DSPIC33EV32GM104T-I/ML - 16-bit 70 MIPS 5V DSC | Microchip
N.º de pieza: DSPIC33EV32GM104T-I/ML ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $4.72 | $4,72 |
| 10 | $4.25 | $42,50 |
| 100 | $3.62 | $362,00 |
| 500 | $3.28 | $1.640,00 |
| 1.000 | $2.95 | $2.950,00 |
DSPIC33EV32GM104T-I/ML Descripción general
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and control logic of a microcontroller. Within the embedded hierarchy, the DSC sits between general-purpose MCUs and dedicated DSPs, making the dsPIC33EV family a natural choice for closed-loop control systems such as motor drives and digital power supplies that need both math throughput and robust I/O.
Key features include a 16-bit dsPIC33EV core running up to 70 MIPS from a 4.5V to 5.5V supply (nominal 5.0V), on-chip CAN 2.0B for vehicular and industrial networking, six motor-control PWM channels for three-phase inverter control, and three integrated op amps plus a CTMU (Charge Time Measurement Unit) for analog front-end conditioning. The ECC Flash protects program memory integrity, and the part carries Microchip Functional Safety (FuSa) documentation support.
Architecturally, the device uses CMOS technology with a modified Harvard 16-bit pipeline and DSP multiply-accumulate instructions, supporting low-power modes per Microchip documentation. Jotrin's listing confirms CAN, 6-channel MC PWM, 3 op amps, CTMU, and SENT peripheral support on the same die.
Typical applications span brushless DC and PMSM motor control in appliances, automotive body and powertrain auxiliaries, and industrial power conversion, where the 5V noise immunity outperforms 3.3V MCUs in harsh electrical environments.
Design consideration: the maximum supply current is 350mA, so decouple the 5V rail with low-ESR ceramics near both VDD pairs and the exposed thermal pad; the tape-and-reel /T suffix suits automated SMT assembly.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para DSPIC33EV32GM104T-I/ML — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con DSPIC33EV32GM104T-I/ML (mismo factor de forma y huella) — difiere en Operating Temperature, Package, Functional Safety Support, Core Architecture, CAN.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
DSPIC33EV32GM104T-E/ML
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
DSPIC33EV64GM104-I/ML
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$3.11 / unidad
Ver hoja de datos →DSPIC33EV64GM104-E/ML
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$3.85 / unidad
Ver hoja de datos →DSPIC33EV128GM104-E/ML
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →DSPIC33EV256GM104-E/ML
✅ Sustitución directa✓ En stock
$3.9 / unidad
Ver hoja de datos →DSPIC33EV32GM104T-I/ML Valores máximos y características eléctricas
| Core | dsPIC 33EV, 16-bit |
| Max CPU Speed | 70 MIPS |
| Program Memory (Flash) | 32KB (11K x 24) with ECC |
| RAM | 4KB |
| Supply Voltage Range | 4.5 V to 5.5 V (nominal 5.0 V) |
| Max Supply Current | 350 mA |
| CAN | Yes (CAN 2.0B) |
| Motor Control PWM | 6 channels |
| Integrated Op Amps | 3 |
| CTMU | Yes (Charge Time Measurement Unit) |
| SENT Peripheral | Yes |
| Encapsulado | 44-QFN (8x8 mm), exposed pad |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40C to +85C (I grade) |
| Functional Safety Support | Yes (FuSa) |
| Technology | CMOS |
| Packaging | Tape & Reel (T suffix) |
Guía de configuración de pines de DSPIC33EV32GM104T-I/ML 44-qfn (8x8 mm), exposed pad
Configuración de pines para DSPIC33EV32GM104T-I/ML (encapsulado 44-qfn (8x8 mm), exposed pad). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para DSPIC33EV32GM104T-I/ML.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
DSPIC33EV32GM104T-I/ML es adecuado para 6 aplicacións: Brushless DC / PMSM Motor Control, Automotive Body and Auxiliary Control, Digital Power Conversion, Home Appliances with Capacitive Touch, Industrial Sensing and Instrumentation, Networking Gateways and Control Nodes.
Brushless DC / PMSM Motor Control
The DSPIC33EV32GM104T-I/ML fits motor control because its six complementary motor-control PWM channels directly drive a three-phase inverter with hardware dead-time, while the 70 MIPS DSP core closes field-oriented control (FOC) loops at practical PWM carrier frequencies of 16-20 kHz. The three on-chip op amps amplify low-side shunt current signals internally, eliminating external amplifier ICs and reducing phase-current measurement error and board area. Operating at 5.0V (4.5-5.5V) gives gate-driver-compatible I/O levels and far better noise margins than 3.3V MCUs in inverter environments with dv/dt switching transients. Typical placement is as the sole control IC between current-sense shunts and gate drivers, with CAN 2.0B linking the drive to supervisory networks in appliances or industrial machines.
Recomendado
Automotive Body and Auxiliary Control
The DSPIC33EV32GM104T-I/ML suits automotive auxiliary ECUs because its 5V supply tolerates the voltage dips and load-dump-conditioned rails common in vehicle electrical systems, and its -40C to +85C industrial grade covers cabin and body electronics environments. The integrated CAN 2.0B controller connects the node to vehicle networks without an external CAN controller, and the SENT peripheral interfaces directly to modern automotive sensors that output nibble-encoded data. The CTMU supports capacitive touch interfaces for control panels. According to Microchip, the dsPIC33EV family explicitly targets harsh automotive applications. For engine-bay temperatures above +85C, substitute the pin-identical extended-grade DSPIC33EV32GM104T-E/ML in the same 44-QFN footprint without PCB changes.
Recomendado
Digital Power Conversion
Digital power supplies and PFC stages benefit from the DSPIC33EV32GM104T-I/ML's combination of 70 MIPS math throughput and six PWM channels with complementary outputs, which implement phase-shifted full-bridge, LLC, or interleaved buck topologies. The 5V core operation keeps logic noise immunity high in switch-mode environments where millivolt-level signals coexist with kilovolt-per-microsecond edges, and the DSP multiply-accumulate instructions execute compensator calculations within single PWM-period interrupts. The on-chip op amps condition current-shunt feedback for cycle-by-cycle limiting. The 32KB ECC Flash provides error-corrected program storage, protecting firmware integrity in electrically noisy converter enclosures - a meaningful advantage for long-lifetime industrial and appliance power stages.
Recomendado
Home Appliances with Capacitive Touch
Appliance control boards - cooktops, washing machines, and range hoods - use the DSPIC33EV32GM104T-I/ML because it merges the touch, motor, and networking functions usually split across multiple ICs. The CTMU implements multi-button capacitive touch sensing through charge-time measurement, the six PWM channels drive the wash pump or fan BLDC motor with FOC, and CAN (or UART-based links) communicates with display and sensor boards. Microchip positions the 5V dsPIC33EV family specifically for harsh appliance environments, where humid, dirty conditions make the 5V noise immunity of this 16-bit DSC more robust than 3.3V alternatives. The 44-QFN (8x8 mm) exposed pad dissipates motor-driver logic heat on a two-layer PCB economically.
Recomendado
Industrial Sensing and Instrumentation
Industrial sensor nodes and instrumentation front-ends exploit the DSPIC33EV32GM104T-I/ML's integrated analog: three op amps for signal amplification, the CTMU for time- and charge-based measurement, and the family ADC for digitization - all on one 5V chip that resists factory-floor electrical noise. The 70 MIPS DSP engine applies filtering (IIR/FIR) and FFT analysis to sampled signals locally, reducing data traffic by sending processed results rather than raw waveforms over CAN 2.0B. Functional Safety (FuSa) documentation availability per DigiKey's catalog simplifies qualification for safety-relevant monitoring equipment. Firmware lives in 32KB ECC Flash (11K x 24) with 4KB RAM, sufficient for protocol stacks plus signal-processing code in compact node designs.
Recomendado
Networking Gateways and Control Nodes
As a CAN-to-serial bridge or distributed control node, the DSPIC33EV32GM104T-I/ML provides the on-chip CAN 2.0B controller with hardware message filtering, plus UART/SPI/I2C ports for local peripherals, on a single 5V 70 MIPS core. The 44-QFN (8x8 mm) package concentrates routing in 8x8 mm for dense I/O modules, while the exposed thermal pad sustains continuous CAN transceiver-adjacent operation. The 5V I/O directly interfaces industrial 5V logic and optocoupler circuits without level shifting, which reduces BOM cost in legacy brownfield installations. Tape-and-reel /T packaging supports automated assembly of panel-level production. Firmware gains from ECC-protected Flash, ensuring communication stack integrity across years of industrial service.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para DSPIC33EV32GM104T-I/ML — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | DSPIC33EV32GM104T-E/ML | DSPIC33EV64GM104-I/ML | DSPIC33EV128GM104-E/ML | DSPIC33EV256GM104-E/ML |
|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) exposed pad | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Program Flash | 32KB (11K x 24) ECC | 32KB (11K x 24) ECC | 64KB | 128KB | 256KB |
| RAM | 4KB | 4KB | 8KB | 16KB | 32KB |
| Supply Voltage | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V |
| Operating Temperature | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +125C (E grade) |
| CAN / PWM / Op Amps | CAN 2.0B / 6 MC PWM / 3 op amps | CAN 2.0B / 6 MC PWM / 3 op amps | CAN 2.0B / 6 MC PWM / 3 op amps | CAN 2.0B / 6 MC PWM / 3 op amps | CAN 2.0B / 6 MC PWM / 3 op amps |
Diferenciadores clave
- Extended temperature option in identical footprint (frente a DSPIC33EV32GM104T-E/ML)
- Lowest-cost entry to the 44-QFN GM104 memory ladder (frente a DSPIC33EV64GM104-I/ML)
- Industrial grade suits cost-optimized appliances (frente a DSPIC33EV256GM104-E/ML)
Notas de diseño
Design the 5V rail for at least 350mA - the datasheet maximum supply current per Microchip USA's specification. Include margin for peripheral loads such as CAN transceiver drive. Use a bulk capacitor of 10uF plus 0.1uF ceramics at each VDD/VSS pin pair. Because the dsPIC33EV is a 5V-only part, do not attempt 3.3V operation; 3.3V peripherals must use level shifters or 5V-tolerant transceivers such as the MCP2562 for CAN.
Estimated: the 44-QFN (8x8 mm) exposed pad is the primary heat path; solder it to a ground pour with an array of thermal vias. A worst-case 350mA at 5V implies 1.75W input power, of which only a fraction is dissipated on-die, but PWM gate-drive current concentrated in the pad region can create hotspots. For extended-temperature designs above +85C ambient, select the /E grade (DSPIC33EV32GM104T-E/ML) in the identical footprint rather than fighting thermal margin.
The T suffix denotes tape-and-reel packaging only - it is electrically identical to the cut-tape part, so never substitute an /E grade when the ambient budget was computed for /I. Configure the six motor-control PWM outputs with hardware dead-time before enabling the inverter; enabling complementary outputs without dead-time creates shoot-through that can destroy gate drivers. Finally, recompile and re-verify ECC Flash configuration when porting firmware to larger-memory family alternatives.
Información de cumplimiento
Lead-free is implied by the I/E commercial temperature grades and current Microchip production; explicit RoHS/REACH declarations were not present in the verified web data and should be confirmed from Microchip's environmental page.