EP2S60F67214N - Stratix II FPGA 60K LE FBGA-672 | Intel / Altera
N.º de pieza: EP2S60F67214N ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $385 | $385,00 |
| 10 | $340 | $3.400,00 |
| 25 | $305 | $7.625,00 |
| 100 | $268 | $26.800,00 |
| 500 | $232 | $116.000,00 |
EP2S60F67214N Descripción general
A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic fabric, interconnect, and I/O cells are configured by the user via a hardware description language (HDL) bitstream. Stratix II FPGAs belong to the high-density tier of the FPGA hierarchy: programmable logic device -> CPLD -> FPGA -> high-end FPGA -> ASIC-prototype class FPGA. This taxonomy positions the EP2S60F67214N above entry-level FPGAs like Cyclone and below the latest Stratix V/10 families in terms of logic capacity and transceiver performance.
Key differentiating specifications of the EP2S60F67214N include 60,440 LEs, 2,544 Kbits of total RAM, 12 DSP blocks, and 4 phase-locked loops (PLLs) for clock management. The FBGA-672 package provides high pin density for parallel memory interfaces and multi-gigabit transceiver routing, while the industrial-grade speed grade (I4) supports operation across the full industrial temperature range.
Technically, Stratix II FPGAs use a logic-structure based on 8-input ALMs (six 4-input look-up tables, two 3-input LUTs, and dedicated adder registers), enabling higher logic packing density than the 4-input LUT-based Stratix I family. The 90 nm process and 1.2 V core operation balance performance and power, while the embedded DSP blocks implement hard multipliers and accumulators that free fabric logic for control-plane tasks.
Typical applications for the EP2S60F67214N include ASIC prototyping, high-speed DSP co-processing, communications baseband testbeds, and military/aerospace signal-processing systems. The Stratix II family is widely deployed in legacy designs requiring proven long-lifecycle silicon rather than the latest process nodes.
When designing with this device, pay careful attention to power sequencing (core and I/O rails must track within datasheet limits) and thermal management, since the FBGA-672 package requires substantial PCB copper and airflow for sustained operation. Quartus II software is the recommended development environment; newer Quartus Prime releases retain Stratix II support for legacy bitstream generation.
This page synthesizes distributor pricing, drop-in same-package Stratix II family variants, and practical design notes that are not consolidated in any single Altera datasheet document.
Alternativas directas para EP2S60F67214N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP2S60F67214N (mismo factor de forma y huella) — difiere en Package, Speed Grade, RoHS Status, Logic Array Blocks (LABs), Total RAM Bits.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP2S60F672I4N
✅ Sustitución directa✓ En stock
$220 / unidad
Ver hoja de datos →EP2S60F672C5N
✅ Sustitución directa✓ En stock
$170 / unidad
Ver hoja de datos →EP2S60F672C4N
✅ Sustitución directa✓ En stock
$325 / unidad
Ver hoja de datos →EP2S30F672I4N
✅ Sustitución directa✓ En stock
$145 / unidad
Ver hoja de datos →EP2S30F672I4
✅ Sustitución directa✓ En stock
$695 / unidad
Ver hoja de datos →EP2S60F67214N Valores máximos y características eléctricas
| Family | Stratix II |
| Logic Elements | 60,440 LE |
| Total RAM Bits | 2,544,192 bit (2.5 Mbit) |
| DSP Blocks | 12 |
| Phase-Locked Loops (PLLs) | 4 |
| Encapsulado | 672-ball FBGA (FineLine BGA) |
| Tipo de montaje | Surface Mount |
| Speed Grade | I4 (industrial, fast) |
| Temperatura de funcionamiento | -40C to +100C (industrial) |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V (typical) |
| Configuration | SRAM-based, configured via bitstream |
| Estado RoHS | Lead-free / RoHS compliant |
| Nivel MSL | 3 (168 hours floor life) |
Guía de configuración de pines de EP2S60F67214N 672-ball fbga (fineline bga)
Configuración de pines para EP2S60F67214N (encapsulado 672-ball fbga (fineline bga)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP2S60F67214N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP2S60F67214N es adecuado para 6 aplicacións: ASIC Prototyping, Communications Baseband Signal Processing, Military and Aerospace Signal Processing, High-Speed Test and Measurement Equipment, Industrial Image Processing, Legacy Networking Infrastructure.
ASIC Prototyping
The EP2S60F67214N's 60,440 logic elements and 12 dedicated DSP blocks provide sufficient capacity to prototype mid-complexity ASIC RTL designs at near-gate speed. With Quartus II synthesis and timing-driven place-and-route, design teams can validate functional correctness and clock-domain behaviour months before tape-out, slashing respin risk on multi-million-gate ASICs. The FBGA-672 package exposes enough I/O to map ASIC pads for memory bus, JTAG, and clock trees without resorting to multi-FGA partitioning.
Recomendado
Communications Baseband Signal Processing
The 12 hard DSP blocks of the EP2S60F67214N implement parallel FIR filters, FFTs, and channelization pipelines for baseband receivers. With 2.5 Mbits of embedded RAM, designers can place channelization coefficient tables and packet buffers on-chip, eliminating external SRAM accesses and reducing latency to nanosecond scale. The 4 PLLs derive multiple clock domains from a single reference oscillator, supporting simultaneous ADC sampling and digital downconversion paths.
Recomendado
Military and Aerospace Signal Processing
Stratix II FPGAs are widely deployed in military and aerospace systems where long-life-cycle silicon and proven IP libraries outweigh bleeding-edge performance. The EP2S60F67214N's industrial temperature rating and established process maturity make it acceptable for ruggedized platforms. With 12 DSP blocks and 60K LEs, the device hosts radar pulse compression, EW channelization, and avionics display controllers in compact, BGA-friendly footprints.
Recomendado
High-Speed Test and Measurement Equipment
The EP2S60F67214N's combination of 4 PLLs and high-performance fabric enables multi-channel logic-analyzer and protocol-analyzer front ends. Engineers use the embedded DSP blocks for hardware-accelerated pattern matching and statistical analysis at multi-Gsps rates, while the abundant RAM holds deep acquisition buffers. The FBGA-672 ballout supports LVDS and DDR memory interfaces needed to push sample data to host processors without bottleneck.
Recomendado
Industrial Image Processing
With 12 DSP blocks and 2.5 Mbits of RAM, the EP2S60F67214N runs real-time image preprocessing pipelines such as Sobel edge detection, FFT-based texture analysis, and Bayer demosaicing for industrial cameras. The 672-ball BGA footprint supports LVDS camera-link inputs and DDR2 line buffers needed for multi-megapixel sensor data rates. Designers also exploit the fabric for conveyor-tracking and machine-vision control loops on the same silicon.
Recomendado
Legacy Networking Infrastructure
Stratix II FPGAs like the EP2S60F67214N power multi-Gbps packet processors, traffic managers, and encryption offload engines in legacy carrier-grade networking gear. The 12 DSP blocks accelerate Reed-Solomon and AES cipher pipelines, while 2.5 Mbits of on-chip RAM implements deep queue structures without external TCAMs. Field-deployed equipment benefits from the silicon's longevity and broad Quartus II IP library support.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP2S60F67214N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP2S60F672I4N | EP2S60F672C5N | EP2S60F672C4N | EP2S30F672I4N | EP2S30F672I4 |
|---|---|---|---|---|---|---|
| Package | FBGA-672 | FBGA-672 - same | FBGA-672 - same | FBGA-672 - same | FBGA-672 - same | FBGA-672 - same |
| Brand | Altera (Intel) | Altera - same | Altera - same | Altera - same | Altera - same | Altera - same |
| Logic Elements | 60,440 LE | 60,440 LE - identical | 60,440 LE - identical | 60,440 LE - identical | 33,880 LE (-50%) | 33,880 LE (-50%) |
| Speed Grade | I4 (industrial) | I4 - identical | C5 (commercial, faster) | C4 (commercial, slower) | I4 (industrial) | I4 (industrial) |
| DSP Blocks | 12 | 12 - identical | 12 - identical | 12 - identical | 8 (-33%) | 8 (-33%) |
| Total RAM | 2.5 Mbit | 2.5 Mbit - identical | 2.5 Mbit - identical | 2.5 Mbit - identical | 1.7 Mbit (-32%) | 1.7 Mbit (-32%) |
| PLLs | 4 | 4 - identical | 4 - identical | 4 - identical | 4 - identical | 4 - identical |
| Operating Temperature | Industrial (I-grade) | Industrial - identical | Commercial (0-85C) | Commercial (0-85C) | Industrial - identical | Industrial - identical |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Stratix II mid-density sweet spot with 60K LE and full DSP block count (frente a EP2S30F672I4N)
- Speed-grade flexibility within the same silicon (frente a EP2S60F672C5N)
- Mid-tier power vs Cyclone II (frente a EP2C70F896)
Notas de diseño
Stratix II FPGAs require multiple supply rails (VCCINT, VCCIO, VCCA_PLL, VCCD_PLL) that must sequence within the datasheet-mandated ramp rates. A recommended power-on sequence is VCCINT first (1.2 V), then VCCIO, then VCCA_PLL, with all rails tracking within 100 ms. Reverse sequencing on power-down is also critical to avoid latch-up. Use a dedicated FPGA supervisor or the Altera PowerPlay power estimator to validate supply design before PCB layout.
Estimated: at 60K LE utilization with 12 DSP blocks at full toggle rate, total power consumption approaches 8-12 W. The FBGA-672 package requires substantial PCB copper pour (>= 4 layer board with thermal vias under the die) and, in many designs, active airflow. Verify junction temperature with the Stratix II thermal model - do not exceed 100C junction in industrial applications.
FBGA-672 requires high-density PCB routing: at least 6 layers, with microvia or via-in-pad stack-ups to break out the BGA. Maintain 50 ohm controlled impedance on all high-speed transceiver lanes (if used) and LVDS pairs, and route differential pairs with matched lengths within 150 mil. Decoupling: place 0.1 uF and 0.01 uF ceramic capacitors directly under the package on both top and bottom layers, with bulk capacitors on every supply plane.
Do not assume newer Quartus Prime releases fully synthesize Stratix II without warnings - some IP cores from later families are not retro-compatible. Always pin Quartus II 13.0 SP1 (or the last Strat II-supported release) for design stability. Also verify configuration mode compatibility: older EPC4/EPC8 configuration devices may not support the EP2S60 F672 fast-page-write timing.
Información de cumplimiento
Lead-free / RoHS compliant per Kynix and MFMIC distributor listings. AEC-Q100 is not applicable (FPGAs do not carry automotive qualification by default). Reach and halogen-free status not explicitly stated in distributor data and require manufacturer inquiry.