EP1AGX35DF780I5N - Arria GX FPGA, 35K LEs, 780-BGA | Intel
N.º de pieza: EP1AGX35DF780I5N ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $320 | $320,00 |
| 10 | $295 | $2.950,00 |
| 100 | $268 | $26.800,00 |
| 500 | $245 | $122.500,00 |
| 1.000 | $225 | $225.000,00 |
EP1AGX35DF780I5N Descripción general
A field-programmable gate array (FPGA) is a semiconductor device whose digital logic fabric and I/O routing are user-defined after manufacture. FPGAs sit at the same hierarchical level as ASICs in the programmable-logic taxonomy (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor). The Arria GX family adds hardened multi-gigabit transceivers (MGTs) and dedicated DSP blocks on top of the generic logic fabric, positioning it between pure logic FPGAs and DSP-optimized devices.
Key features include 8 transceiver channels supporting data rates up to 3.125 Gbps, 4 PLLs, dedicated hardware multipliers for DSP, and 341 user I/O pins. The device is available in commercial (C6), industrial (I5, I6), and other speed grades, with -40 C to +100 C junction temperature support in the industrial grade. Memory interface support includes DDR2 SDRAM, QDRII SRAM, and RLDRAM II controllers.
The fabric combines 4-input lookup tables (LUTs), distributed M9K memory blocks, and MLAB blocks arranged in Logic Array Blocks (LABs). Configuration is via passive serial, fast passive parallel, or JTAG, supporting bitstream encryption with AES for design protection. The Quartus II design software provides synthesis, place-and-route, and timing closure.
Typical applications include Serial RapidIO bridging, PCI Express endpoint and root port designs, HD-SDI video processing, wireless backhaul modems, and ASIC prototyping. Transceiver-rich designs leverage the on-chip MGTs to eliminate external PHY chips and reduce BOM cost and board area in space-constrained systems.
When designing with this part, pay close attention to transceiver reference-clock jitter, decoupling network density (at least one 0.1 uF + one 10 uF per transceiver supply pin), and PCB stackup for controlled-impedance differential pairs. Industrial-grade parts must be derated to keep junction temperature below 100 C under worst-case ambient. Bitstream encryption with AES should be enabled for any field-deployed design.
This page synthesizes distributor pricing, drop-in speed-grade alternatives, and practical design notes that are not consolidated in any single manufacturer datasheet or distributor listing.
Alternativas directas para EP1AGX35DF780I5N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP1AGX35DF780I5N (mismo factor de forma y huella) — difiere en Speed Grade, Package, Family, RoHS Status, Configuration Method.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP1AGX35DF780I6N
✅ Sustitución directa✓ En stock
$171 / unidad
Ver hoja de datos →EP1AGX35DF780C6N
✅ Sustitución directa✓ En stock
$199.5 / unidad
Ver hoja de datos →EP1AGX35DF780I5
✅ Sustitución directa✓ En stock
$118.4 / unidad
Ver hoja de datos →EP1AGX35DF780C6
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →EP1AGX35DF780C5N
✅ Sustitución directa✓ En stock
$198 / unidad
Ver hoja de datos →EP1AGX35CF780I6N
✅ Sustitución directa✓ En stock
$278.75 / unidad
Ver hoja de datos →EP1AGX35DF780
✅ Sustitución directa✓ En stock
$142.6 / unidad
Ver hoja de datos →EP1AGX35DF780I5N Valores máximos y características eléctricas
| Family | Arria GX |
| Logic Elements | 33,520 |
| Embedded Memory (Bits) | 1,348,416 |
| Logic Array Blocks (LABs) | 1,676 |
| Maximum User I/O Pins | 341 |
| Transceiver Channels | 8 |
| Maximum Transceiver Data Rate | 3.125 Gbps |
| PLLs | 4 |
| Global Clocks | 16 |
| Encapsulado | 780-ball FineLine BGA (FBGA) |
| Process Technology | 90 nm |
| Speed Grade | I5 (industrial) |
| Temperatura de unión de funcionamiento | -40 C to +100 C (industrial) |
| Configuration Method | Passive Serial / FPP / JTAG |
| Bitstream Encryption | AES-128 supported |
| Memory Interface Hard IP | DDR2, QDRII, RLDRAM II |
| DSP Blocks (18x18 multipliers) | Max 252 |
| Estado RoHS | Compliant |
Guía de configuración de pines de EP1AGX35DF780I5N 780-ball fineline bga (fbga)
Configuración de pines para EP1AGX35DF780I5N (encapsulado 780-ball fineline bga (fbga)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP1AGX35DF780I5N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP1AGX35DF780I5N es adecuado para 7 aplicacións: Serial RapidIO Bridge and Switch, PCI Express Endpoint / Root Port, HD-SDI Video Processing, Wireless Baseband Modem, ASIC Prototyping Platform, Industrial Automation Controller, Medical Imaging Data Aggregator.
Serial RapidIO Bridge and Switch
The EP1AGX35DF780I5N fits RapidIO bridge designs through its 8 multi-gigabit transceivers supporting up to 3.125 Gbps per lane, exactly matching Serial RapidIO physical layer requirements. With 33,520 logic elements and 252 hardware 18x18 multipliers, the FPGA fabric can implement packet processing, DMA engines, and traffic-management functions alongside the hard PHY. The I5 industrial speed grade ensures operation from -40 C to +100 C junction, suitable for outdoor base stations and military communication systems. A typical implementation uses four transceivers for the RapidIO link and the remaining channels for Aurora or PCIe sideband connectivity.
Recomendado
PCI Express Endpoint / Root Port
The EP1AGX35DF780I5N suits PCI Express Gen1 endpoint and root-port designs because its MGTs deliver the 2.5 Gbps signaling required for PCIe Gen1 lanes, while the fabric provides the PIPE, transaction, and DMA layers. Industrial temperature grade (I5) makes it acceptable for -40 C to +100 C operation in industrial backplanes and ruggedized servers. Hard DDR2/QDRII controllers simplify memory-buffer implementations on x1/x4/x8 link widths. Quartus II IP Compiler delivers the complete PCIe IP stack, and the AES-128 bitstream encryption protects field-deployed firmware.
Recomendado
HD-SDI Video Processing
The EP1AGX35DF780I5N's 3.125 Gbps transceiver channels match the SDI data rate hierarchy required for HD-SDI (1.485 Gbps) and 3G-SDI (2.97 Gbps), enabling broadcast-grade video processing without external serializer chips. The 33,520 logic elements and embedded multipliers handle deinterlacing, color-space conversion, and audio embedding, while the on-chip MGTs drive 75-ohm coax directly via coupling transformers. Industrial temperature operation ensures reliable behavior in outdoor broadcast head-ends. Pin-to-pin compatibility with the EP1AGX35DF780I6N lets designers swap speed grades when timing margins tighten.
Recomendado
Wireless Baseband Modem
The EP1AGX35DF780I5N serves wireless baseband modems where its 8 multi-gigabit transceivers interface to RF front-ends and digital backhaul, while the 252 hardware 18x18 multipliers accelerate channel coding (Viterbi, Turbo), FFT/iFFT, and channel equalization. Industrial speed grade operation (-40 C to +100 C) supports outdoor small-cell and macro BTS installations, and the 1.3-Mbit embedded memory absorbs sample-rate buffers and timing slop without external SRAM. The device's AES-128 bitstream encryption protects operator-proprietary PHY and MAC algorithms against reverse engineering.
Recomendado
ASIC Prototyping Platform
The EP1AGX35DF780I5N provides 33,520 logic elements and 1,348 Kbits of embedded RAM sufficient for partition-level ASIC prototyping, especially for transceiver-rich networking and storage SoCs. Multiple 3.125 Gbps channels let the FPGA emulate multi-lane SerDes at near-real-time speeds, while 4 PLLs allow per-channel clock synthesis for realistic timing closure. Industrial speed grade operation enables the prototype to live in thermally aggressive environments for in-system validation. Quartus II's incremental compile and LogicLock regions let designers partition the ASIC RTL into per-developer blocks without re-running full place-and-route.
Recomendado
Industrial Automation Controller
The EP1AGX35DF780I5N's industrial temperature rating, multi-gigabit transceivers, and 341 user I/Os make it well-suited for PLC-style controllers requiring EtherCAT, PROFINET, or SERCOS III industrial Ethernet master interfaces. Hardware multipliers accelerate motion-control loops at sub-microsecond cycle times, while 1.3 Mbits of embedded RAM store cyclic process data and interpolation tables. The AES-128 bitstream encryption protects proprietary control algorithms on factory-floor equipment. The NRND status means new factory designs should evaluate Cyclone V 5CGXFC7, but existing lines keep sourcing this part.
Recomendado
Medical Imaging Data Aggregator
The EP1AGX35DF780I5N aggregates data from ultrasound transducer arrays, MRI receiver coils, or endoscopy camera heads through its 8 multi-gigabit transceivers, each running up to 3.125 Gbps to absorb uncompressed video or digitized RF data streams. The 252 hardware multipliers implement beamforming, FIR filtering, and image reconstruction in real time, while 1.3 Mbits of embedded RAM buffer pixel data between digitizer and display pipeline. Industrial speed grade operation supports portable cart-based medical devices whose ambient swings between refrigerated storage and warm clinical rooms.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP1AGX35DF780I5N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP1AGX35DF780I6N | EP1AGX35DF780C6N | EP1AGX35DF780I5 | EP1AGX35DF780C6 | EP1AGX35DF780C5N |
|---|---|---|---|---|---|---|
| Package | 780-ball FineLine BGA (FBGA) | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | I5 (industrial) | I6 (industrial, faster) | C6 (commercial) | I5 (industrial) | C6 (commercial) | C5 (commercial, slower) |
| Junction Temperature Range | -40 C to +100 C | -40 C to +100 C | 0 C to +85 C | -40 C to +100 C | 0 C to +85 C | 0 C to +85 C |
| Logic Elements | 33,520 | 33,520 | 33,520 | 33,520 | 33,520 | 33,520 |
| Transceiver Channels | 8 | 8 | 8 | 8 | 8 | 8 |
| Maximum Transceiver Data Rate | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Diferenciadores clave
- Industrial speed grade in same FBGA footprint (frente a EP1AGX35DF780C6N)
- Same die across speed grades (frente a EP1AGX35DF780I6N)
- Drop-in without packaging-suffix change (frente a EP1AGX35DF780I5 (no 'N' suffix))
Notas de diseño
Decouple every transceiver supply pin (VCCMGT) with one 0.1 uF ceramic plus one 10 uF bulk capacitor placed within 3 mm of the BGA ball; missing or distant decoupling causes jitter and link errors at 3.125 Gbps. Separate VCCMGT from VCCINT and VCCIO planes where possible, and tie core and IO grounds to a single low-impedance plane at a single-point stitch. Power-on ramp must satisfy the manufacturer's monotonic turn-on requirement; failure to do so can corrupt configuration or latch the device into an indeterminate state.
The 780-ball FBGA has a junction-to-ambient thermal resistance that requires either substantial airflow or a heat spreader when transceiver channels run hot. Estimate: with all 8 transceivers at 3.125 Gbps and 100 percent utilization, total power dissipation approaches 8-10 W, which pushes the junction within 15-20 C of the 100 C industrial limit on a 4-layer JEDEC test board. Engineers must reduce ambient temperature, add airflow, or reduce active transceiver count to stay within thermal envelope.
The 780-ball FineLine BGA requires microvia-in-pad PCB technology; a 1.0 mm pitch FBGA cannot be reliably assembled with conventional through-via pads. Use ENIG or ENEPIG surface finish to prevent solder joint embrittlement, and match the BGA pad diameter (typically 0.4 mm) per the Altera/Intel footprint recommendation. Inner-layer antipads must clear ground and power planes below the BGA to avoid shorting during reflow, and differential pairs feeding the MGTs should follow 100-ohm controlled-impedance routing with length-matched + / - traces within 150 um.
Do not assume the I5 speed grade will close timing in designs originally targeted at the I6 speed grade; rerun Quartus II place-and-route after a speed-grade swap. The MSEL pins must be tied to logic levels matching the desired configuration mode; floating or incorrect MSEL settings result in configuration failure. AES bitstream encryption must be enabled with a non-zero key before production to protect IP; default unencrypted mode is for development only. Finally, do not forget the 10 kohm pull-up on the nCONFIG pin and the 1 kohm pull-up on the JTAG TCK pin per the handbook reset and JTAG guidelines.
Información de cumplimiento
RoHS-compliant lead-free FBGA per Intel/Altera product page. Not AEC-Q100 qualified - this is an industrial-temp-grade FPGA, not an automotive part. AES-128 bitstream encryption available for IP protection.
