EP3C40F484C6N - Cyclone III 39.6K LE FPGA, 484-FBGA | Altera
N.º da peça: EP3C40F484C6N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $472.68 | $472,68 |
| 10 | $425.41 | $4.254,10 |
| 100 | $387.12 | $38.712,00 |
| 500 | $348.56 | $174.280,00 |
| 1.000 | $312.4 | $312.400,00 |
EP3C40F484C6N Visão geral
An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O resources that can be configured by the end user after manufacture. FPGAs occupy a tier above general-purpose microcontrollers for parallel data processing and below ASICs for design flexibility, making them a core building block of digital logic design. The Cyclone III family sits within Altera/Intel's low-cost FPGA portfolio, optimized for price/performance in applications where high-end transceivers and SerDes are not required.
The EP3C40F484C6N ships in the F484 package (23x23 mm, 1.0 mm ball pitch) and supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards through dedicated I/O banks. Configuration is supported via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes. Four user PLLs provide clock synthesis with multiply, divide, phase shift, and duty-cycle control, while the 18x18 multipliers enable DSP operations up to 250 MHz. The device operates from a 1.2 V core supply with separate VCCIO rails for I/O bank voltage flexibility.
Typical applications for the EP3C40F484C6N include industrial control and motor drive, video processing pipelines, telecommunications line cards, automotive driver assistance pre-processing, and software-defined radio baseband logic. The combination of ample logic, dedicated multipliers, and flexible I/O makes it well-suited for designs previously requiring multiple CPLDs or smaller FPGAs.
When designing with this device, ensure proper decoupling with 0.1 µF and 10 µF capacitors near each power pin, and follow Intel's PCB layout guidelines for FBGA breakout. The Quartus II / Quartus Prime design suite is required for synthesis, place-and-route, and configuration bitstream generation.
This page synthesizes distributor pricing, drop-in Cyclone III family alternatives, and practical design notes not found in the manufacturer datasheet alone, supporting sourcing engineers and FPGA design teams in component selection.
Alternativas drop-in para EP3C40F484C6N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP3C40F484C6N (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Process Technology, Speed Grade, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP3C40F484C7N
✅ Drop-In✓ Em estoque
$264 / unidade
Ver ficha técnica →EP3C40F484C8N
✅ Drop-In✓ Em estoque
$21.4 / unidade
Ver ficha técnica →EP3C40F484I7N
✅ Drop-In✓ Em estoque
$118.5 / unidade
Ver ficha técnica →EP3C40F484C6
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP3C40F484C7
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP3C40F484I7
✅ Drop-In✓ Em estoque
$65 / unidade
Ver ficha técnica →EP3C40F484C6N Classificações máximas e características elétricas
| Family | Cyclone III |
| Logic Elements (LE) | 39,600 |
| Total Memory Bits | 1,161,216 bits |
| Embedded 18x18 Multipliers | 396 |
| User I/O Pins (max) | 331 |
| PLLs | 4 |
| Process Technology | 65 nm low-k dielectric |
| Core Voltage | 1.2 V |
| Encapsulamento | 484-FBGA (F484, 23x23 mm, 1.0 mm pitch) |
| Tipo de montagem | Surface Mount (BGA) |
| Speed Grade | C6 (commercial, -40C to +125C operating) |
| Temperatura de operação | -40C to +125C |
| Configuration Modes | JTAG, AS, AP, PS |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Status RoHS | Compliant (lead-free) |
Configuração de pinos do EP3C40F484C6N
| Pino A1 | I/O Bank 1 — User I/O - check pinout file for specific assignment per signal |
| Pino A2 | I/O — User I/O |
| Pino A3 | VCCIO1 — I/O bank 1 voltage supply |
| Pino A4 | I/O — User I/O |
| Pino A5 | GND — Ground |
| Pino A6 | I/O — User I/O |
| Pino A7 | VCCINT — Core voltage (1.2 V) |
| Pino A8 | I/O — User I/O |
| Pino A9 | GND — Ground |
| Pino A10 | I/O — User I/O |
| Pino A11 | VCCIO2 — I/O bank 2 voltage supply |
| Pino A12 | I/O — User I/O |
| Pino B1 | I/O — User I/O |
| Pino B2 | VCCIO1 — I/O bank 1 voltage supply |
| Pino B3 | GND — Ground |
| Pino B4 | I/O — User I/O |
| Pino B5 | I/O — User I/O |
| Pino B6 | VCCINT — Core voltage (1.2 V) |
| Pino B7 | I/O — User I/O |
| Pino B8 | GND — Ground |
| Pino B9 | I/O — User I/O |
| Pino B10 | VCCIO2 — I/O bank 2 voltage supply |
| Pino B11 | I/O — User I/O |
| Pino B12 | GND — Ground |
| Pino C1 | I/O — User I/O |
| Pino C2 | GND — Ground |
| Pino C3 | I/O — User I/O |
| Pino C4 | VCCIO3 — I/O bank 3 voltage supply |
| Pino C5 | I/O — User I/O |
| Pino C6 | GND — Ground |
| Pino C7 | I/O — User I/O |
| Pino C8 | VCCIO4 — I/O bank 4 voltage supply |
| Pino C9 | I/O — User I/O |
| Pino C10 | GND — Ground |
| Pino C11 | I/O — User I/O |
| Pino C12 | VCCIO2 — I/O bank 2 voltage supply |
| Pino D1 | VCCINT — Core voltage (1.2 V) |
| Pino D2 | I/O — User I/O |
| Pino D3 | VCCIO3 — I/O bank 3 voltage supply |
| Pino D4 | I/O — User I/O |
| Pino D5 | GND — Ground |
| Pino D6 | I/O — User I/O |
| Pino D7 | GND — Ground |
| Pino D8 | I/O — User I/O |
| Pino D9 | VCCIO4 — I/O bank 4 voltage supply |
| Pino D10 | I/O — User I/O |
| Pino D11 | VCCINT — Core voltage (1.2 V) |
| Pino D12 | I/O — User I/O |
Aplicações típicas
EP3C40F484C6N é adequado para 6 aplicaçãos: Industrial Motor Control, Video Processing and Display Controllers, Telecommunications Line Cards, Automotive Driver Assistance Pre-Processing, Software-Defined Radio Baseband, Medical Imaging Signal Conditioning.
Industrial Motor Control
The EP3C40F484C6N fits industrial motor control because its 396 embedded 18x18 multipliers and 4 PLLs deliver deterministic DSP throughput for field-oriented control (FOC) loops up to 200 kHz switching frequency. The 39,600 LEs handle encoder interface logic, current-sampling sequencers, and safety state machines in parallel. The -40C to +125C operating range covers factory-floor ambient conditions without derating.
Recomendado
Video Processing and Display Controllers
For video processing pipelines, the EP3C40F484C6N provides 1,161,216 embedded memory bits arranged in M9K blocks - sufficient for line buffers, color-space conversion FIFOs, and deinterlacing frame stores at 1080p60 resolution. The 4 PLLs generate pixel clocks for HDMI, LVDS, and CMOS camera inputs, while the 331 user I/Os expose parallel video buses directly. Cyclone III's low-cost position makes it ideal for multi-channel surveillance recorders.
Recomendado
Telecommunications Line Cards
In telecom line-card applications, the EP3C40F484C6N handles packet classification, TDM-to-Ethernet bridging, and timing-over-packet logic. Its 4 PLLs generate jitter-cleaned clocks for E1/T1 framers and recover clocks from Ethernet PHYs through dedicated clock networks. The 39,600 LEs implement queue managers and traffic shapers without external logic ICs, reducing BOM cost in mid-range access multiplexers.
Recomendado
Automotive Driver Assistance Pre-Processing
For ADAS sensor pre-processing, the EP3C40F484C6N executes radar FFT windows, lidar point-cloud filtering, and camera lane-detection kernels. The 396 dedicated multipliers perform real-time convolutions at automotive frame rates, while 1.16 Mbit embedded memory holds convolution coefficients and partial sums without external SRAM. Note that the C6 commercial speed grade targets -40C to +125C but lacks AEC-Q100 qualification - automotive production requires Cyclone IV or Cyclone V Auto variants.
Recomendado
Software-Defined Radio Baseband
In SDR baseband designs, the EP3C40F484C6N implements digital down-conversion, channelization filters, and modulation/demodulation chains. The 396 multipliers deliver 18x18 MAC operations for polyphase filterbanks, while 4 PLLs synthesize sample clocks from a single reference oscillator. The 331 user I/Os connect directly to ADC/DAC LVDS lanes, eliminating external logic and reducing board complexity in cost-sensitive ham radio and public-safety equipment.
Recomendado
Medical Imaging Signal Conditioning
In medical imaging front-ends (ultrasound beamformers, patient monitors), the EP3C40F484C6N's 1.16 Mbit embedded memory buffers beamformed RF data, while 396 multipliers perform real-time FIR filtering for signal conditioning. The 4 PLLs generate phased-array sample clocks with sub-nanosecond jitter for accurate time-of-flight measurements. Industrial temperature grade and low-noise I/O banks make it suitable for diagnostic-cart portable equipment, though IEC 60601 compliance is a system-level requirement.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP3C40F484C6N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP3C40F484C7N | EP3C40F484C8N | EP3C40F484I7N |
|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 484-FBGA (F484) | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 |
| Embedded Memory | 1,161,216 bits | 1,161,216 bits | 1,161,216 bits | 1,161,216 bits |
| Embedded Multipliers (18x18) | 396 | 396 | 396 | 396 |
| User I/O (max) | 331 | 331 | 331 | 331 |
| PLLs | 4 | 4 | 4 | 4 |
| Speed Grade | C6 (commercial) | C7 (faster) | C8 (fastest commercial) | I7 (industrial) |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +100C |
Principais diferenciais
- C6 speed grade provides balanced timing margin and price (vs EP3C40F484C7N)
- Extended +125C junction temperature operation (vs EP3C40F484I7N)
- Same Cyclone III family - guaranteed Quartus tool compatibility (vs EP4CE40F23C8N (Cyclone IV E))
Notas de projeto
The EP3C40F484C6N requires separate VCCINT (1.2 V core) and VCCIO (per-bank I/O voltage) rails. Per Intel's Cyclone III power design guidelines, place 0.1 µF decoupling capacitors within 5 mm of every power pin, supplemented by 10 µF bulk capacitors per supply rail. Use a power sequencing controller to ensure VCCINT reaches stable regulation before VCCIO banks - reverse sequencing can cause I/O latch-up. Typical quiescent current is 500 mA at 1.2 V with all logic active; add 30% margin for power supply sizing.
For the F484 FBGA package (23x23 mm, 1.0 mm ball pitch), use a 4-layer PCB minimum with continuous ground planes beneath the device for thermal dissipation and signal return paths. Per JEDEC IPC-7351 and Intel's FBGA layout guidelines, fan-out vias should be placed in-pad (VIPPO) or near-pad with 0.2 mm drill and 0.4 mm pad. Add thermal vias (0.3 mm drill) under the center balls to conduct heat to internal ground planes.
Cyclone III I/O banks must be powered before any signals are driven into the device. Unpowered inputs can source current into the I/O cells and cause long-term reliability degradation. Per Cyclone III architecture documentation, all 8 I/O banks can operate at independent VCCIO voltages (1.2 V to 3.3 V) but unused banks still require VCCIO supply. Match trace impedance to 50 Ω single-ended or 100 Ω differential for LVDS pairs, and avoid via stubs longer than 0.5 mm on high-speed signals.
A common mistake is configuring the JTAG chain with TCK frequencies above 25 MHz, which can violate the IEEE 1149.1 specification and cause configuration failures. Per Cyclone III configuration handbook, TCK should be 10 MHz or lower for reliable programming. Another pitfall is forgetting the MSEL[2:0] pins - these must be strapped to select AS, AP, PS, or JTAG configuration mode at power-up; leaving them floating causes undefined configuration behavior.
Informações de conformidade
RoHS compliant per DigiKey product page. Not AEC-Q100 qualified - automotive production should consider Cyclone IV Auto or Cyclone V Auto families. Halogen-free status not explicitly confirmed in available data.
