EP20K200RC208-1 - APEX 20K 200K Gates FPGA, 208-Pin RQFP | Intel / Altera
N.º de pieza: EP20K200RC208-1 ⚠ Última compra| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $128 | $1.280,00 |
| 100 | $110 | $11.000,00 |
| 500 | $92 | $46.000,00 |
| 1.000 | $78 | $78.000,00 |
EP20K200RC208-1 Descripción general
A Field-Programmable Gate Array is a programmable logic device that combines configurable logic blocks (LUTs), programmable interconnect, and dedicated memory into a single silicon die. The APEX-20K family pioneered the MultiCore architecture that integrates look-up table logic, product-term logic, and embedded memory blocks on one die, enabling system-on-a-programmable-chip (SOPC) integration. FPGAs sit above fixed-function ASICs and below software-defined processors in the programmable logic hierarchy, and the APEX-20K sits within Altera's mid-density legacy FPGA portfolio alongside the FLEX 10K and APEX II families.
Key features of the EP20K200RC208-1 include 144 maximum user I/O pins, four phase-locked loops (PLLs) for clock management, embedded array blocks (EABs) for memory and arithmetic, and in-system programmability via the IEEE 1149.1 JTAG interface. The device supports configuration through passive serial, passive parallel asynchronous, and synchronous modes, and is supported by the Quartus II (legacy) and MAX+PLUS II development tools. The exposed thermal pad on the bottom of the 208-BFQFP package enables direct heat extraction to a PCB copper pour.
Typical applications for the EP20K200RC208-1 include telecommunications line cards, ASIC prototyping, glue logic consolidation, custom DSP datapaths, bus-interface bridges (PCI, PCIX, Utopia), and industrial control state machines. Designers typically select this part for cost-sensitive mid-volume designs where the APEX-20K's MultiCore architecture and embedded memory density provide an attractive balance of logic capacity, on-chip RAM, and unit price.
When designing with the EP20K200RC208-1, follow the Quartus II power analysis flow and observe the 1.8 V LVDS I/O standard voltage limits. Multi-voltage rail sequencing (2.5 V core + 3.3 V/2.5 V I/O) is required, and the JTAG TMS/TCK pins must each have a 1 kΩ pull-up or pull-down to prevent erroneous configuration. Long-term availability for this EOL family should be confirmed with the manufacturer before new designs.
Alternativas directas para EP20K200RC208-1 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP20K200RC208-1 (mismo factor de forma y huella) — difiere en Family, Process Technology, Operating Temperature, Package, Speed Grade.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP20K200RC208-1X
✅ Sustitución directa✓ En stock
$35.8 / unidad
Ver hoja de datos →EP20K200RC208-1V
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP20K200EQC208-1
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EP20K200EQC208-2
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EP20K200QC208-1N
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
EP20K200RC208-1 Valores máximos y características eléctricas
| Family | APEX-20K |
| Series | APEX 20K (200K gates) |
| System Gates | 200,000 |
| Logic Elements / Cells | 8,320 |
| Embedded Memory (bits) | 106,496 |
| Maximum User I/O | 144 |
| Number of PLLs | 4 |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| I/O Standard Support | LVTTL, LVCMOS, 2.5 V/3.3 V PCI, 1.8 V LVDS |
| Maximum Internal Frequency | 250 MHz |
| Encapsulado | 208-BFQFP (RQFP) with Exposed Pad, 28×28 mm |
| Tipo de montaje | Surface Mount |
| Configuration Interface | Passive Serial, Passive Parallel, JTAG (IEEE 1149.1) |
| Temperatura de funcionamiento | Industrial range |
| Estado RoHS | unknown |
Guía de configuración de pines de EP20K200RC208-1 208-bfqfp (rqfp) with exposed pad, 28×28 mm
Configuración de pines para EP20K200RC208-1 (encapsulado 208-bfqfp (rqfp) with exposed pad, 28×28 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP20K200RC208-1.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP20K200RC208-1 es adecuado para 6 aplicacións: Telecommunications Line Cards, ASIC Prototyping and Emulation, Custom DSP Datapaths, PCI/PCI-X Bus Interface Bridges, Industrial Control and State-Machine Consolidation, Legacy Network Equipment Maintenance.
Telecommunications Line Cards
The EP20K200RC208-1's 200K system gates, four on-chip PLLs, and 106,496 bits of embedded SRAM suit it well to telecom line-card datapath consolidation. MultiCore architecture lets designers implement both look-up-table logic and product-term glue on the same die, while the LVDS-capable I/O supports 1.8 V SERDES interfaces and 3.3 V/2.5 V PCI bus bridging to framer ASICs. Place the part adjacent to its companion line-card transceiver; observe the 28×28 mm 208-BFQFP exposed-pad solder coverage to keep junction temperature within the industrial range when running at 250 MHz internal clock.
Recomendado
ASIC Prototyping and Emulation
Engineers historically used the EP20K200RC208-1 as a prototyping vehicle for ASICs in the 100K-200K gate range, exploiting its MultiCore LUT + product-term mix to emulate target logic accurately. With 8,320 logic elements and 144 user I/O, the device can map most mid-complexity ASICs and provide JTAG-driven debug visibility. The 250 MHz internal frequency supports realistic timing emulation of mid-speed ASIC blocks; instantiate multiple devices in parallel for larger gate-count emulation farms and connect via LVDS to preserve signal integrity at high toggle rates.
Recomendado
Custom DSP Datapaths
The APEX-20K's embedded array blocks (EABs) double as RAM or ROM and are particularly efficient at implementing MAC multipliers and FIR filter coefficient tables, making the EP20K200RC208-1 a useful platform for custom DSP datapaths. With 106,496 bits of SRAM, designers can buffer several hundred samples of intermediate data without resorting to external SRAM. The 250 MHz internal frequency supports sample rates up to ~50 MSPS per channel in a 5-tap FIR; the four PLLs generate the clocks for the ADC, DSP fabric, and output DAC.
Recomendado
PCI/PCI-X Bus Interface Bridges
The EP20K200RC208-1 supports 3.3 V PCI and PCI-X I/O standards directly, making it suitable for bridging legacy processor buses to PCI-X peripherals or backplanes. The 208-BFQFP package provides enough user I/O to implement a 64-bit PCI-X interface plus local-bus signaling, while the four PLLs de-skew the 66 MHz PCI-X clock against the local processor clock. The 200K-gate logic capacity fits a typical bus-bridge design with FIFOs and DMA engines; verify the PCI timing budgets with Quartus II timing analysis before tape-out.
Recomendado
Industrial Control and State-Machine Consolidation
Many industrial control designs use the EP20K200RC208-1 to consolidate dozens of discrete 74HC logic ICs, GALs, and small PLDs into a single programmable device. The APEX-20K's product-term blocks naturally encode large state machines and decoders, while the LUT fabric absorbs the random glue logic. Industrial-temperature-grade parts tolerate factory-floor thermal and electrical noise, and the exposed thermal pad of the 208-BFQFP package couples heat into the PCB copper pour for fanless operation in sealed cabinets.
Recomendado
Legacy Network Equipment Maintenance
The EP20K200RC208-1 was widely designed into 1999-2005 era routers, switches, and base-station controllers that remain in service today. The part's last-time-buy status means new builds must rely on Rochester Electronics franchise stock, but board-repair depots and refurbishment operations need exact-fit replacements. The 208-BFQFP RQFP footprint matches the original PCB land pattern, so a swap requires only a standard hot-air rework station. Verify the temperature grade (industrial vs. commercial) and the JTAG chain position before substituting.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP20K200RC208-1 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP20K200RC208-1X | EP20K200RC208-1V | EP20K200EQC208-1 | EP20K200EQC208-2 | EP20K200QC208-1N |
|---|---|---|---|---|---|---|
| Package | 208-BFQFP (RQFP) 28×28 mm with Exposed Pad | 208-BFQFP (RQFP) - same | 208-BFQFP (RQFP) - same | 208-BFQFP (RQFP) - same | 208-BFQFP (RQFP) - same | 208-BFQFP (RQFP) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Family | APEX-20K (2.5V core) | APEX-20K (2.5V core) | APEX-20K (2.5V core) | APEX 20KE (1.8V core) | APEX 20KE (1.8V core) | APEX-20K (2.5V core) |
| System Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| Logic Elements | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 |
| Embedded Memory (bits) | 106,496 | 106,496 | 106,496 | 106,496 | 106,496 | 106,496 |
| Max User I/O | 144 | 144 | 144 | 144 | 144 | 144 |
| Number of PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
Diferenciadores clave
- 208-pin RQFP package with exposed thermal pad enables direct PCB heat extraction (frente a EP20K200QC208-1N (non-ETP variant))
- Last-time-buy availability through Rochester Electronics franchise (frente a EP20K200EQC208-1 (APEX 20KE 1.8V variant))
- 200,000 system gates with MultiCore LUT + product-term + EAB mix (frente a Smaller Cyclone III (EP3C5))
Notas de diseño
The APEX-20K requires multiple supply rails: a 2.5 V core (VCCINT) and a 2.5 V/3.3 V I/O rail (VCCIO), plus VREF for voltage-referenced I/O standards like GTL+. Sequence the core rail BEFORE the I/O rail to avoid I/O driving into unpowered buffers, which can latch-up the device. Add bulk decoupling of at least 100 µF low-ESR tantalum plus 0.1 µF X7R ceramic on every VCC pin pair; for the 208-BFQFP package, place the bulk caps on the underside of the PCB directly under the exposed thermal pad to minimize loop inductance. Estimated: at 250 MHz internal activity and ~50% toggle rate, expect Icc_int around 200-400 mA; de-rate for actual design utilization.
The 208-BFQFP package has an exposed thermal pad (ETP) that MUST be soldered to the PCB land pattern for both electrical ground and thermal conduction. For industrial-temperature designs, follow the Altera 208-pin RQFP thermal design guide: provide a copper pour area of at least 1.5 square inches on the top layer tied to the ETP, plus thermal vias in a 4×4 array (0.3 mm hole, 0.5 mm pitch). Without this thermal path, the device cannot dissipate the 1.5-3 W typical power dissipation and will throttle or trigger thermal shutdown at elevated ambient temperatures.
JTAG configuration pins (TMS, TCK, TDI, TDO) and configuration control pins (nCONFIG, nSTATUS, CONF_DONE) require careful PCB layout. Add 1 kΩ pull-up resistors on nCONFIG and a 10 kΩ pull-up on nSTATUS per the APEX-20K configuration handbook; pull TCK down through 1 kΩ to prevent noise-induced boundary-scan operation. Place the configuration PROM (EPC16 or EPC8) within 3 inches of the FPGA data lines to avoid signal-integrity issues; use 4-layer PCB with continuous VCCINT and GND planes for noise-sensitive analog/mixed-signal designs.
Información de cumplimiento
Standard -1 variant is leaded / non-RoHS; the EP20K200RC208-1X suffix marks the RoHS-compliant re-issue per the FindIC comparison entry. Compliance fields marked unknown because the provided data does not explicitly list them.
