DSPIC33EV64GM104-I/ML - 5V 70 MIPS 16-bit DSC 64KB Flash | Microchip
MPN: DSPIC33EV64GM104-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.62 | $4.62 |
| 10 | $4.18 | $41.80 |
| 100 | $3.74 | $374.00 |
| 500 | $3.42 | $1,710.00 |
| 1,000 | $3.11 | $3,110.00 |
DSPIC33EV64GM104-I/ML Overview
A digital signal controller combines the computational capability of a microcontroller with DSP-oriented features such as hardware multiply-accumulate, making the dsPIC33EV family a bridge between general-purpose MCUs and dedicated DSPs. Within the power-management hierarchy of embedded control, a DSC sits above basic MCUs and is optimized for closed-loop control loops, digital power conversion, and motor control in electrically harsh environments.
Key features include a 5V-tolerant operating supply that eliminates level-shifting in industrial and automotive 5V systems, up to 24 channels of 10-bit ADC, four DMA channels, CAN 2.0B and SENT interfaces for automotive networking, and on-chip op amps plus high-resolution PWM outputs targeted at motor control. The integrated ECC Flash provides single-bit error correction for improved functional safety in noisy environments.
Architecturally, the dsPIC33EV core runs a modified Harvard pipeline at up to 70 MIPS, with DSP instruction extensions (MAC, modulo addressing, bit-reversed addressing) that accelerate digital filtering and control algorithms. The wide 3.0V to 5.5V supply range and industrial-grade design target harsh conditions with noise and vibration.
Typical applications include BLDC and PMSM motor control, automotive sensors and touch/control units, appliance control boards, industrial power supplies, and CAN-networked body modules.
When designing with this device, plan the VDD decoupling with low-ESR ceramics and account for the exposed thermal pad on the QFN bottom when creating the PCB land pattern.
This page synthesizes distributor pricing, drop-in same-family alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EV64GM104-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EV64GM104-I/ML (same form factor and footprint) — differing in Operating Temperature, Functional Safety Support, Package, Core, CAN.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EV64GM004-I/ML
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$2.96 / Unit
View Datasheet →DSPIC33EV32GM104T-I/ML
✅ Drop-In✓ In Stock
$2.95 / Unit
View Datasheet →DSPIC33EV128GM104-E/ML
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →DSPIC33EV256GM104-E/ML
✅ Drop-In✓ In Stock
$3.9 / Unit
View Datasheet →DSPIC33EV64GM104-I/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC33E DSC core |
| Maximum CPU Speed | 70 MIPS |
| Flash Program Memory | 64 KB with ECC |
| RAM | 8 KB |
| Operating Voltage Range | 3.0 V to 5.5 V |
| Supply Class | 5 V tolerant I/O |
| ADC | Up to 24-channel 10-bit ADC |
| DMA Channels | 4 |
| CAN Interface | CAN 2.0B |
| SENT Interface | Yes |
| PWM | Motor-control PWM with advanced features |
| On-chip Op Amps | Yes |
| Package | 44-pin QFN (8x8 mm) with exposed pad |
| Temperature Range | -40C to +85C (Industrial, I suffix) |
| Mounting Type | Surface Mount |
| Packaging | Tube |
| Target Applications | Automotive, industrial, appliances, motor control |
DSPIC33EV64GM104-I/ML 44-pin qfn (8x8 mm) with exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EV64GM104-I/ML (44-pin qfn (8x8 mm) with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EV64GM104-I/ML.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EV64GM104-I/ML is suitable for 6 applications: BLDC/PMSM Motor Control, Automotive Sensors and Body Control, Digital Power Supplies, Appliance Control Boards, Industrial Automation and PLC I/O, Embedded Control with CAN Networking.
BLDC/PMSM Motor Control
The DSPIC33EV64GM104-I/ML fits sensorless and sensored motor-control designs because its 70 MIPS DSP core executes field-oriented control loops with hardware MAC instructions, while motor-control PWM outputs provide complementary drive with dead-time insertion. The on-chip op amps condition shunt-resistor current feedback, and the 10-bit ADC with 4 DMA channels samples multiple phase currents without CPU overhead. Placed between the gate-driver stage and the CAN bus, the DSC handles both the inner current loop (typically tens of microseconds per iteration) and higher-level communication. The 5V I/O interfaces directly with industrial gate drivers, improving noise margin over 3.3V controllers in inverter environments with high dv/dt switching noise.
Recommended
Automotive Sensors and Body Control
Automotive sensor nodes and touch/control units benefit from the DSPIC33EV64GM104-I/ML's native 5V operation, CAN 2.0B controller, and SENT interface for transmitting sensor data with high noise immunity. The 10-bit ADC with up to 24 channels digitizes analog sensor arrays, while 64 KB of ECC Flash protects firmware integrity in electrically noisy 12V/24V vehicle environments. The device tolerates load-dump-adjacent supply conditions via its 3.0V to 5.5V operating range when paired with upstream regulation. Designers should connect an external CAN transceiver to the CANTX/CANRX pins and use the SENT peripheral for direct interfacing with Smart Sensors per the SAE SENT convention implemented by Microchip.
Recommended
Digital Power Supplies
In digitally controlled AC/DC and DC/DC converters, the DSPIC33EV64GM104-I/ML closes voltage and current loops with its 70 MIPS core and high-resolution PWM peripherals, achieving switching frequencies typical of industrial power stages. The 5V supply domain matches optocoupler and gate-driver logic levels directly, removing translation stages. The 10-bit ADC plus DMA streams output-voltage and current samples into control firmware each switching cycle, while ECC Flash maintains firmware integrity across brown-out events. Designers should synchronize ADC sampling to the PWM period to sample mid-ramp for average-current accuracy, and budget control-loop execution time carefully since the 70 MIPS ceiling defines the achievable bandwidth.
Recommended
Appliance Control Boards
Major appliances (washing machines, dishwashers, HVAC blowers) operate in environments with vibration, humidity, and severe electrical noise - exactly the harsh conditions Microchip targets for the dsPIC33EV family. The DSPIC33EV64GM104-I/ML drives universal and BLDC motors via its PWM outputs, reads user-interface touch or encoder inputs, and manages 5V-relative sensors without level shifting. The 70 MIPS core runs both motor control and appliance state-machine firmware concurrently, aided by 64 KB ECC Flash. On the PCB, the exposed-pad QFN should be soldered to a grounded copper pour for both thermal relief and EMI reduction, and CAN links to other boards can reuse the on-chip CAN 2.0B controller.
Recommended
Industrial Automation and PLC I/O
Factory automation modules use the DSPIC33EV64GM104-I/ML where 24V industrial logic must be interfaced at 5V levels; the device's 5V-tolerant I/O connects directly to opto-isolated inputs and relay or SSR drivers. The 24-channel 10-bit ADC digitizes analog process signals, four DMA channels offload high-rate sampling, and the 70 MIPS core executes PID control and filtering with DSP instructions. The CAN 2.0B interface links the module into industrial CANopen-style networks via an external transceiver. Firmware stored in ECC Flash resists single-bit errors from electrically noisy cabinets. For longer product lifecycles, the extended-temperature E-grade siblings share the same footprint for thermal-design flexibility.
Recommended
Embedded Control with CAN Networking
General embedded controllers that bridge local control and a CAN backbone - such as gateways, chargers, and pump controllers - use the DSPIC33EV64GM104-I/ML's integrated CAN 2.0B controller to eliminate a dedicated CAN microcontroller. The 70 MIPS DSC core handles application logic and protocol stacks in the 64 KB ECC Flash, while SENT supports digital sensor inputs from automotive-grade sources. The 8 KB RAM buffers CAN message queues and ADC streams via DMA. Compared with a two-chip MCU-plus-CAN-controller solution, the single-chip design reduces BOM count and firmware complexity, and the 5V I/O allows direct interfacing with legacy 5V transceivers and peripherals common in industrial retrofits.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EV64GM104-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EV64GM004-I/ML | DSPIC33EV32GM104T-I/ML | DSPIC33EV128GM104-E/ML | DSPIC33EV256GM104-E/ML |
|---|---|---|---|---|---|
| Package | 44-QFN (8x8) ML | 44-QFN (8x8) ML - same | 44-QFN (8x8) ML - same | 44-QFN (8x8) ML - same | 44-QFN (8x8) ML - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB ECC | 64 KB ECC | 32 KB ECC | 128 KB ECC | 256 KB ECC |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Operating Voltage | 3.0 V to 5.5 V | 3.0 V to 5.5 V | 3.0 V to 5.5 V | 3.0 V to 5.5 V | 3.0 V to 5.5 V |
| Temperature Range | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) |
| CAN / SENT / Op Amps | Yes / Yes / Yes (GM10X) | GM004 variant - reduced peripheral set | Yes / Yes / Yes (GM10X) | Yes / Yes / Yes (GM10X) | Yes / Yes / Yes (GM10X) |
Key Differentiators
- Native 5V operation with 3.0V-5.5V supply range (vs DSPIC33EP64MC504-E/MV)
- Integrated CAN 2.0B, SENT, and on-chip op amps in one chip (vs DSPIC33EV64GM004-I/ML)
- 70 MIPS DSP core with ECC Flash (vs DSPIC33EV32GM104T-I/ML)
Design Notes
The 44-QFN (8x8) package has an exposed thermal pad on the underside that must be connected to VSS. Design the PCB land pattern with a central thermal via array (approximately 5x5 via grid, 0.3 mm vias) tied to the ground plane. This pad is essential for both heat dissipation and ground-return integrity in motor-control and power-conversion designs where the DSC shares a ground with switching stages. Follow the land-pattern dimensions in the Microchip family data sheet DS70005144H rather than third-party footprints.
The device operates from 3.0V to 5.5V; in 12V/24V automotive or industrial systems, provide a regulated 5V rail with transient suppression, since the part tolerates 5V operation but not unregulated automotive transients. Decouple each VDD pin with 0.1 uF ceramics placed within 2 mm of the pin, plus bulk 4.7-10 uF near the package. Verify AVDD is filtered separately from DVDD when using the on-chip op amps and 10-bit ADC, using an RC or ferrite filter to preserve ADC accuracy.
Do not confuse GM00X and GM10X peripheral sets: only GM10X variants (including this 64GM104) guarantee CAN, SENT, and op amps; the GM004 variant trims these. Also note the -I suffix specifies -40C to +85C; for under-hood or enclosed power electronics near +105C ambient, select the -E grade (up to +125C), which is pin-compatible in the same ML package. Confirm MCLR/PGD/PGC programming-pin routing per the Flash Programming Specification (70005137) to retain in-circuit debug access.
Compliance Information
Microchip industrial catalog parts (I-suffix) are supplied RoHS-compliant and lead-free per standard Microchip product policy; obtain the official material declaration from Microchip for REACH and conflict-minerals status for your date code.
