EP3SL340H1152I4LN - 337.5K LEs Stratix III L FPGA, 1152-BGA | Intel
부품 번호: EP3SL340H1152I4LN ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $20136.61 | $20,136.61 |
| 10 | $19500 | $195,000.00 |
| 25 | $18900 | $472,500.00 |
| 50 | $18500 | $925,000.00 |
| 100 | $18050 | $1,805,000.00 |
EP3SL340H1152I4LN 개요
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs), which sit under digital logic ICs, and ultimately the integrated circuit family. The Stratix III generation, introduced in 2007, emphasized lower static power than its predecessor through a programmable power technology that lets unused logic tiles enter a low-leakage state.
Key features of the EP3SL340H1152I4LN include 13,500 Adaptive Logic Modules (ALMs) organized as Logic Array Blocks (LABs), 1,152 Kbits of MLAB memory, dedicated DSP blocks for high-throughput arithmetic, and 8.5625 Gbps transceivers in select speed grades. The industrial temperature grade (-40C to +100C TJ) and Pb-free / RoHS-compliant package suit telecom, broadcast, military, and high-end ASIC prototyping applications.
Architecturally, Stratix III L uses a 65 nm low-power CMOS process with copper interconnects, a fine-grained ALM providing 8 inputs and two outputs per module, and an embedded memory hierarchy combining distributed MLAB RAM with true dual-port M144K block RAM. Hard IP includes PCIe Gen1 hard IP blocks, external memory interfaces (DDR3/QDRII+/RLDRAM II), and up to 24 transceivers supporting CPRI/OBSAI/Serial RapidIO protocols.
Typical applications include high-performance digital signal processing, software-defined radio (SDR) baseband, radar processing, ASIC prototyping, video broadcast infrastructure, and high-speed serial protocol bridging. The very high logic capacity also makes it attractive for compute acceleration and high-channel-count data acquisition.
When designing with this device, ensure your PCB land pattern matches the 1.0 mm pitch HBGA 1152-ball layout, allocate sufficient decoupling (multiple bulk + 0402/0201 ceramics) near each power pin, and use the Altera Quartus II design suite with the Stratix III device library for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, drop-in alternatives from the Stratix III L family, and practical design notes not aggregated in any single manufacturer document.
드롭인 대체품: EP3SL340H1152I4LN — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL340H1152I4LN (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Core Voltage, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL340H1152I4L
✅ 드롭인✓ 재고 있음
$4100 / 개
데이터시트 보기 →EP3SL340H1152I4
✅ 드롭인✓ 재고 있음
$15100 / 개
데이터시트 보기 →EP3SL340H1152I3N
✅ 드롭인✓ 재고 있음
$14250 / 개
데이터시트 보기 →EP3SL340H1152C4LN
✅ 드롭인✓ 재고 있음
$1980 / 개
데이터시트 보기 →EP3SL340H1152C4N
✅ 드롭인✓ 재고 있음
$1245 / 개
데이터시트 보기 →EP3SL340H1152I3
✅ 드롭인✓ 재고 있음
$13234.64 / 개
데이터시트 보기 →EP3SL340H1152C4L
✅ 드롭인✓ 재고 있음
$3500 / 개
데이터시트 보기 →EP3SL340H1152I4LN 최대 정격 & 전기적 특성
| Series | Stratix III L |
| Manufacturer | Intel (formerly Altera) |
| Process Technology | 65 nm CMOS |
| Logic Elements | 337,500 |
| Adaptive Logic Modules (ALMs) | 135,000 |
| Number of LABs/CLBs | 13,500 |
| Total RAM Bits | 18,821,144 |
| Maximum User I/Os | 744 |
| 동작 온도 | -40C to +100C (TJ) |
| Core Voltage | 1.1 V |
| 패키지 | 1152-BBGA, FCBGA (40x40 mm) |
| 실장 유형 | Surface Mount |
| Product Status | Obsolete (last-time-buy expired) |
| RoHS 상태 | Compliant (Pb-free) |
| Max Core Frequency | 500 MHz (per FindIC summary) |
EP3SL340H1152I4LN 1152-bbga, fcbga (40x40 mm) 핀 구성 가이드
EP3SL340H1152I4LN(1152-bbga, fcbga (40x40 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL340H1152I4LN.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL340H1152I4LN 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, High-Performance DSP and Signal Processing, Software Defined Radio (SDR) Baseband, High-Speed Serial Protocol Bridging, Radar and EW Signal Processing, Video Broadcast and Imaging Infrastructure.
ASIC Prototyping and Emulation
The EP3SL340H1152I4LN is an industry-standard platform for ASIC prototyping and emulation. Its 337,500 logic elements and 18.82 Mbit embedded memory provide enough density to map multi-million-gate ASIC designs onto one or two FPGAs in a partitioned fashion. The 1152-ball FCBGA package exposes 744 user I/Os, enabling a chip-to-chip pin mapping that mirrors the target ASIC's pad ring. Quartus II synthesis supports gate-level mapping from synthesized ASIC netlists, and the device's dedicated DSP and memory blocks accelerate emulation of arithmetic and datapath-heavy ASICs. The -40C to +100C industrial temp grade also permits in-lab bring-up across varying ambient conditions.
추천
High-Performance DSP and Signal Processing
With its dedicated DSP blocks, 337,500 logic elements, and high-speed on-chip memory, the EP3SL340H1152I4LN excels at high-throughput DSP workloads. The device can implement hundreds of multiply-accumulate (MAC) operations per clock cycle, making it suitable for radar baseband, channel aggregation, and software-defined radio. The 65 nm low-power Stratix III L process minimizes static power during long idle periods between processing bursts, and the embedded MLAB/M144K memory hierarchy delivers low-latency data access for FFT, FIR, and matrix operations. Designers typically pair the FPGA with DDR3 or QDRII+ external memory for high-bandwidth data buffering.
추천
Software Defined Radio (SDR) Baseband
The EP3SL340H1152I4LN supports up to 24 transceivers running at up to 8.5 Gbps, which is sufficient to implement CPRI, OBSAI, and Serial RapidIO links used in wireless base stations. The device's combination of high logic density and embedded DSP lets designers implement PHY-layer baseband processing, scrambling/descrambling, and forward error correction entirely in the FPGA, paired with an external RF transceiver and ADC/DAC chain. The industrial temperature grade is well suited for outdoor remote-radio-head (RRH) deployments where ambient temperatures can exceed 85C in sun-loaded enclosures.
추천
High-Speed Serial Protocol Bridging
The EP3SL340H1152I4LN integrates dedicated PCIe hard IP, multi-gigabit transceivers, and external memory interfaces that make it ideal for protocol bridging applications such as PCIe-to-GbE, SATA-to-Fibre Channel, or Aurora-based chip-to-chip links. The 1152-ball FCBGA exposes sufficient transceivers and clock pins to support multiple independent serial domains simultaneously, and the embedded memory acts as a high-bandwidth packet buffer. This is a common application in telecom line cards, video broadcast routers, and storage controller boards.
추천
Radar and EW Signal Processing
Military and aerospace radar, SIGINT, and electronic-warfare systems leverage the EP3SL340H1152I4LN's high logic capacity for beamforming, pulse compression, and Doppler processing. The device supports parallel ADC/DAC interfacing through LVDS-based LVDS serialization/deserialization, and its dedicated DSP blocks perform FFTs of several thousand points per microsecond. While the part is not formally MIL-PRF-38535 qualified, the industrial temperature grade and high MTBF make it a popular choice for commercial-off-the-shelf (COTS) military designs.
추천
Video Broadcast and Imaging Infrastructure
The EP3SL340H1152I4LN's embedded memory and DSP capability make it a strong fit for broadcast video processing - including SDI/HD-SDI/3G-SDI aggregation, video scaling, deinterlacing, and color-space conversion. The 744 user I/Os permit many parallel video data streams to be aggregated and processed simultaneously. Industrial temperature and lead-free assembly meet modern broadcast OEM compliance requirements, and the device is supported by IP cores from both Altera and third-party vendors for JPEG2000, H.264, and emerging codecs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL340H1152I4LN — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL340H1152I4L | EP3SL340H1152I4 | EP3SL340H1152I3N | EP3SL340H1152C4LN |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-BBGA, FCBGA (40x40 mm) | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 |
| Speed Grade | 4 | 4 | 4 | 3 (faster) | 4 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Ball Finish | Pb-free (N suffix) | Pb-free (non-N marking but RoHS in modern lots) | SnPb (non-N) | Pb-free (N) | Pb-free (N) |
| RoHS Compliant | Yes | Yes | No (SnPb balls) | Yes | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Approx Unit Price (USD) | 20,136.61 | Quote only | Quote only | Quote only | Quote only |
주요 차별점
- Same-die drop-in alternative with industry-proven stability (vs EP3SL340H1152I4L)
- Faster speed grade at same BGA footprint (vs EP3SL340H1152I3N)
- True Stratix III L die compatibility - same 65 nm low-power process (vs EP3SL340H1152C4LN)
설계 노트
The 1152-ball FCBGA uses a 1.0 mm ball pitch with a 40x40 mm body. PCB design must use non-solder-mask-defined (NSMD) pads with a 0.45-0.50 mm pad diameter, an 0.6 mm solder mask opening, and a via-in-pad or microvia construction for fanout to inner layers. Stack-up should include at least 8 layers with dedicated GND/PWR planes adjacent to the BGA breakout layers to ensure signal-integrity and power-delivery performance above 500 MHz core frequencies.
The EP3SL340H1152I4LN requires multiple supply rails: VCCINT (1.1 V core), VCCPD (3.0 V), VCCAUX (2.5 V), VCCIO (per-bank 1.2/1.5/1.8/2.5/3.0 V), and dedicated transceiver supplies. Estimated: at typical utilization (~50% LE toggle rate at 250 MHz) the device can draw 6-10 A from VCCINT alone; bulk decoupling should include 22 uF polymer + 4.7 uF ceramic per regulator, with 0402 0.1 uF + 0201 10 nF decoupling adjacent to each power pin. Designers must sequence VCCINT before VCCAUX/VCCPD per Intel's power-up requirements.
Estimated: at full utilization with typical industrial ambient (55C), the device will dissipate 8-12 W and require a heatsink or chassis thermal path. The 40x40 mm BGA provides adequate copper area for spreader-plate attachment; thermal compound (e.g., ShinEtsu X23-7783D) should be used to interface with a finned or cold-finger heatsink. Verify junction temperature does not exceed 100C under worst-case workload using the Quartus II PowerPlay early-power-estimator report.
Configuration flash: the Stratix III configuration scheme requires an external EPCQ256 or EPCS64 flash; designers often forget that the FPGA's nCONFIG and nSTATUS lines must be pulled up correctly during power-up. Also, the device is obsolete; any new design should weigh the cost of second-source qualification versus migrating to a Stratix V or Cyclone V equivalent. Verify IO standard banking compatibility carefully when migrating firmware - the LVDS support and pin mapping differ between Stratix III and later generations.
규정 준수 정보
RoHS-compliant per Pb-free N suffix in part number. Not AEC-Q100 qualified (commercial/industrial FPGA, not automotive). Halogen-free status not explicitly stated in verified data.
