement Unit (CTMU) plus three op amps make this DSC effective for capacitive, resistive, and time-of-flight measurement systems - level sensing, keypad touch, and ultrasonic front ends. The CTMU provides a precision constant-current source and time measurement for capacitance conversion, while the op amps condition small sensor signals before the on-chip ADC samples them. The 70 MIPS DSP core applies digital filtering (IIR/FIR) to raw data, achieving measurement stability that discrete analog chains struggle to match across temperature. The -40C to +85C range and ECC Flash support long-term metrology reliability. Because signal conditioning, conversion, filtering, and reporting all occur in one 5V chip, board area and BOM count shrink versus separate amplifier-ADC-MCU architectures.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para DSPIC33EV32GM104-I/ML — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | DSPIC33EV32GM104-E/ML | DSPIC33EV32GM104-H/ML | DSPIC33EV32GM102-I/ML | DSPIC33EV64GM104-I/ML | DSPIC33EV256GM104-E/ML |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm), exposed pad | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 32 KB (11K x 24) | 32 KB (11K x 24) | 32 KB (11K x 24) | 16 KB | 64 KB | 256 KB |
| Max CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS core (40MHz clock listed by distributor) | 70 MIPS | 70 MIPS | 70 MIPS |
| Operating Temperature | -40C to +85C (I grade) | -40C to +125C (E grade) | Restricted temperature qualification | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +125C (E grade) |
| CAN / SENT / Op Amps | CAN 2.0B / SENT / 3 op amps | CAN 2.0B / SENT / 3 op amps | CAN 2.0B / SENT / 3 op amps | CAN 2.0B / SENT / 3 op amps | CAN 2.0B / SENT / 3 op amps | CAN 2.0B / SENT / 3 op amps |
Diferenciadores clave
- Extended temperature option on identical die (frente a DSPIC33EV32GM104-E/ML)
- More Flash at same footprint (frente a DSPIC33EV32GM102-I/ML)
- Cost-optimized memory point (frente a DSPIC33EV256GM104-E/ML)
Notas de diseño
The 44-QFN exposed pad must be soldered to a solid grounded copper pour via an array of thermal vias. The exposed pad is the primary ground return; relying only on perimeter pins degrades ground integrity and ADC accuracy. For dsPIC33EV layout practice, follow Microchip's family data sheet 'getting started' pin-connection guidance: keep VDDCORE capacitor connection short and never share it with load transients. Place 0.1uF decoupling caps within 2mm of each VDD/AVDD pin.
VDDCORE requires its dedicated external capacitor per the family data sheet connection diagrams - omitting it or connecting other loads to this pin prevents the internal regulator from starting. Also verify Peripheral Pin Select (PPS) mapping at boot: unconfigured remappable pins default to digital inputs and CAN or UART traffic will silently fail. Use MPLAB Code Configurator to generate the PPS initialization sequence and validate against the DS70005144H register tables.
Estimated: at 70 MIPS on a 5V rail, core current draw scales per the data sheet DC characteristics; for a representative ~60mA total at full speed, dissipation is roughly 0.3W. The exposed-pad QFN on a 2 oz copper pour handles this without a heatsink, but in sealed enclosures above +70C ambient, prefer the -E grade variant (DSPIC33EV32GM104-E/ML) which extends junction limits to +125C with identical footprint. Verify final numbers against DS70005144H before sign-off.
Información de cumplimiento
RoHS compliance and lead-free finishing are standard for current Microchip dsPIC33EV production parts; REACH/halogen/conflict-minerals declarations were not found in the provided data and must be confirmed from the Microchip product page or certificate of compliance. Not AEC-Q100 qualified as a standard part - FuSa support is noted, and automotive-grade variants should be confirmed with Microchip.