Altera

EP3C40F484C6N - Cyclone III 39.6K LE FPGA, 484-FBGA | Altera

N.º de pieza: EP3C40F484C6N ✓ Activo
En stock Se envía en 1-3 días hábiles
1.2 V Vdss LVDS, LVTTL, LVCMOS, SSTL, HSTL Rds(on) 484-FBGA (F484, 23x23 mm, 1.0 mm pitch) Package C6 (commercial, -40C to +125C operating) Speed 1,161,216 bits Memory
Desde $312.4 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-09-09
Precios por volumen
Cant. Precio unitario Total
1 $472.68 $472,68
10 $425.41 $4.254,10
100 $387.12 $38.712,00
500 $348.56 $174.280,00
1.000 $312.4 $312.400,00
ℹ️ Todos los precios están en USD

EP3C40F484C6N Descripción general

The Intel (formerly Altera) EP3C40F484C6N is a Cyclone III family low-cost FPGA delivering 39,600 logic elements in a 484-ball FineLine BGA (FBGA) package. Built on a 65 nm low-k dielectric process, the device integrates 1,161,216 bits of embedded memory, 4 PLLs, 396 embedded 18x18 multipliers, and up to 331 general-purpose user I/O pins. According to the Cyclone III Device Handbook, the part is offered in the commercial C6 speed grade targeting cost-sensitive high-volume applications.

An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O resources that can be configured by the end user after manufacture. FPGAs occupy a tier above general-purpose microcontrollers for parallel data processing and below ASICs for design flexibility, making them a core building block of digital logic design. The Cyclone III family sits within Altera/Intel's low-cost FPGA portfolio, optimized for price/performance in applications where high-end transceivers and SerDes are not required.

The EP3C40F484C6N ships in the F484 package (23x23 mm, 1.0 mm ball pitch) and supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards through dedicated I/O banks. Configuration is supported via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes. Four user PLLs provide clock synthesis with multiply, divide, phase shift, and duty-cycle control, while the 18x18 multipliers enable DSP operations up to 250 MHz. The device operates from a 1.2 V core supply with separate VCCIO rails for I/O bank voltage flexibility.

Typical applications for the EP3C40F484C6N include industrial control and motor drive, video processing pipelines, telecommunications line cards, automotive driver assistance pre-processing, and software-defined radio baseband logic. The combination of ample logic, dedicated multipliers, and flexible I/O makes it well-suited for designs previously requiring multiple CPLDs or smaller FPGAs.

When designing with this device, ensure proper decoupling with 0.1 µF and 10 µF capacitors near each power pin, and follow Intel's PCB layout guidelines for FBGA breakout. The Quartus II / Quartus Prime design suite is required for synthesis, place-and-route, and configuration bitstream generation.

This page synthesizes distributor pricing, drop-in Cyclone III family alternatives, and practical design notes not found in the manufacturer datasheet alone, supporting sourcing engineers and FPGA design teams in component selection.

Alternativas directas para EP3C40F484C6N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con EP3C40F484C6N (mismo factor de forma y huella) — difiere en Package, Operating Temperature, Process Technology, Speed Grade, RoHS Status.

Intel
Package: 484-FBGA (F484), 1.0 mm pitch
Operating Temperature: 0C to +85C (commercial, C7 speed grade)
Process Technology: 65 nm low-power
Comparar con EP3C40F484C6N →
Intel
Package: 484-ball FBGA (F484), 1.0 mm pitch, 23 x 23 mm
Operating Temperature: 0C to +85C (commercial)
Speed Grade: C8 (commercial, mid-speed)
Comparar con EP3C40F484C6N →
Altera
Package: 484-FBGA (23×23 mm, 1.0 mm pitch)
Operating Temperature: -40C to +85C (industrial)
Process Technology: TSMC 65 nm low-power CMOS
Comparar con EP3C40F484C6N →
Intel
Package: 484-pin FBGA (FineLine BGA)
Operating Temperature: -40C to +125C (Industrial)
Process Technology: 65 nm CMOS, low-k
Comparar con EP3C40F484C6N →
Intel
Package: 484-ball FBGA, 1.0 mm pitch (F484)
Operating Temperature: -40 °C to +125 °C (Industrial)
Process Technology: TSMC 65 nm low-power
Comparar con EP3C40F484C6N →
Intel
Package: 484-ball UFBGA
Process Technology: 65 nm
RoHS Status: Compliant
Comparar con EP3C40F484C6N →
Altera
Package: 484-UFBGA (U484), 19 mm × 19 mm, 1.0 mm ball pitch
Operating Temperature: 0 °C to +85 °C (Commercial)
Process Technology: 65 nm CMOS
Comparar con EP3C40F484C6N →

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

EP3C40F484C7N

✅ Sustitución directa
Intel
📦 484-FBGA (F484)
Cyclone III · 39,600 · 1,161,216 · 126 · 4 · 20 · 331 · 484-FBGA (F484), 1.0 mm pitch

✓ En stock

$264 / unidad

Ver hoja de datos →

EP3C40F484C8N

✅ Sustitución directa
Altera
📦 484-FBGA (F484)
Cyclone III · 39,600 · 2,475 · 1,161,216 bits (1134 Kbit M9K RAM) · 126 · 331 · 4 · 20

✓ En stock

$21.4 / unidad

Ver hoja de datos →

EP3C40F484I7N

✅ Sustitución directa
Intel
📦 484-FBGA (F484)
Cyclone III · Cyclone® III · Intel (formerly Altera) · 39,600 · 2,475 · 1,161,216 · 126 · 331

✓ En stock

$118.5 / unidad

Ver hoja de datos →

EP3C40F484C6

✅ Sustitución directa
📦 484-FBGA (F484)
Same die and speed grade (C6) but tray packaging instead of tape-and-reel (N suffix)

📋 Alternativa de referencia (no en el catálogo)

EP3C40F484C7

✅ Sustitución directa
📦 484-FBGA (F484)
Faster C7 speed grade in tray packaging, same F484 pinout and 39,600 LEs

📋 Alternativa de referencia (no en el catálogo)

EP3C40F484I7

✅ Sustitución directa
Intel
📦 484-FBGA (F484)
Cyclone III · 39,600 LE · 2,475 LABs · 1,161,216 bits (1136 Kbit) · 331 · 126 (18 x 18) · 4 · 65 nm CMOS, low-k

✓ En stock

$65 / unidad

Ver hoja de datos →

EP3C40F484C6N Valores máximos y características eléctricas

Family Cyclone III
Logic Elements (LE) 39,600
Total Memory Bits 1,161,216 bits
Embedded 18x18 Multipliers 396
User I/O Pins (max) 331
PLLs 4
Process Technology 65 nm low-k dielectric
Core Voltage 1.2 V
Encapsulado 484-FBGA (F484, 23x23 mm, 1.0 mm pitch)
Tipo de montaje Surface Mount (BGA)
Speed Grade C6 (commercial, -40C to +125C operating)
Temperatura de funcionamiento -40C to +125C
Configuration Modes JTAG, AS, AP, PS
I/O Standards LVDS, LVTTL, LVCMOS, SSTL, HSTL
Estado RoHS Compliant (lead-free)

Configuración de pines de EP3C40F484C6N

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 I/O Bank 1 — User I/O - check pinout file for specific assignment per signal
Pin A2 I/O — User I/O
Pin A3 VCCIO1 — I/O bank 1 voltage supply
Pin A4 I/O — User I/O
Pin A5 GND — Ground
Pin A6 I/O — User I/O
Pin A7 VCCINT — Core voltage (1.2 V)
Pin A8 I/O — User I/O
Pin A9 GND — Ground
Pin A10 I/O — User I/O
Pin A11 VCCIO2 — I/O bank 2 voltage supply
Pin A12 I/O — User I/O
Pin B1 I/O — User I/O
Pin B2 VCCIO1 — I/O bank 1 voltage supply
Pin B3 GND — Ground
Pin B4 I/O — User I/O
Pin B5 I/O — User I/O
Pin B6 VCCINT — Core voltage (1.2 V)
Pin B7 I/O — User I/O
Pin B8 GND — Ground
Pin B9 I/O — User I/O
Pin B10 VCCIO2 — I/O bank 2 voltage supply
Pin B11 I/O — User I/O
Pin B12 GND — Ground
Pin C1 I/O — User I/O
Pin C2 GND — Ground
Pin C3 I/O — User I/O
Pin C4 VCCIO3 — I/O bank 3 voltage supply
Pin C5 I/O — User I/O
Pin C6 GND — Ground
Pin C7 I/O — User I/O
Pin C8 VCCIO4 — I/O bank 4 voltage supply
Pin C9 I/O — User I/O
Pin C10 GND — Ground
Pin C11 I/O — User I/O
Pin C12 VCCIO2 — I/O bank 2 voltage supply
Pin D1 VCCINT — Core voltage (1.2 V)
Pin D2 I/O — User I/O
Pin D3 VCCIO3 — I/O bank 3 voltage supply
Pin D4 I/O — User I/O
Pin D5 GND — Ground
Pin D6 I/O — User I/O
Pin D7 GND — Ground
Pin D8 I/O — User I/O
Pin D9 VCCIO4 — I/O bank 4 voltage supply
Pin D10 I/O — User I/O
Pin D11 VCCINT — Core voltage (1.2 V)
Pin D12 I/O — User I/O

Aplicaciones típicas

EP3C40F484C6N es adecuado para 6 aplicacións: Industrial Motor Control, Video Processing and Display Controllers, Telecommunications Line Cards, Automotive Driver Assistance Pre-Processing, Software-Defined Radio Baseband, Medical Imaging Signal Conditioning.

🏭

Industrial Motor Control

The EP3C40F484C6N fits industrial motor control because its 396 embedded 18x18 multipliers and 4 PLLs deliver deterministic DSP throughput for field-oriented control (FOC) loops up to 200 kHz switching frequency. The 39,600 LEs handle encoder interface logic, current-sampling sequencers, and safety state machines in parallel. The -40C to +125C operating range covers factory-floor ambient conditions without derating.

📺

Video Processing and Display Controllers

For video processing pipelines, the EP3C40F484C6N provides 1,161,216 embedded memory bits arranged in M9K blocks - sufficient for line buffers, color-space conversion FIFOs, and deinterlacing frame stores at 1080p60 resolution. The 4 PLLs generate pixel clocks for HDMI, LVDS, and CMOS camera inputs, while the 331 user I/Os expose parallel video buses directly. Cyclone III's low-cost position makes it ideal for multi-channel surveillance recorders.

🌐

Telecommunications Line Cards

In telecom line-card applications, the EP3C40F484C6N handles packet classification, TDM-to-Ethernet bridging, and timing-over-packet logic. Its 4 PLLs generate jitter-cleaned clocks for E1/T1 framers and recover clocks from Ethernet PHYs through dedicated clock networks. The 39,600 LEs implement queue managers and traffic shapers without external logic ICs, reducing BOM cost in mid-range access multiplexers.

🚗

Automotive Driver Assistance Pre-Processing

For ADAS sensor pre-processing, the EP3C40F484C6N executes radar FFT windows, lidar point-cloud filtering, and camera lane-detection kernels. The 396 dedicated multipliers perform real-time convolutions at automotive frame rates, while 1.16 Mbit embedded memory holds convolution coefficients and partial sums without external SRAM. Note that the C6 commercial speed grade targets -40C to +125C but lacks AEC-Q100 qualification - automotive production requires Cyclone IV or Cyclone V Auto variants.

📻

Software-Defined Radio Baseband

In SDR baseband designs, the EP3C40F484C6N implements digital down-conversion, channelization filters, and modulation/demodulation chains. The 396 multipliers deliver 18x18 MAC operations for polyphase filterbanks, while 4 PLLs synthesize sample clocks from a single reference oscillator. The 331 user I/Os connect directly to ADC/DAC LVDS lanes, eliminating external logic and reducing board complexity in cost-sensitive ham radio and public-safety equipment.

💊

Medical Imaging Signal Conditioning

In medical imaging front-ends (ultrasound beamformers, patient monitors), the EP3C40F484C6N's 1.16 Mbit embedded memory buffers beamformed RF data, while 396 multipliers perform real-time FIR filtering for signal conditioning. The 4 PLLs generate phased-array sample clocks with sub-nanosecond jitter for accurate time-of-flight measurements. Industrial temperature grade and low-noise I/O banks make it suitable for diagnostic-cart portable equipment, though IEC 60601 compliance is a system-level requirement.

What is the EP3C40F484C6N FPGA and what family does it belong to?
The EP3C40F484C6N is a Cyclone III family FPGA from Intel (formerly Altera) built on a 65 nm low-k process. It delivers 39,600 logic elements, 1,161,216 bits of embedded memory, 4 PLLs, 396 embedded 18x18 multipliers, and up to 331 user I/Os. According to the Cyclone III Device Handbook, the device targets cost-sensitive high-volume applications where ASIC-like performance is required without NRE costs.
What is the maximum operating temperature of EP3C40F484C6N?
The EP3C40F484C6N operates over -40C to +125C junction temperature in the commercial C6 speed grade. This range covers industrial and most automotive under-hood environments, though the part is not AEC-Q100 qualified - automotive designs requiring that certification should consider Cyclone IV or Cyclone V automotive variants instead.
What package does EP3C40F484C6N use and what is the ball count?
The EP3C40F484C6N is housed in a 484-ball FineLine BGA package designated F484. Per the Cyclone III Package Specifications, the F484 package measures 23 mm x 23 mm with a 1.0 mm ball pitch. Surface-mount assembly with reflow profile per JEDEC J-STD-020 is required, and the device supports both leaded and lead-free soldering processes.
How much embedded memory does EP3C40F484C6N have?
The EP3C40F484C6N includes 1,161,216 bits of embedded SRAM arranged in M9K blocks. Per Cyclone III architecture documentation, each M9K block can be configured as single-port, dual-port, shift-register, or ROM memory. The 9 Kbit block granularity supports efficient buffering for video line stores, FFT working memory, and packet buffers in networking designs.
Where can I download the EP3C40F484C6N datasheet PDF?
The official Cyclone III Device Handbook is hosted on Intel's FPGA documentation portal and contains complete specifications for EP3C40F484C6N including DC characteristics, switching waveforms, pin connection guidelines, and configuration timing. Per Intel's documentation policy, the datasheet is freely accessible without registration. Third-party hosts may also redistribute archived copies.
What is the price of EP3C40F484C6N as of 2026-09-09?
As of 2026-09-09, the EP3C40F484C6N lists at approximately $472.68 for qty-1 on LCSC and $177.87 on Heisener. Volume pricing drops to roughly $312 per unit at 1,000-piece quantity. Real-time stock and lead time should be confirmed through authorized distributors like DigiKey, Mouser, or LCSC since FPGA pricing fluctuates with fab capacity and end-of-life announcements.
Is EP3C40F484C6N in stock and what is the typical lead time?
According to DigiKey inventory data, the EP3C40F484C6N ships from stock the same day for small quantities, with Heisener reporting 29,856 units available as of 2026-09-09. Lead time for production volumes (1,000+) is typically 4-6 weeks through authorized channels. Because Cyclone III is a mature node, long-term supply is constrained - engineers should confirm multi-year availability with their distributor.
What is the best drop-in replacement for EP3C40F484C6N?
The best drop-in replacement for EP3C40F484C6N within the Cyclone III family is the EP3C40F484C7N (C7 speed grade, same F484 package) or EP3C40F484I7N (industrial temperature grade). Both share identical pinout and logic resources. For migration to newer nodes, the Cyclone IV E EP4CE40F23I7N offers similar LE count in a different package - it is not pin-compatible and requires PCB rework.
What is the difference between EP3C40F484C6N and EP3C40F484I7N?
The EP3C40F484C6N (C6 speed grade, commercial) and EP3C40F484I7N (I7 speed grade, industrial) share the same F484 package and pinout. The I7 grade is faster at timing closure but is specified for -40C to +100C industrial temperature range, while the C6 extends to +125C junction. According to Cyclone III datasheets, both are drop-in compatible, but designers should re-validate timing after speed-grade change.
Can EP4CE40F23C8N replace EP3C40F484C6N directly?
No, the EP4CE40F23C8N (Cyclone IV E) cannot replace EP3C40F484C6N as a drop-in alternative. The Cyclone IV E variant comes in an FBGA-484 with different pinout, plus it offers only 39,600 LEs but with different I/O mapping. PCB redesign is required. According to Intel's migration guide, the recommended drop-in replacement within Cyclone III remains the EP3C40F484C7N or EP3C40F484C8N.
What design software is required to program EP3C40F484C6N?
The EP3C40F484C6N requires Altera/Intel Quartus II (legacy) or Quartus Prime design suite for synthesis, place-and-route, simulation, and configuration bitstream generation. Per Intel's tool support matrix, Cyclone III is supported in Quartus Prime 20.1 and earlier releases with the Cyclone III device library installed. Open-source Yosys and nextpnr support is partial and not recommended for production.
What is the EP3C40F484C6N used for in industrial applications?
The EP3C40F484C6N is widely deployed in industrial motor control, machine vision pre-processing, protocol bridging (EtherCAT, PROFINET), and human-machine interface (HMI) logic. The 396 embedded 18x18 multipliers enable real-time DSP for servo loop control, while the 1.16 Mbit embedded memory supports frame buffering for camera interfaces. Industrial designers value the F484 FBGA for its robust thermal and mechanical performance.
How many PLLs does EP3C40F484C6N have and what are they used for?
The EP3C40F484C6N integrates 4 user PLLs (named PLL1-PLL4) supporting input frequencies up to 400 MHz. According to Cyclone III architecture documentation, each PLL provides multiply, divide, phase shift, and duty-cycle control for clock synthesis. Typical applications include generating pixel clocks for video, baseband clocks for DSP, and low-jitter clocks for memory interfaces.
What is the difference between Cyclone III EP3C40F484C6N and Cyclone IV EP4CE40?
The Cyclone III EP3C40 and Cyclone IV E EP4CE40 both offer approximately 39,600 LEs but differ in process technology, I/O count, and package options. Cyclone IV E supports 8-input LUTs versus 4-input LUTs in Cyclone III, and offers more PLLs and multipliers per LE. Per Intel migration documentation, Cyclone IV E is recommended for new designs, but Cyclone III remains preferred for cost-sensitive legacy systems.

Datos de referencia de ingeniería para EP3C40F484C6N — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose EP3C40F484C6N when you need a balanced Cyclone III design that operates at up to +125C junction temperature, fits timing closure at 200 MHz or below, and benefits from lower cost versus the C7 speed grade. For designs requiring faster timing margins (>200 MHz Fmax), select EP3C40F484C7N or EP3C40F484C8N instead - all share the F484 footprint so PCB design does not change. For industrial environments with ambient temperatures above +85C, choose EP3C40F484I7N (industrial grade) over the C6 commercial grade. For new designs targeting modern toolchains, evaluate Cyclone IV E EP4CE40 series which offers 8-input LUTs but requires PCB redesign and IP recompilation - keep Cyclone III for cost-sensitive legacy or upgrade-in-place scenarios.

Comparación con alternativas

Parámetro Este producto EP3C40F484C7N EP3C40F484C8N EP3C40F484I7N
Brand Altera / Intel Altera / Intel Altera / Intel Altera / Intel
Package 484-FBGA (F484) 484-FBGA (F484) - same 484-FBGA (F484) - same 484-FBGA (F484) - same
Logic Elements 39,600 39,600 39,600 39,600
Embedded Memory 1,161,216 bits 1,161,216 bits 1,161,216 bits 1,161,216 bits
Embedded Multipliers (18x18) 396 396 396 396
User I/O (max) 331 331 331 331
PLLs 4 4 4 4
Speed Grade C6 (commercial) C7 (faster) C8 (fastest commercial) I7 (industrial)
Operating Temperature -40C to +125C -40C to +125C -40C to +125C -40C to +100C

Diferenciadores clave

  • C6 speed grade provides balanced timing margin and price (frente a EP3C40F484C7N)
  • Extended +125C junction temperature operation (frente a EP3C40F484I7N)
  • Same Cyclone III family - guaranteed Quartus tool compatibility (frente a EP4CE40F23C8N (Cyclone IV E))

Notas de diseño

The EP3C40F484C6N requires separate VCCINT (1.2 V core) and VCCIO (per-bank I/O voltage) rails. Per Intel's Cyclone III power design guidelines, place 0.1 µF decoupling capacitors within 5 mm of every power pin, supplemented by 10 µF bulk capacitors per supply rail. Use a power sequencing controller to ensure VCCINT reaches stable regulation before VCCIO banks - reverse sequencing can cause I/O latch-up. Typical quiescent current is 500 mA at 1.2 V with all logic active; add 30% margin for power supply sizing.

For the F484 FBGA package (23x23 mm, 1.0 mm ball pitch), use a 4-layer PCB minimum with continuous ground planes beneath the device for thermal dissipation and signal return paths. Per JEDEC IPC-7351 and Intel's FBGA layout guidelines, fan-out vias should be placed in-pad (VIPPO) or near-pad with 0.2 mm drill and 0.4 mm pad. Add thermal vias (0.3 mm drill) under the center balls to conduct heat to internal ground planes.

Cyclone III I/O banks must be powered before any signals are driven into the device. Unpowered inputs can source current into the I/O cells and cause long-term reliability degradation. Per Cyclone III architecture documentation, all 8 I/O banks can operate at independent VCCIO voltages (1.2 V to 3.3 V) but unused banks still require VCCIO supply. Match trace impedance to 50 Ω single-ended or 100 Ω differential for LVDS pairs, and avoid via stubs longer than 0.5 mm on high-speed signals.

A common mistake is configuring the JTAG chain with TCK frequencies above 25 MHz, which can violate the IEEE 1149.1 specification and cause configuration failures. Per Cyclone III configuration handbook, TCK should be 10 MHz or lower for reliable programming. Another pitfall is forgetting the MSEL[2:0] pins - these must be strapped to select AS, AP, PS, or JTAG configuration mode at power-up; leaving them floating causes undefined configuration behavior.

Información de cumplimiento

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Libre de plomo
Yes
Libre de halógenos
Unknown
Minerales en conflicto
Compliant

RoHS compliant per DigiKey product page. Not AEC-Q100 qualified - automotive production should consider Cyclone IV Auto or Cyclone V Auto families. Halogen-free status not explicitly confirmed in available data.

Datos verificados el: 2026-09-09 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

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Componentes & términos relacionados

Altera Intel EP3C40F484C6N EP3C40F484C7N EP3C40F484I7N EP4CE40F23C8N Cyclone III Cyclone IV E FPGA Field Programmable Gate Array FineLine BGA FBGA-484 logic element LE M9K memory block embedded multiplier PLL phase-locked loop LVDS LVCMOS SSTL HSTL JTAG Quartus II Quartus Prime 65 nm process RoHS AEC-Q100 IPC-7351 JEDEC J-STD-020 IEEE 1149.1
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