EP3SE50F780C4L - Stratix III E FPGA 47.5K LE | Intel | 780-FCBGA
N.º de pieza: EP3SE50F780C4L ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1720 | $17.200,00 |
| 100 | $1580 | $158.000,00 |
| 500 | $1450 | $725.000,00 |
| 1.000 | $1320 | $1.320.000,00 |
EP3SE50F780C4L Descripción general
An FPGA is a reprogrammable digital logic device built from a matrix of configurable logic blocks (CLBs), dedicated DSP blocks, embedded RAM (BRAM/M9K/M144K), high-speed transceivers, and programmable I/O cells connected by a routing fabric. Stratix III E parts are positioned as mid-density, transceiver-equipped FPGAs in the Intel FPGA portfolio, sitting between low-cost Cyclone families and high-end Stratix V/Arria families, used when applications require a balance of logic density, memory bandwidth, DSP throughput, and I/O count.
Key features include 6 input/output banks supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), dedicated DSP blocks for high-performance fixed- and floating-point arithmetic, on-chip PLLs for clock generation and conditioning, hard PCI Express and external memory interface controllers, configuration via passive serial, fast passive parallel, JTAG, or Altera-enhanced configuration devices, and a wide industrial operating temperature range depending on the speed-grade suffix.
Stratix III E FPGAs use a programmable power technology that intelligently manages static and dynamic power across logic, memory, and routing resources, reducing total power consumption by up to 50% versus prior generations. The 40 nm process combined with a 1.1 V core voltage (Stratix III core voltage plane) allows dense designs to operate within typical board power budgets. The high transceiver count and DSP density make the device suitable for DSP-intensive signal processing pipelines.
Typical applications include high-speed wireline telecom line cards, military and aerospace signal processing, ASIC prototyping, broadcast video processing, test and measurement instrumentation, and high-performance computing accelerators. The 780-ball FCBGA package supports dense board layouts with controlled-impedance signal routing for multi-gigabit interfaces.
When designing with this device, ensure the FPGA configuration scheme is selected and a proper JTAG chain is laid out. The Quartus II design software is the primary development environment; verify timing closure using TimeQuest with the 'C4' speed-grade timing models. Thermal dissipation grows with utilization - use thermal vias and a sufficient copper pour under the FCBGA for high-utilization designs.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para EP3SE50F780C4L — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP3SE50F780C4L (mismo factor de forma y huella) — difiere en Package, Speed Grade, Family, Mounting Type, RoHS Status.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP3SE50F780C4
✅ Sustitución directa✓ En stock
$726.28 / unidad
Ver hoja de datos →EP3SE50F780C4G
✅ Sustitución directa✓ En stock
$593 / unidad
Ver hoja de datos →EP3SE50F780C3N
✅ Sustitución directa✓ En stock
$717.12 / unidad
Ver hoja de datos →EP3SE50F780C3G
✅ Sustitución directa✓ En stock
$1030 / unidad
Ver hoja de datos →EP3SE50F780C3
✅ Sustitución directa✓ En stock
$890 / unidad
Ver hoja de datos →EP3SE110F780C4L
✅ Sustitución directa✓ En stock
$1550 / unidad
Ver hoja de datos →EP3SE260H780C4L
✅ Sustitución directa✓ En stock
$1190 / unidad
Ver hoja de datos →EP3SE50F780C4L Valores máximos y características eléctricas
| Series | Stratix III E |
| Family | Stratix III |
| Logic Elements (LE) | 47,500 |
| Embedded Memory | 5,760,000 bits |
| User I/Os | 488 |
| DSP Blocks (18x18 multipliers) | 304 (19x16) |
| Encapsulado | 780-ball FCBGA (Flip-Chip BGA) |
| Process Node | 40 nm |
| Core Voltage | 1.1 V |
| Speed Grade | C4 (commercial, speed 4) |
| Lead-Free (L suffix) | Yes |
| Configuration Method | Passive Serial / Fast Passive Parallel / JTAG / Enhanced |
| Estado RoHS | Compliant (lead-free) |
Guía de configuración de pines de EP3SE50F780C4L 780-ball fcbga (flip-chip bga)
Configuración de pines para EP3SE50F780C4L (encapsulado 780-ball fcbga (flip-chip bga)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP3SE50F780C4L.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP3SE50F780C4L es adecuado para 6 aplicacións: High-Speed Telecom Line Cards, ASIC Prototyping, Military and Aerospace Signal Processing, Broadcast Video Processing, Test and Measurement Instrumentation, High-Performance Computing Accelerators.
High-Speed Telecom Line Cards
The EP3SE50F780C4L's 47,500 logic elements, 304 18x18 multipliers, and 5.76 Mbits of embedded memory make it well suited for high-speed telecom line-card signal processing. Its 488 user I/Os support multi-channel SERDES, SFI/SPI interfaces, and backplane connectivity at multi-gigabit rates. The 780-FCBGA package provides controlled-impedance routing for SFP+/XFP cages and PCIe interfaces. For designers migrating from legacy Stratix II FPGAs, the EP3SE50F780C4L offers roughly 2x the DSP throughput at lower total power per MHz. Pair the FPGA with an Intel/Altera soft-core Nios II processor for control-plane tasks and external DDR2/DDR3 memory controllers for high-bandwidth packet buffers.
Recomendado
ASIC Prototyping
The EP3SE50F780C4L is widely used as an ASIC prototyping platform because 47,500 LEs plus 304 DSP blocks approximate mid-complexity ASIC gate counts. Quartus II design software supports rapid synthesis and incremental compile flows, while the F780 package exposes sufficient I/O for multi-FPGA partitioning boards. ASIC prototypes typically use multiple Stratix III E parts in tandem, with the EP3SE50F780C4L providing the central glue-logic and memory controller while dedicated I/O FPGAs handle board-level clock and reset distribution. The C4 speed grade supports aggressive timing closure for ASIC emulation of sub-200 MHz designs.
Recomendado
Military and Aerospace Signal Processing
The EP3SE50F780C4L suits military and aerospace signal processing because the Stratix III E family offers industrial temperature grades and high DSP density for radar, electronic warfare, and SDR baseband designs. The 304 18x18 multipliers support FFT, FIR, and matrix-math pipelines at high sample rates. With 5.76 Mbits of embedded memory, the device can buffer multiple radar PRI bursts without external SRAM. The 780-FCBGA package withstands shock and vibration typical of avionics environments when properly socketed or soldered with underfill. Designers should review the radiation-hardness flow if targeting space applications; the EP3SE50F780I4N industrial variant is often preferred for aerospace programs requiring full -40°C to +100°C operation.
Recomendado
Broadcast Video Processing
The EP3SE50F780C4L supports broadcast video processing applications including SD/HD/3G-SDI routing, video format conversion, and overlay composition. The 488 I/Os handle multiple SDI streams plus HDMI/DVI interfaces, while the 304 DSP blocks accelerate video scaling, color space conversion, and deinterlacing in real time. The 5.76 Mbits of embedded memory is sufficient to buffer several video lines for temporal filtering, and the on-chip PLLs generate precise pixel clocks for broadcast timing. Pair the device with external DDR2/DDR3 memory for frame-buffer storage and HDMI transmitters for output. The F780 FCBGA package enables compact, single-board broadcast routers and switchers.
Recomendado
Test and Measurement Instrumentation
The EP3SE50F780C4L fits test and measurement instrumentation because 304 18x18 multipliers and 5.76 Mbits of embedded memory enable real-time DSP for arbitrary waveform generators, spectrum analyzers, and protocol analyzers. The 488 user I/Os provide enough bandwidth for high-speed ADC/DAC interfaces like LVDS, JESD204B, and parallel CMOS at hundreds of MSPS. The F780 FCBGA package exposes sufficient I/O for multi-channel acquisition cards. The on-chip PLLs synchronize ADC sampling clocks, and Quartus II's DSP Builder toolchain accelerates model-based design. The C4 speed grade supports timing closure for high-sample-rate designs where every DSP pipeline stage matters.
Recomendado
High-Performance Computing Accelerators
The EP3SE50F780C4L serves as a high-performance computing (HPC) coprocessor for FPGA-accelerated workloads such as financial Monte Carlo simulation, genomics alignment, machine-learning inference, and scientific computing. The 304 DSP blocks deliver tens of GMACs of fixed-point throughput, and the 5.76 Mbits of embedded memory supports cache-line-sized data structures. The 780-FCBGA package enables dense accelerator boards where the FPGA is paired with HBM or DDR4 memory and a host-side PCIe link. Quartus II's OpenCL SDK and HLS toolchain support C/C++/OpenCL kernel compilation for HPC users unfamiliar with HDL design. Choose EP3SE110F780C4L or EP3SE260H780C4L when density or memory bandwidth requirements exceed the EP3SE50F780C4L's capacity.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP3SE50F780C4L — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP3SE50F780C4 | EP3SE50F780C4G | EP3SE50F780C3 | EP3SE110F780C4L | EP3SE260H780C4L |
|---|---|---|---|---|---|---|
| Package | 780-FCBGA | 780-FCBGA | 780-FCBGA | 780-FCBGA | 780-FCBGA | 780-FCBGA |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 107,500 | ~254,000 |
| Embedded Memory | 5.76 Mbits | 5.76 Mbits | 5.76 Mbits | 5.76 Mbits | ~8.5 Mbits | ~15.6 Mbits |
| DSP Blocks (18x18) | 304 | 304 | 304 | 304 | 448 | 768 |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | C4 | C4 | C4 | C3 (slower) | C4 | C4 |
| Lead-Free | Yes (L) | No (SnPb) | Yes | No | Yes | Yes |
| Lifecycle | NMDNR | NMDNR | NMDNR | NMDNR | NMDNR | NMDNR |
Diferenciadores clave
- Mid-density Stratix III E with 488 user I/Os (frente a EP3SE50F484I4N)
- C4 speed grade for tighter timing margins (frente a EP3SE50F780C3)
- Lead-free terminal finish compliant with RoHS (frente a EP3SE50F780C4)
Notas de diseño
The EP3SE50F780C4L in the 780-FCBGA package dissipates significant power at high utilization. Estimated: at 50% utilization, 300 MHz, and a typical toggle rate, total power is approximately 5-8 W; at 80% utilization with high toggle rates, power may exceed 12 W. Apply a thermal via array (0.3 mm pitch, 9+ vias per cm²) directly under the FCBGA die, plus a top-side copper spreader and adequate airflow. Always validate with junction temperature measurement using the on-die temperature-sensing diode (Tsd) in Quartus II.
FCBGA packages require controlled-impedance routing for high-speed signals: 50 ohm single-ended for CMOS, 100 ohm differential for LVDS pairs, and 85 ohm differential for the dedicated SERDES channels. Use 1-2-3 or 1-2-3-4 stack-up with thin dielectrics (3-5 mil) for tight impedance control. Length-match all DDR2/DDR3 byte lanes within +/-25 mils and route address/command signals with proper fly-by termination. Refer to the Stratix III device handbook pin connection guidelines for unused-pin behavior.
Place decoupling capacitors as close as possible to every power pin: 0.1 µF X7R for high-frequency noise, 10 µF X5R for bulk, and 220 µF aluminum-polymer for board-level bulk. Use a star-ground topology with separate analog and digital ground planes joined under the FPGA. Route all configuration signals (nCONFIG, nSTATUS, CONF_DONE, MSEL[0:3]) with short traces and pull-up/pull-down resistors per the configuration mode selection table.
Do not confuse the EP3SE50F780C4L (lead-free) with the EP3SE50F780C4 (SnPb) when sourcing for RoHS-compliant production. The 'L' suffix indicates Pb-free terminal finish; the EP3SE50F780C4 has SnPb balls and is non-RoHS. Also confirm the speed grade (C4 vs C3 vs C2) before placement - a lower speed grade may cause timing closure failure. For new designs in 2026+, choose Stratix V/Stratix 10 or Cyclone V/Cyclone 10 families since Stratix III is NMDNR.
Información de cumplimiento
L suffix in EP3SE50F780C4L confirms Pb-free terminal finish compliant with RoHS directive 2011/65/EU. AEC-Q100 not applicable (programmable logic, not automotive ASIC). REACH, halogen-free, and conflict-minerals status require verification against the Intel product compliance declaration.