EP3C80F484I7 - Cyclone III FPGA, 81K LE, 484-FBGA | Intel
N.º de pieza: EP3C80F484I7 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $165.15 | $165,15 |
| 10 | $148.2 | $1.482,00 |
| 100 | $132.45 | $13.245,00 |
| 500 | $118.75 | $59.375,00 |
| 1.000 | $105.3 | $105.300,00 |
EP3C80F484I7 Descripción general
An FPGA (Field-Programmable Gate Array) is a semiconductor device built from a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit alongside ASICs in the digital IC hierarchy: PLD -> FPGA -> CPLD (simpler) and FPGA -> SoC FPGA (more complex). Unlike fixed-function ASICs, FPGAs can be reconfigured in the field to implement arbitrary digital logic, making them ideal for prototyping, low-volume production, and designs requiring late-stage hardware changes.
The Cyclone III family delivers up to 200K logic elements, up to 8 Mbits of RAM, and integrated multipliers, while consuming a fraction of the power of previous-generation FPGAs. The EP3C80F484I7 specifically offers 5,079 LABs, 244 M9K memory blocks, four PLLs, and supports external memory interfaces including DDR, DDR2, and QDRII SRAM. Its 484-ball FBGA package with 1.0 mm ball pitch simplifies PCB layout and supports standard reflow processes.
This part is well suited for applications such as industrial motor control, video processing pipelines, software-defined radio (SDR) baseband, automotive infotainment pre-development, and high-volume consumer electronics. The Cyclone III architecture supports the Nios II soft-core processor, enabling complete microcontroller/SoC functionality within a single FPGA. Designers benefit from the Quartus II design software with extensive IP libraries.
When designing with this device, pay close attention to power sequencing - the 1.2 V core, 2.5 V analog, and I/O voltages must ramp in a defined order to prevent latch-up. The device supports hot-socketing and has dedicated JTAG pins for boundary-scan testing. For high-speed memory interfaces, use the dedicated DQS pins and follow Intel's pinout guidelines to achieve the rated 472 MHz performance.
Alternativas directas para EP3C80F484I7 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP3C80F484I7 (mismo factor de forma y huella) — difiere en Package, Process Technology, Operating Temperature, Speed Grade, RoHS Status.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP3C80F484C8N
✅ Sustitución directa✓ En stock
$208.75 / unidad
Ver hoja de datos →EP3C80F484C8
✅ Sustitución directa✓ En stock
$182.76 / unidad
Ver hoja de datos →EP3C80F484C7N
✅ Sustitución directa✓ En stock
$306.54 / unidad
Ver hoja de datos →EP3C80F484C7
✅ Sustitución directa✓ En stock
$215 / unidad
Ver hoja de datos →EP3C120F484I7
✅ Sustitución directa✓ En stock
$595.8 / unidad
Ver hoja de datos →EP3C120F484I7N
✅ Sustitución directa✓ En stock
$84.7 / unidad
Ver hoja de datos →EP3C55F484I7
✅ Sustitución directa✓ En stock
$175.54 / unidad
Ver hoja de datos →EP3C55F484I7N
✅ Sustitución directa✓ En stock
$205.4 / unidad
Ver hoja de datos →EP3C80F484I7 Valores máximos y características eléctricas
| Series | Cyclone III |
| Device Type | FPGA |
| Logic Elements | 81,264 |
| Logic Array Blocks (LABs) | 5,079 |
| Total RAM Bits | 2,810,880 |
| M9K Memory Blocks | 244 |
| Embedded Multipliers (18x18) | 305 |
| Phase-Locked Loops (PLLs) | 4 |
| User I/Os | 295 |
| Encapsulado | 484-FBGA (FineLine BGA), 23x23 mm, 1.0 mm pitch |
| Core Voltage | 1.2 V |
| Process Technology | 65 nm low-power CMOS |
| Internal Operating Frequency | Up to 472 MHz |
| Temperatura de funcionamiento | -40C to +100C (Industrial grade, "I7" suffix) |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
| Tipo de montaje | Surface Mount (BGA) |
| Nivel MSL | 3 (per JEDEC J-STD-020) |
Guía de configuración de pines de EP3C80F484I7 484-fbga (fineline bga), 23x23 mm, 1.0 mm pitch
Configuración de pines para EP3C80F484I7 (encapsulado 484-fbga (fineline bga), 23x23 mm, 1.0 mm pitch). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP3C80F484I7.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP3C80F484I7 es adecuado para 6 aplicacións: Industrial Motor Control, Video Processing Pipelines, Software-Defined Radio (SDR) Baseband, Automotive Infotainment Pre-Development, Nios II Soft-Core Processor Systems, High-Volume Consumer Electronics.
Industrial Motor Control
The EP3C80F484I7's 305 18x18 embedded multipliers and 295 user I/Os make it ideal for multi-axis industrial motor control. Its 472 MHz internal frequency supports field-oriented control (FOC) loops at 20-50 kHz PWM switching frequencies with multiple axes processed in parallel. The 244 M9K memory blocks store position feedback lookups and PID controller state, while four PLLs generate precise PWM-aligned clocks for space-vector modulation. Industrial temperature grading (-40C to +100C) ensures reliable operation near motor drives with elevated ambient temperatures.
Recomendado
Video Processing Pipelines
The EP3C80F484I7 delivers sufficient DSP resources for HD video processing pipelines including scaling, deinterlacing, and color space conversion. Its 305 dedicated 18x18 multipliers handle real-time FIR filters and DCT/IDCT transforms, while 2.8 Mbits of embedded RAM buffer video line storage. The 295 I/Os support parallel RGB/YCbCr interfaces alongside HDMI, DisplayPort, or BT.656 connections. Quartus II Video IP cores accelerate development of common functions like alpha blending and gamma correction.
Recomendado
Software-Defined Radio (SDR) Baseband
The EP3C80F484I7 supports SDR baseband processing for narrowband and wideband receivers. Its parallel multiplier architecture handles FFT, channelization, and demodulation algorithms in real-time. With 472 MHz operation, the FPGA can process baseband bandwidths up to 100 MHz depending on modulation scheme. Embedded RAM serves as FFT window storage, and the industrial temperature rating enables outdoor SDR equipment. Designers can pair this FPGA with RF front-end chips from Analog Devices for complete SDR solutions.
Recomendado
Automotive Infotainment Pre-Development
The EP3C80F484I7 enables pre-production validation of automotive infotainment designs before ASIC tape-out. Engineers prototype head-unit, instrument cluster, and rear-seat entertainment logic in this FPGA, validating algorithms, interfaces (CAN, LIN, MOST, Ethernet AVB), and HMIs. The 295 I/Os accommodate multiple display outputs, touch controllers, and audio CODECs. While the I7 industrial grade is not AEC-Q100 qualified, it suffices for bench development before migrating to qualified Cyclone III variants or HardCopy ASICs.
Recomendado
Nios II Soft-Core Processor Systems
The EP3C80F484I7 supports multiple Nios II/f soft-core processors running in parallel, enabling complete SoC functionality in a single chip. The 81K logic elements host two to four Nios II cores plus custom peripherals and accelerators. With 295 I/Os, designers integrate Ethernet, USB, SPI, I2C, UART, and GPIO interfaces without external bridge chips. The four PLLs generate the precise clocks required for memory interfaces (DDR, DDR2) and external peripherals, making this part a versatile embedded platform.
Recomendado
High-Volume Consumer Electronics
The EP3C80F484I7 suits high-volume consumer products such as digital signage controllers, LED video walls, printers, and home appliances with custom logic requirements. The 65 nm low-power process minimizes static and dynamic power, critical for energy-conscious consumer designs. The 484-FBGA package supports automated assembly at high volumes, and the Cyclone III family's long-term availability (10+ year product lifecycle) ensures design stability. Designers leverage Quartus II's IP catalog for rapid development of consumer interfaces.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP3C80F484I7 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP3C80F484C8N | EP3C120F484I7 | EP3C55F484I7 |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (23x23 mm) | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 81,264 | 81,264 (same die) | 119,088 (+48%) | 55,856 (-31%) |
| Total RAM Bits | 2,810,880 | 2,810,880 (same die) | 3,981,312 (+42%) | 2,396,160 (-15%) |
| Embedded Multipliers (18x18) | 305 | 305 (same die) | 576 (+89%) | 156 (-49%) |
| User I/Os | 295 | 295 (same die) | 295 (same) | 296 (same) |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
Diferenciadores clave
- Highest logic density in 484-FBGA Cyclone III family (frente a EP3C55F484I7)
- Industrial temperature grade (frente a EP3C80F484C8N)
- More embedded memory than mid-range Cyclone III (frente a EP3C40F484I7)
Notas de diseño
The EP3C80F484I7 requires multiple power rails: 1.2 V VCCINT (core), 2.5 V VCCA (analog/PLL), and VCCIO for I/O banks (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, or 3.3 V depending on interface). Power sequencing is critical - VCCINT must ramp before or simultaneously with VCCIO to prevent latch-up. Use a dedicated power supervisor or follow the Cyclone III Handbook sequencing guidelines. Decoupling: place 0.1 uF and 0.01 uF ceramic capacitors as close as possible to every power pin, plus bulk capacitors on each supply rail.
The 484-FBGA package has 1.0 mm ball pitch and 23x23 mm body size. Recommended PCB stack-up: 8-12 layers with continuous ground planes beneath the device for thermal dissipation and signal reference. Use microvia-in-pad technology for breakout; standard 0.4 mm diameter vias may be used on outer rows. Place thermal vias in a grid pattern under the package center (8-16 vias minimum) to conduct heat to internal ground planes. Maintain at least 4-6 layer PCB stack-up with controlled impedance for DDR2 traces (50 ohm single-ended, 100 ohm differential).
Common design pitfalls: (1) Failing to assign all configuration pins (MSEL, nCE, nCONFIG, CONF_DONE, nSTATUS) to valid logic levels - leaving them floating prevents configuration. (2) Not connecting the JTAG TCK pin to ground through a 1-10 kOhm pull-down if JTAG is unused. (3) Using shared I/O pins for critical timing signals without consulting the pinout guidelines - some pins have higher skew or reduced performance. (4) Overclocking beyond 472 MHz without verifying the timing closure in TimeQuest - operating margins shrink at extreme conditions. Always validate the design with Quartus II's full compilation before committing to PCB layout.
Información de cumplimiento
RoHS and lead-free compliant per Altera/Intel product page. Industrial temperature grade ('I7' suffix) supports -40C to +100C ambient. Not AEC-Q100 qualified; the commercial-grade variants (C8N, C7N) are not suitable for production automotive use without qualification.
