EP2AGZ350FF35I3G - Arria II GZ FPGA 350K LE | 1152-FBGA | Intel
N.º de pieza: EP2AGZ350FF35I3G ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $2850 | $2.850,00 |
| 10 | $2620 | $26.200,00 |
| 100 | $2350 | $235.000,00 |
| 500 | $2100 | $1.050.000,00 |
| 1.000 | $1850 | $1.850.000,00 |
EP2AGZ350FF35I3G Descripción general
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a configurable logic-block matrix interconnected by a programmable routing fabric. The Arria II GZ family sits in Intel's mid-range transceiver-equipped tier between Cyclone (low-cost) and Stratix (high-performance), making it well suited for high-speed serial I/O, digital signal processing (DSP), and embedded memory-intensive designs. FPGAs differ from ASICs in being reprogrammable post-fabrication, which compresses development cycles and supports late-stage design changes.
Key features of the EP2AGZ350FF35I3G include 350K logic elements (LEs), 17.4 Mbit embedded memory, embedded DSP blocks for high-throughput arithmetic, multi-gigabit transceivers, and 554 user I/Os. Per the GlobalSpec datasheet listing, the part is built on a 40 nm process node, supports DDR3 external memory interfaces, and includes dedicated hard IP for PCI Express Gen2 and 10 Gigabit Ethernet MACs. The 1152-FBGA flip-chip package enables high pin density and superior electrical/thermal performance compared to wire-bond variants.
Architecturally, the Arria II GZ fabric combines adaptive logic modules (ALMs), M20K memory blocks, and variable-precision DSP blocks. The I3 speed grade represents a mid-bin timing/performance tradeoff versus the I4 and I5 grades, allowing designers to trade margin for cost. The device supports configuration via passive serial, fast passive parallel, JTAG, and encrypted bitstreams.
Typical applications include high-performance digital signal processing (radar, beamforming, wireless baseband), high-speed serial protocol bridging (PCIe Gen2, 10GbE, Serial RapidIO), test and measurement instrumentation, and broadcast video processing. The wide transceivers and DSP density also make the device useful for medical imaging and aerospace flight-control prototyping.
When designing with this device, ensure the PCB has a 1.0 mm or 0.8 mm pitch BGA fanout with microvia stack-ups, because the 1152-ball package demands high-density interconnect (HDI) board technology. Power integrity analysis with the Intel Early Power Estimator is recommended before PCB layout commit.
This page synthesizes distributor stock, life-cycle context for the legacy Arria II GZ family, drop-in same-package variants, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas directas para EP2AGZ350FF35I3G — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP2AGZ350FF35I3G (mismo factor de forma y huella) — difiere en Package, RoHS Status, Transceivers, Operating Temperature Grade, Speed Grade.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP2AGZ350FF35I3
✅ Sustitución directa✓ En stock
$4409.18 / unidad
Ver hoja de datos →EP2AGZ350FF35C3N
✅ Sustitución directa✓ En stock
$2250 / unidad
Ver hoja de datos →EP2AGZ350FF35C3G
✅ Sustitución directa✓ En stock
$2680 / unidad
Ver hoja de datos →EP2AGZ350FF35C4N
✅ Sustitución directa✓ En stock
$2150 / unidad
Ver hoja de datos →EP2AGZ350FF35C4G
✅ Sustitución directa✓ En stock
$1395 / unidad
Ver hoja de datos →EP2AGZ350FF35I3G Valores máximos y características eléctricas
| Family | Arria II GZ |
| Logic Elements | 350,000 |
| Embedded Memory (Bits) | 21,270,528 |
| Embedded RAM | 17.4 Mbit |
| User I/O | 554 |
| Encapsulado | 1152-BBGA, FCBGA |
| Speed Grade | I3 |
| Temperatura de funcionamiento | -40C to +100C (Industrial) |
| Process Node | 40 nm |
| Transceivers | Multi-gigabit transceivers (per Arria II GZ family) |
| DSP Blocks | Yes, variable-precision |
| Memory Interfaces | DDR3, DDR2, QDRII+, RLDRAM II |
| Hard IP | PCIe Gen2, 10GbE MAC |
| Configuration | Passive Serial, Fast Passive Parallel, JTAG |
| Estado RoHS | Compliant (Pb-free, G) |
| Lead-Free | Yes |
Configuración de pines de EP2AGZ350FF35I3G
| Pin BALL-A1 | I/O — User I/O (FF35 package variant, see family handbook for ball-grid coordinates) |
Aplicaciones típicas
EP2AGZ350FF35I3G es adecuado para 7 aplicacións: High-Performance DSP / Radar Signal Processing, High-Speed Serial Protocol Bridging (PCIe Gen2 / 10GbE), Broadcast Video Processing, Test & Measurement Instrumentation, Medical Imaging Systems, Wireless Baseband Processing, Industrial Automation / Machine Vision.
High-Performance DSP / Radar Signal Processing
The EP2AGZ350FF35I3G's 350K logic elements and embedded variable-precision DSP blocks deliver the throughput required for radar baseband, beamforming, and electronic-warfare signal chains. Its embedded M20K memory (17.4 Mbit total) stages FFT and pulse-compression intermediate results without external buffering, while multi-gigabit transceivers move digitized RF data between ADC chips and the FPGA fabric. The 554 user I/Os expose wide parallel LVDS lanes to front-end ADCs and DACs. Versus a smaller 225K LE Arria II GZ device, the 350K variant sustains wider FFT sizes and more parallel channels at the same sample rate.
Recomendado
High-Speed Serial Protocol Bridging (PCIe Gen2 / 10GbE)
Embedded hard IP for PCI Express Gen2 and 10 Gigabit Ethernet MACs makes the EP2AGZ350FF35I3G a strong fit for protocol-bridging cards that aggregate multiple lanes and offload protocol processing from a host CPU. The fabric's 350K LEs allow user-customized DMA engines and protocol-state machines alongside the hard IP. The 1152-FBGA package provides ample signal integrity for multi-gigabit serial lanes, supporting link training at Gen2 5Gbps. Designers typically pair this device with external SFP+ cages or backplane SERDES for line-card designs.
Recomendado
Broadcast Video Processing
Broadcast video processing pipelines benefit from the EP2AGZ350FF35I3G's large logic and memory budgets to handle multi-stream SD/HD/3G-SDI routing, de-interlacing, and chroma resampling at frame-rate. The 554 user I/Os aggregate many parallel video buses plus SDI deserializer inputs, while embedded transceivers handle SDI cable equalization interfaces. The 17.4 Mbit embedded memory lines up naturally with line-buffer sizing for 1080p and 4K processing. The industrial temperature grade (I3) supports use in studio and outside-broadcast equipment racks.
Recomendado
Test & Measurement Instrumentation
The EP2AGZ350FF35I3G's mix of logic, memory, and serial I/O fits arbitrary waveform generators, logic analyzers, and protocol analyzers. DSP blocks implement real-time FIR filtering and arbitrary waveform synthesis, while 17.4 Mbit of M20K memory acts as deep sample storage. The 1152-FBGA package accommodates the wide parallel LVDS buses that connect to high-speed ADC/DAC front-ends. The I3 industrial speed grade supports precision timing margins for measurement applications.
Recomendado
Medical Imaging Systems
Ultrasound beamforming, CT reconstruction, and MRI gradient control demand deterministic real-time DSP with parallel I/O bandwidth - the EP2AGZ350FF35I3G delivers this through 350K LEs, variable-precision DSP blocks, and embedded transceivers. The 17.4 Mbit of memory supports channel-data buffering and image-line storage. The 1152-FBGA package's thermal performance suits enclosed cart-based systems. The industrial temperature grade accommodates clinical-environment thermal envelopes.
Recomendado
Wireless Baseband Processing
The EP2AGZ350FF35I3G can implement LTE and 5G NR baseband PHY layers, including channel coding (Turbo/LDPC), FFT/iFFT, and MIMO precoding, leveraging the variable-precision DSP blocks for efficient complex-arithmetic pipelines. Multi-gigabit transceivers connect to RF front-ends via CPRI or JESD204B. The 554 user I/Os accommodate antenna-carrier parallel interfaces. Memory (17.4 Mbit) handles HARQ soft-buffer storage for LTE uplink.
Recomendado
Industrial Automation / Machine Vision
Multi-camera machine-vision systems benefit from the EP2AGZ350FF35I3G's parallel LVDS bandwidth (554 user I/Os) to ingest CoaXPress or Camera Link frames, and from DSP blocks for real-time image pre-processing. The 17.4 Mbit embedded memory stages frame-data buffers between camera links and processing pipelines. The I3 industrial speed grade and -40C to +100C operating range suit factory-floor enclosures. The device can also drive EtherCAT or PROFINET protocol stacks via soft IP.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP2AGZ350FF35I3G — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP2AGZ350FF35I3 | EP2AGZ350FF35C3N | EP2AGZ350FF35C3G | EP2AGZ350FF35C4N | EP2AGZ350FF35C4G |
|---|---|---|---|---|---|---|
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 350,000 | 350,000 | 350,000 | 350,000 | 350,000 | 350,000 |
| Speed Grade | I3 (industrial) | I3 (industrial) | C3 (commercial, faster) | C3 (commercial, faster) | C4 (commercial, slower) | C4 (commercial, slower) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Lead-Free (Pb-free) | Yes (G suffix) | No (no G suffix) | No | Yes (G suffix) | No | Yes (G suffix) |
| Embedded Memory | 21,270,528 bits (17.4 Mbit) | 21,270,528 bits | 21,270,528 bits | 21,270,528 bits | 21,270,528 bits | 21,270,528 bits |
| User I/O | 554 | 554 | 554 | 554 | 554 | 554 |
| Packaging Media | Tray | Tray | Tray | Tray | Tape & Reel (N suffix) | Tape & Reel (N suffix) |
Diferenciadores clave
- Highest LE count in 1152-FBGA Arria II GZ family (frente a EP2AGZ225FF35I3G (225K LE))
- Industrial temperature grade for harsh environments (frente a EP2AGZ350FF35C3G (commercial C3 grade))
- Pb-free (RoHS) lead finish (frente a EP2AGZ350FF35I3 (non-Pb-free))
Notas de diseño
The 1152-ball FCBGA package demands HDI PCB stack-up with microvias (laser-drilled, 4-6-6-6 layer typical). Use the device handbook's package drawing to extract ball-pitch (1.0 mm or 0.8 mm depending on FF35 sub-variant) and verify your PCB vendor supports the required via-in-pad or dog-bone fanout. Decoupling capacitors should be placed on the BGA's underside via short, wide traces to keep power-impedance low for core transients.
Estimated: with 350K LEs and multiple transceivers active, the EP2AGZ350FF35I3G can draw 5-15W depending on toggle rate. Use the Intel Early Power Estimator (EPE) tool before PCB layout commit. Provide separate analog and digital supply planes (PLL analog rails are noise-sensitive), and place ferrite beads or pi-filters between shared rails. A bulk capacitor bank of 220uF+ polymer or tantalum plus 0.1uF/1uF/10uF ceramics is recommended near each power ball group.
Multi-gigabit transceiver channels require controlled-impedance routing (100 ohm differential for transceivers, 50 ohm single-ended for high-speed LVDS). Reference the Arria II GZ device handbook's Transceiver chapter for pre-emphasis, equalization, and PCB trace-length matching. For DDR3 external memory interfaces, enforce matched-length routing within 25 mil across byte lanes and use fly-by topology with write-leveling calibration.
The Arria II GZ family is in NRND status - confirm long-term supply before committing to new designs. Arria II GZ is supported only by Quartus II (legacy), not newer Quartus Prime - retain the legacy toolchain on a documented build machine. Configuration bitstream compatibility between speed grades requires recompilation; never assume a 'C3 bitstream runs on I3 silicon' without re-quartus compile.
Información de cumplimiento
RoHS compliant per the 'G' suffix in MPN. AEC-Q100 not applicable (FPGA, not an automotive-grade IC). REACH/halogen-free/conflict-minerals status not confirmed in verified data.