EP3SL340H1152I4LN - 337.5K LEs Stratix III L FPGA, 1152-BGA | Intel
N.º de pieza: EP3SL340H1152I4LN ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $20136.61 | $20.136,61 |
| 10 | $19500 | $195.000,00 |
| 25 | $18900 | $472.500,00 |
| 50 | $18500 | $925.000,00 |
| 100 | $18050 | $1.805.000,00 |
EP3SL340H1152I4LN Descripción general
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs), which sit under digital logic ICs, and ultimately the integrated circuit family. The Stratix III generation, introduced in 2007, emphasized lower static power than its predecessor through a programmable power technology that lets unused logic tiles enter a low-leakage state.
Key features of the EP3SL340H1152I4LN include 13,500 Adaptive Logic Modules (ALMs) organized as Logic Array Blocks (LABs), 1,152 Kbits of MLAB memory, dedicated DSP blocks for high-throughput arithmetic, and 8.5625 Gbps transceivers in select speed grades. The industrial temperature grade (-40C to +100C TJ) and Pb-free / RoHS-compliant package suit telecom, broadcast, military, and high-end ASIC prototyping applications.
Architecturally, Stratix III L uses a 65 nm low-power CMOS process with copper interconnects, a fine-grained ALM providing 8 inputs and two outputs per module, and an embedded memory hierarchy combining distributed MLAB RAM with true dual-port M144K block RAM. Hard IP includes PCIe Gen1 hard IP blocks, external memory interfaces (DDR3/QDRII+/RLDRAM II), and up to 24 transceivers supporting CPRI/OBSAI/Serial RapidIO protocols.
Typical applications include high-performance digital signal processing, software-defined radio (SDR) baseband, radar processing, ASIC prototyping, video broadcast infrastructure, and high-speed serial protocol bridging. The very high logic capacity also makes it attractive for compute acceleration and high-channel-count data acquisition.
When designing with this device, ensure your PCB land pattern matches the 1.0 mm pitch HBGA 1152-ball layout, allocate sufficient decoupling (multiple bulk + 0402/0201 ceramics) near each power pin, and use the Altera Quartus II design suite with the Stratix III device library for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, drop-in alternatives from the Stratix III L family, and practical design notes not aggregated in any single manufacturer document.
Alternativas directas para EP3SL340H1152I4LN — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP3SL340H1152I4LN (mismo factor de forma y huella) — difiere en Package, Operating Temperature, Speed Grade, Core Voltage, RoHS Status.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP3SL340H1152I4L
✅ Sustitución directa✓ En stock
$4100 / unidad
Ver hoja de datos →EP3SL340H1152I4
✅ Sustitución directa✓ En stock
$15100 / unidad
Ver hoja de datos →EP3SL340H1152I3N
✅ Sustitución directa✓ En stock
$14250 / unidad
Ver hoja de datos →EP3SL340H1152C4LN
✅ Sustitución directa✓ En stock
$1980 / unidad
Ver hoja de datos →EP3SL340H1152C4N
✅ Sustitución directa✓ En stock
$1245 / unidad
Ver hoja de datos →EP3SL340H1152I3
✅ Sustitución directa✓ En stock
$13234.64 / unidad
Ver hoja de datos →EP3SL340H1152C4L
✅ Sustitución directa✓ En stock
$3500 / unidad
Ver hoja de datos →EP3SL340H1152I4LN Valores máximos y características eléctricas
| Series | Stratix III L |
| Manufacturer | Intel (formerly Altera) |
| Process Technology | 65 nm CMOS |
| Logic Elements | 337,500 |
| Adaptive Logic Modules (ALMs) | 135,000 |
| Number of LABs/CLBs | 13,500 |
| Total RAM Bits | 18,821,144 |
| Maximum User I/Os | 744 |
| Temperatura de funcionamiento | -40C to +100C (TJ) |
| Core Voltage | 1.1 V |
| Encapsulado | 1152-BBGA, FCBGA (40x40 mm) |
| Tipo de montaje | Surface Mount |
| Product Status | Obsolete (last-time-buy expired) |
| Estado RoHS | Compliant (Pb-free) |
| Max Core Frequency | 500 MHz (per FindIC summary) |
Guía de configuración de pines de EP3SL340H1152I4LN 1152-bbga, fcbga (40x40 mm)
Configuración de pines para EP3SL340H1152I4LN (encapsulado 1152-bbga, fcbga (40x40 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP3SL340H1152I4LN.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP3SL340H1152I4LN es adecuado para 6 aplicacións: ASIC Prototyping and Emulation, High-Performance DSP and Signal Processing, Software Defined Radio (SDR) Baseband, High-Speed Serial Protocol Bridging, Radar and EW Signal Processing, Video Broadcast and Imaging Infrastructure.
ASIC Prototyping and Emulation
The EP3SL340H1152I4LN is an industry-standard platform for ASIC prototyping and emulation. Its 337,500 logic elements and 18.82 Mbit embedded memory provide enough density to map multi-million-gate ASIC designs onto one or two FPGAs in a partitioned fashion. The 1152-ball FCBGA package exposes 744 user I/Os, enabling a chip-to-chip pin mapping that mirrors the target ASIC's pad ring. Quartus II synthesis supports gate-level mapping from synthesized ASIC netlists, and the device's dedicated DSP and memory blocks accelerate emulation of arithmetic and datapath-heavy ASICs. The -40C to +100C industrial temp grade also permits in-lab bring-up across varying ambient conditions.
Recomendado
High-Performance DSP and Signal Processing
With its dedicated DSP blocks, 337,500 logic elements, and high-speed on-chip memory, the EP3SL340H1152I4LN excels at high-throughput DSP workloads. The device can implement hundreds of multiply-accumulate (MAC) operations per clock cycle, making it suitable for radar baseband, channel aggregation, and software-defined radio. The 65 nm low-power Stratix III L process minimizes static power during long idle periods between processing bursts, and the embedded MLAB/M144K memory hierarchy delivers low-latency data access for FFT, FIR, and matrix operations. Designers typically pair the FPGA with DDR3 or QDRII+ external memory for high-bandwidth data buffering.
Recomendado
Software Defined Radio (SDR) Baseband
The EP3SL340H1152I4LN supports up to 24 transceivers running at up to 8.5 Gbps, which is sufficient to implement CPRI, OBSAI, and Serial RapidIO links used in wireless base stations. The device's combination of high logic density and embedded DSP lets designers implement PHY-layer baseband processing, scrambling/descrambling, and forward error correction entirely in the FPGA, paired with an external RF transceiver and ADC/DAC chain. The industrial temperature grade is well suited for outdoor remote-radio-head (RRH) deployments where ambient temperatures can exceed 85C in sun-loaded enclosures.
Recomendado
High-Speed Serial Protocol Bridging
The EP3SL340H1152I4LN integrates dedicated PCIe hard IP, multi-gigabit transceivers, and external memory interfaces that make it ideal for protocol bridging applications such as PCIe-to-GbE, SATA-to-Fibre Channel, or Aurora-based chip-to-chip links. The 1152-ball FCBGA exposes sufficient transceivers and clock pins to support multiple independent serial domains simultaneously, and the embedded memory acts as a high-bandwidth packet buffer. This is a common application in telecom line cards, video broadcast routers, and storage controller boards.
Recomendado
Radar and EW Signal Processing
Military and aerospace radar, SIGINT, and electronic-warfare systems leverage the EP3SL340H1152I4LN's high logic capacity for beamforming, pulse compression, and Doppler processing. The device supports parallel ADC/DAC interfacing through LVDS-based LVDS serialization/deserialization, and its dedicated DSP blocks perform FFTs of several thousand points per microsecond. While the part is not formally MIL-PRF-38535 qualified, the industrial temperature grade and high MTBF make it a popular choice for commercial-off-the-shelf (COTS) military designs.
Recomendado
Video Broadcast and Imaging Infrastructure
The EP3SL340H1152I4LN's embedded memory and DSP capability make it a strong fit for broadcast video processing - including SDI/HD-SDI/3G-SDI aggregation, video scaling, deinterlacing, and color-space conversion. The 744 user I/Os permit many parallel video data streams to be aggregated and processed simultaneously. Industrial temperature and lead-free assembly meet modern broadcast OEM compliance requirements, and the device is supported by IP cores from both Altera and third-party vendors for JPEG2000, H.264, and emerging codecs.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP3SL340H1152I4LN — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP3SL340H1152I4L | EP3SL340H1152I4 | EP3SL340H1152I3N | EP3SL340H1152C4LN |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-BBGA, FCBGA (40x40 mm) | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 |
| Speed Grade | 4 | 4 | 4 | 3 (faster) | 4 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Ball Finish | Pb-free (N suffix) | Pb-free (non-N marking but RoHS in modern lots) | SnPb (non-N) | Pb-free (N) | Pb-free (N) |
| RoHS Compliant | Yes | Yes | No (SnPb balls) | Yes | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Approx Unit Price (USD) | 20,136.61 | Quote only | Quote only | Quote only | Quote only |
Diferenciadores clave
- Same-die drop-in alternative with industry-proven stability (frente a EP3SL340H1152I4L)
- Faster speed grade at same BGA footprint (frente a EP3SL340H1152I3N)
- True Stratix III L die compatibility - same 65 nm low-power process (frente a EP3SL340H1152C4LN)
Notas de diseño
The 1152-ball FCBGA uses a 1.0 mm ball pitch with a 40x40 mm body. PCB design must use non-solder-mask-defined (NSMD) pads with a 0.45-0.50 mm pad diameter, an 0.6 mm solder mask opening, and a via-in-pad or microvia construction for fanout to inner layers. Stack-up should include at least 8 layers with dedicated GND/PWR planes adjacent to the BGA breakout layers to ensure signal-integrity and power-delivery performance above 500 MHz core frequencies.
The EP3SL340H1152I4LN requires multiple supply rails: VCCINT (1.1 V core), VCCPD (3.0 V), VCCAUX (2.5 V), VCCIO (per-bank 1.2/1.5/1.8/2.5/3.0 V), and dedicated transceiver supplies. Estimated: at typical utilization (~50% LE toggle rate at 250 MHz) the device can draw 6-10 A from VCCINT alone; bulk decoupling should include 22 uF polymer + 4.7 uF ceramic per regulator, with 0402 0.1 uF + 0201 10 nF decoupling adjacent to each power pin. Designers must sequence VCCINT before VCCAUX/VCCPD per Intel's power-up requirements.
Estimated: at full utilization with typical industrial ambient (55C), the device will dissipate 8-12 W and require a heatsink or chassis thermal path. The 40x40 mm BGA provides adequate copper area for spreader-plate attachment; thermal compound (e.g., ShinEtsu X23-7783D) should be used to interface with a finned or cold-finger heatsink. Verify junction temperature does not exceed 100C under worst-case workload using the Quartus II PowerPlay early-power-estimator report.
Configuration flash: the Stratix III configuration scheme requires an external EPCQ256 or EPCS64 flash; designers often forget that the FPGA's nCONFIG and nSTATUS lines must be pulled up correctly during power-up. Also, the device is obsolete; any new design should weigh the cost of second-source qualification versus migrating to a Stratix V or Cyclone V equivalent. Verify IO standard banking compatibility carefully when migrating firmware - the LVDS support and pin mapping differ between Stratix III and later generations.
Información de cumplimiento
RoHS-compliant per Pb-free N suffix in part number. Not AEC-Q100 qualified (commercial/industrial FPGA, not automotive). Halogen-free status not explicitly stated in verified data.
