EP3C80F484I7 - Cyclone III FPGA, 81K LE, 484-FBGA | Intel
MPN： EP3C80F484I7 ✓ 啟用中EP3C80F484I7 概覽
An FPGA (Field-Programmable Gate Array) is a semiconductor device built from a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit alongside ASICs in the digital IC hierarchy: PLD -> FPGA -> CPLD (simpler) and FPGA -> SoC FPGA (more complex). Unlike fixed-function ASICs, FPGAs can be reconfigured in the field to implement arbitrary digital logic, making them ideal for prototyping, low-volume production, and designs requiring late-stage hardware changes.
The Cyclone III family delivers up to 200K logic elements, up to 8 Mbits of RAM, and integrated multipliers, while consuming a fraction of the power of previous-generation FPGAs. The EP3C80F484I7 specifically offers 5,079 LABs, 244 M9K memory blocks, four PLLs, and supports external memory interfaces including DDR, DDR2, and QDRII SRAM. Its 484-ball FBGA package with 1.0 mm ball pitch simplifies PCB layout and supports standard reflow processes.
This part is well suited for applications such as industrial motor control, video processing pipelines, software-defined radio (SDR) baseband, automotive infotainment pre-development, and high-volume consumer electronics. The Cyclone III architecture supports the Nios II soft-core processor, enabling complete microcontroller/SoC functionality within a single FPGA. Designers benefit from the Quartus II design software with extensive IP libraries.
When designing with this device, pay close attention to power sequencing - the 1.2 V core, 2.5 V analog, and I/O voltages must ramp in a defined order to prevent latch-up. The device supports hot-socketing and has dedicated JTAG pins for boundary-scan testing. For high-speed memory interfaces, use the dedicated DQS pins and follow Intel's pinout guidelines to achieve the rated 472 MHz performance.
直接替換替代品，適用於 EP3C80F484I7 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3C80F484I7 （相同外形與佔位） — 差異在於 Package, Process Technology, Operating Temperature, Speed Grade, RoHS Status.
EP3C80F484C8N
✅ 直接替換聯絡詢價
查看資料表 →EP3C80F484C8
✅ 直接替換聯絡詢價
查看資料表 →EP3C80F484C7N
✅ 直接替換聯絡詢價
查看資料表 →EP3C80F484C7
✅ 直接替換聯絡詢價
查看資料表 →EP3C120F484I7
✅ 直接替換聯絡詢價
查看資料表 →EP3C120F484I7N
✅ 直接替換聯絡詢價
查看資料表 →EP3C55F484I7
✅ 直接替換聯絡詢價
查看資料表 →EP3C55F484I7N
✅ 直接替換聯絡詢價
查看資料表 →EP3C80F484I7 最大額定值與電氣特性
| Series | Cyclone III |
| Device Type | FPGA |
| Logic Elements | 81,264 |
| Logic Array Blocks (LABs) | 5,079 |
| Total RAM Bits | 2,810,880 |
| M9K Memory Blocks | 244 |
| Embedded Multipliers (18x18) | 305 |
| Phase-Locked Loops (PLLs) | 4 |
| User I/Os | 295 |
| 封裝 | 484-FBGA (FineLine BGA), 23x23 mm, 1.0 mm pitch |
| Core Voltage | 1.2 V |
| Process Technology | 65 nm low-power CMOS |
| Internal Operating Frequency | Up to 472 MHz |
| 工作溫度 | -40C to +100C (Industrial grade, "I7" suffix) |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
| 安裝類型 | Surface Mount (BGA) |
| MSL 等級 | 3 (per JEDEC J-STD-020) |
EP3C80F484I7 484-fbga (fineline bga), 23x23 mm, 1.0 mm pitch 腳位配置指南
EP3C80F484I7（484-fbga (fineline bga), 23x23 mm, 1.0 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3C80F484I7.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3C80F484I7 適用於 6 應用s: Industrial Motor Control, Video Processing Pipelines, Software-Defined Radio (SDR) Baseband, Automotive Infotainment Pre-Development, Nios II Soft-Core Processor Systems, High-Volume Consumer Electronics.
Industrial Motor Control
The EP3C80F484I7's 305 18x18 embedded multipliers and 295 user I/Os make it ideal for multi-axis industrial motor control. Its 472 MHz internal frequency supports field-oriented control (FOC) loops at 20-50 kHz PWM switching frequencies with multiple axes processed in parallel. The 244 M9K memory blocks store position feedback lookups and PID controller state, while four PLLs generate precise PWM-aligned clocks for space-vector modulation. Industrial temperature grading (-40C to +100C) ensures reliable operation near motor drives with elevated ambient temperatures.
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Video Processing Pipelines
The EP3C80F484I7 delivers sufficient DSP resources for HD video processing pipelines including scaling, deinterlacing, and color space conversion. Its 305 dedicated 18x18 multipliers handle real-time FIR filters and DCT/IDCT transforms, while 2.8 Mbits of embedded RAM buffer video line storage. The 295 I/Os support parallel RGB/YCbCr interfaces alongside HDMI, DisplayPort, or BT.656 connections. Quartus II Video IP cores accelerate development of common functions like alpha blending and gamma correction.
推薦
Software-Defined Radio (SDR) Baseband
The EP3C80F484I7 supports SDR baseband processing for narrowband and wideband receivers. Its parallel multiplier architecture handles FFT, channelization, and demodulation algorithms in real-time. With 472 MHz operation, the FPGA can process baseband bandwidths up to 100 MHz depending on modulation scheme. Embedded RAM serves as FFT window storage, and the industrial temperature rating enables outdoor SDR equipment. Designers can pair this FPGA with RF front-end chips from Analog Devices for complete SDR solutions.
推薦
Automotive Infotainment Pre-Development
The EP3C80F484I7 enables pre-production validation of automotive infotainment designs before ASIC tape-out. Engineers prototype head-unit, instrument cluster, and rear-seat entertainment logic in this FPGA, validating algorithms, interfaces (CAN, LIN, MOST, Ethernet AVB), and HMIs. The 295 I/Os accommodate multiple display outputs, touch controllers, and audio CODECs. While the I7 industrial grade is not AEC-Q100 qualified, it suffices for bench development before migrating to qualified Cyclone III variants or HardCopy ASICs.
推薦
Nios II Soft-Core Processor Systems
The EP3C80F484I7 supports multiple Nios II/f soft-core processors running in parallel, enabling complete SoC functionality in a single chip. The 81K logic elements host two to four Nios II cores plus custom peripherals and accelerators. With 295 I/Os, designers integrate Ethernet, USB, SPI, I2C, UART, and GPIO interfaces without external bridge chips. The four PLLs generate the precise clocks required for memory interfaces (DDR, DDR2) and external peripherals, making this part a versatile embedded platform.
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High-Volume Consumer Electronics
The EP3C80F484I7 suits high-volume consumer products such as digital signage controllers, LED video walls, printers, and home appliances with custom logic requirements. The 65 nm low-power process minimizes static and dynamic power, critical for energy-conscious consumer designs. The 484-FBGA package supports automated assembly at high volumes, and the Cyclone III family's long-term availability (10+ year product lifecycle) ensures design stability. Designers leverage Quartus II's IP catalog for rapid development of consumer interfaces.
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推薦產品摘要
工程參考資料，適用於 EP3C80F484I7 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3C80F484C8N | EP3C120F484I7 | EP3C55F484I7 |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (23x23 mm) | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 81,264 | 81,264 (same die) | 119,088 (+48%) | 55,856 (-31%) |
| Total RAM Bits | 2,810,880 | 2,810,880 (same die) | 3,981,312 (+42%) | 2,396,160 (-15%) |
| Embedded Multipliers (18x18) | 305 | 305 (same die) | 576 (+89%) | 156 (-49%) |
| User I/Os | 295 | 295 (same die) | 295 (same) | 296 (same) |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
主要差異化特點
- Highest logic density in 484-FBGA Cyclone III family (對比EP3C55F484I7)
- Industrial temperature grade (對比EP3C80F484C8N)
- More embedded memory than mid-range Cyclone III (對比EP3C40F484I7)
設計說明
The EP3C80F484I7 requires multiple power rails: 1.2 V VCCINT (core), 2.5 V VCCA (analog/PLL), and VCCIO for I/O banks (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, or 3.3 V depending on interface). Power sequencing is critical - VCCINT must ramp before or simultaneously with VCCIO to prevent latch-up. Use a dedicated power supervisor or follow the Cyclone III Handbook sequencing guidelines. Decoupling: place 0.1 uF and 0.01 uF ceramic capacitors as close as possible to every power pin, plus bulk capacitors on each supply rail.
The 484-FBGA package has 1.0 mm ball pitch and 23x23 mm body size. Recommended PCB stack-up: 8-12 layers with continuous ground planes beneath the device for thermal dissipation and signal reference. Use microvia-in-pad technology for breakout; standard 0.4 mm diameter vias may be used on outer rows. Place thermal vias in a grid pattern under the package center (8-16 vias minimum) to conduct heat to internal ground planes. Maintain at least 4-6 layer PCB stack-up with controlled impedance for DDR2 traces (50 ohm single-ended, 100 ohm differential).
Common design pitfalls: (1) Failing to assign all configuration pins (MSEL, nCE, nCONFIG, CONF_DONE, nSTATUS) to valid logic levels - leaving them floating prevents configuration. (2) Not connecting the JTAG TCK pin to ground through a 1-10 kOhm pull-down if JTAG is unused. (3) Using shared I/O pins for critical timing signals without consulting the pinout guidelines - some pins have higher skew or reduced performance. (4) Overclocking beyond 472 MHz without verifying the timing closure in TimeQuest - operating margins shrink at extreme conditions. Always validate the design with Quartus II's full compilation before committing to PCB layout.
合規資訊
RoHS and lead-free compliant per Altera/Intel product page. Industrial temperature grade ('I7' suffix) supports -40C to +100C ambient. Not AEC-Q100 qualified; the commercial-grade variants (C8N, C7N) are not suitable for production automotive use without qualification.
