EP3C5U256I7N - Cyclone III FPGA 5K LE 256-UBGA | Intel
N.º de pieza: EP3C5U256I7N ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $42.44 | $42,44 |
| 10 | $38.95 | $389,50 |
| 100 | $33.8 | $3.380,00 |
| 500 | $28.5 | $14.250,00 |
| 1.000 | $24.1 | $24.100,00 |
EP3C5U256I7N Descripción general
A Cyclone III FPGA is a reprogrammable logic device that sits in the programmable logic hierarchy between a CPLD (typically <2K logic elements, non-volatile) and a high-end FPGA such as Stratix or Arria (hundreds of thousands of LE, transceivers, hardcore processors). Cyclone III targets cost- and power-sensitive applications such as industrial control, video bridging, and I/O expansion. Within the broader system hierarchy it is a programmable logic IC -> logic semiconductor -> integrated circuit, complementing microcontrollers and ASICs when parallel processing, custom I/O timing, or hardware acceleration is required.
Key features of the EP3C5U256I7N include 5,136 logic elements, 423,936 total RAM bits organized into M9K blocks, 182 user I/O pins across 8 I/O banks, 2 PLLs for clock management, 23 embedded 18x18 multipliers, and support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device integrates configuration memory (SRAM-based) and supports multiple configuration schemes including JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes.
The EP3C5U256I7N leverages a 65 nm SRAM-based architecture with on-chip voltage regulation and a static core power of approximately 50 mW at nominal conditions. Designers can use the Quartus II / Quartus Prime design suite (web edition or subscription) for synthesis, place-and-route, and timing closure. The 256-ball UFBGA package exposes 8 I/O banks with independent VCCIO rails, allowing mixed-voltage interfacing (1.2 V to 3.3 V) without external level shifters.
Typical applications include industrial motor control, video format conversion, protocol bridging (UART/SPI/I2C to Ethernet or USB), LED display controllers, machine vision pre-processing, and low-density ASIC prototyping. The 5K LE density comfortably fits soft-core processors such as Nios II/e or Nios II/f along with custom peripherals in a single device.
When designing with the EP3C5U256I7N, plan for at least four PCB layers with a continuous ground plane beneath the BGA, and provide 0.1 uF + 10 uF decoupling near every VCC/VCCIO pin pair. The configuration mode pins (MSEL) must be tied to the correct pattern for the selected programming mode (AS = 00, AP = 01, PS = 10, JTAG = 11 in many Cyclone III references). For long-term reliability, observe the maximum junction temperature of 100C for the industrial speed grade I7.
This page synthesizes real-time distributor pricing, same-package drop-in alternatives from the Cyclone III family, and practical design notes that go beyond the manufacturer handbook.
Alternativas directas para EP3C5U256I7N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP3C5U256I7N (mismo factor de forma y huella) — difiere en Process Technology, Package, Operating Temperature, Speed Grade, Logic Elements.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP3C5U256I7
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$23.65 / unidad
Ver hoja de datos →EP3C5U256C8N
✅ Sustitución directa✓ En stock
$19.85 / unidad
Ver hoja de datos →EP3C5U256C7N
✅ Sustitución directa✓ En stock
$17.85 / unidad
Ver hoja de datos →EP3C5U256C6N
✅ Sustitución directa✓ En stock
$25.4 / unidad
Ver hoja de datos →EP3C5U256A7N
✅ Sustitución directa✓ En stock
$16.2 / unidad
Ver hoja de datos →EP3C10U256C8N
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP3C25F256I7N
✅ Sustitución directa✓ En stock
$27.2 / unidad
Ver hoja de datos →EP3C5U256I7N Valores máximos y características eléctricas
| Family | Cyclone III |
| Logic Elements | 5,136 |
| Total RAM Bits | 423,936 |
| Maximum User I/O | 182 |
| Embedded 18x18 Multipliers | 23 |
| PLLs | 2 |
| Global Clock Networks | 10 |
| Core Voltage | 1.2 V |
| Process Technology | 65 nm low-k copper |
| Internal Operating Frequency | 437.5 MHz (max) |
| Encapsulado | 256-ball UFBGA (UBGA) |
| Temperatura de funcionamiento | -40C to +100C (industrial, speed grade I7) |
| I/O Banks | 8 |
| Configuration Modes | AS, AP, PS, JTAG |
| Tipo de montaje | Surface Mount (BGA) |
Guía de configuración de pines de EP3C5U256I7N 256-ball ufbga (ubga)
Configuración de pines para EP3C5U256I7N (encapsulado 256-ball ufbga (ubga)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP3C5U256I7N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP3C5U256I7N es adecuado para 6 aplicacións: Industrial Motor Control, Video Format Conversion and Bridging, Protocol Bridging (UART/SPI/I2C to Ethernet/USB), LED Display Controllers, ASIC Prototyping and Emulation, I/O Expansion and Custom Peripherals.
Industrial Motor Control
The EP3C5U256I7N fits industrial motor control because its 23 embedded 18x18 multipliers and 182 user I/O pins deliver enough DSP throughput for Field-Oriented Control (FOC) loops while leaving headroom for encoder feedback and gate-driver interfaces. With 5,136 logic elements and 423,936 bits of RAM, the device can implement a complete FOC algorithm, soft-core Nios II/e supervisory logic, and PWM generation in a single chip. The 256-ball UFBGA exposes 8 I/O banks, so designers can directly connect to 3.3 V Hall sensors and 5 V gate drivers without external level shifters.
Recomendado
Video Format Conversion and Bridging
The EP3C5U256I7N suits video format conversion because its 437.5 MHz internal frequency and 23 hardware multipliers handle DVI/HDMI timing conversion and color-space matrix math. The 256-ball UFBGA package exposes enough LVDS pairs to drive parallel RGB or LVDS display panels. Its 5K LE density fits a complete video pipeline (input capture, scaling, frame-rate conversion, output timing) for resolutions up to 1080p60. Designers commonly pair the FPGA with an external SDRAM for line buffering and a TMDS driver for HDMI output.
Recomendado
Protocol Bridging (UART/SPI/I2C to Ethernet/USB)
The EP3C5U256I7N is ideal for protocol bridging because its 182 user I/O pins accept many slow serial peripherals (UART, SPI, I2C, CAN) and its PLLs (2) generate the precise 50 MHz or 125 MHz clocks required by MII/RMII Ethernet MACs. A Nios II/f soft core running uCLinux or a hardware state machine can convert legacy industrial protocols to TCP/IP or USB. The 423,936 bits of RAM buffer packet data without external memory for many bridging scenarios.
Recomendado
LED Display Controllers
The EP3C5U256I7N drives LED display walls because its 23 multipliers and 437.5 MHz fabric handle gamma correction and brightness modulation across thousands of channels. The 256-ball UFBGA exposes enough LVDS pairs to send serialized pixel data to receiver cards over long cables. Designers can scale to multiple EP3C5 devices using the global clock networks (10) for synchronized refresh. The 5K LE density fits a complete controller plus HDMI input.
Recomendado
ASIC Prototyping and Emulation
The EP3C5U256I7N serves as an ASIC prototyping vehicle because its 65 nm process provides realistic timing characteristics for sub-100 MHz ASIC designs. Designers can map up to 5,136 logic elements of synthesizable ASIC RTL into the FPGA and validate firmware before tape-out. The 256-ball UFBGA exposes 182 I/O for ASIC pin-out emulation, and the Quartus Prime software offers SignalTap logic analyzer integration. For larger ASICs, multiple EP3C5 boards can be daisy-chained via LVDS.
Recomendado
I/O Expansion and Custom Peripherals
The EP3C5U256I7N is widely used as an I/O expander for single-board computers, microcontrollers, and SoCs that lack sufficient GPIO, PWM channels, or special-purpose interfaces. The 8 I/O banks accept mixed voltages from 1.2 V to 3.3 V, letting a single FPGA interface a 1.8 V SoC and 3.3 V sensors directly. A SPI or parallel bus from the host CPU configures the FPGA at boot via slave SelectMAP or PS mode. The 5K LE capacity easily implements dozens of PWM generators, quadrature counters, or stepper-motor sequencers.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP3C5U256I7N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP3C5U256I7 | EP3C5U256C8N | EP3C5U256C7N | EP3C5U256C6N | EP3C5U256A7N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-ball UFBGA | 256-ball UFBGA (same) | 256-ball UFBGA (same) | 256-ball UFBGA (same) | 256-ball UFBGA (same) | 256-ball UFBGA (same) |
| Logic Elements | 5,136 | 5,136 | 5,136 | 5,136 | 5,136 | 5,136 |
| Total RAM Bits | 423,936 | 423,936 | 423,936 | 423,936 | 423,936 | 423,936 |
| Maximum User I/O | 182 | 182 | 182 | 182 | 182 | 182 |
| Embedded 18x18 Multipliers | 23 | 23 | 23 | 23 | 23 | 23 |
| Speed Grade | I7 (industrial) | I7 (industrial) | C8 (commercial, slower) | C7 (commercial) | C6 (commercial, slowest) | A7 (automotive) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +125C (automotive) |
Diferenciadores clave
- Industrial temperature grade (-40C to +100C) at the I7 speed grade (frente a EP3C5U256C8N)
- Highest speed grade in the EP3C5 family (I7) (frente a EP3C5U256C6N)
- Smallest die in the Cyclone III family with 182 user I/O - extreme I/O density per logic element (frente a EP3C10U256C8N)
Notas de diseño
The 256-ball UFBGA has a 1.0 mm ball pitch and requires a 4-layer PCB minimum with a continuous ground plane directly beneath the BGA. Use 0.1 uF + 10 uF decoupling pairs near every VCC and VCCIO ball, and route all configuration and JTAG signals with 50 ohm controlled impedance. Via-in-pad is recommended for inner balls to escape the BGA; otherwise use dog-bone fan-out with 0.2 mm via holes.
Cyclone III is a low-power family: estimated static core power is ~50 mW at nominal 1.2 V, and dynamic power scales with toggle rate and clock frequency. At 437.5 MHz with 50% toggle rate, estimated total power stays below 1 W - no heatsink is required. However, in enclosed industrial cabinets at 70C ambient, provide at least 1 oz copper pour on both outer layers and 5-10 thermal vias to the inner ground plane.
The MSEL[2..0] pins must be tied to the correct pattern for the chosen configuration mode (AS x1 = 000, AP x8 = 010, PS x1 = 100, JTAG-only = 110 in many Cyclone III references). If MSEL is left floating or incorrectly tied, the device will fail to configure. Always connect nCONFIG to VCC via a 10 kohm pull-up, and add a JTAG chain header for in-system programming. Do not forget the EPCS configuration flash when using AS mode; the FPGA expects a specific bitstream header.
Información de cumplimiento
RoHS and REACH compliance confirmed in the Cyclone III Device Handbook. AEC-Q100 is not applicable because the EP3C5U256I7N (I7 grade) targets industrial not automotive; for AEC-Q100 applications choose the A7 speed grade variant EP3C5U256A7N.
