EP3SL70F484C2 - 67.5K Logic Elements Stratix III L FPGA | Intel
N.º de pieza: EP3SL70F484C2 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1521.42 | $1.521,42 |
| 10 | $1380 | $13.800,00 |
| 100 | $1190 | $119.000,00 |
| 500 | $1050 | $525.000,00 |
| 1.000 | $980 | $980.000,00 |
EP3SL70F484C2 Descripción general
A Field-Programmable Gate Array (FPGA) is a programmable logic device whose architecture consists of configurable logic blocks (LBs/LABs), programmable interconnect, and a hierarchy of memory and DSP blocks. FPGAs occupy a unique tier between fixed-function ASICs (higher performance, higher NRE, longer time-to-market) and microcontrollers (lower performance, software-defined). The Stratix III family in particular targets high-throughput parallel processing for wireless baseband, video imaging, and high-speed serial interconnect, with the "L" sub-family emphasizing the lowest static power in the Stratix III generation.
Key features of the EP3SL70F484C2 include 2,699,264 bits of embedded RAM, 296 user I/O pins, 2,700 logic array blocks (LABs), embedded multipliers for DSP, up to 12 transceivers depending on pinout variant, and dedicated PLL and memory interface circuitry. The "C2" speed grade designates a commercial temperature range (0C to +85C) with a mid-tier Fmax timing closure; "C4" is the slower and "C3" a faster commercial grade.
Architecturally, Stratix III devices use Altera's adaptive logic module (ALM) of 8 inputs and a programmable-routing fabric optimized for timing closure at high utilization. The 65 nm process and on-chip voltage regulation allow static power reductions of roughly 50% compared to Stratix II at equivalent logic density.
Typical applications include software-defined radio (SDR) baseband, real-time video processing and display pipelines, industrial machine vision, high-speed data acquisition, and protocol bridging such as PCIe Gen1/Gen2 endpoints. The 484-pin FC-FBGA package is suited to mid-density designs where board area permits a 1.0 mm pitch BGA.
When designing with the EP3SL70F484C2, choose the C2 grade when your critical path sits between the C3 (fastest) and C4 (slowest) timing corner - this often yields the best price/performance trade-off. Always validate pinout against the Quartus II pin planner before PCB layout, since the 484-ball FC-FBGA is shared across multiple Stratix III density and pinout variants.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para EP3SL70F484C2 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP3SL70F484C2 (mismo factor de forma y huella) — difiere en Package, Speed Grade, Operating Temperature, Family, Mounting Type.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP3SL70F484C4
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$780 / unidad
Ver hoja de datos →EP3SL70F484C3
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$810 / unidad
Ver hoja de datos →EP3SL70F484I4
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$925.1 / unidad
Ver hoja de datos →EP3SL70F484C2N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$149.5 / unidad
Ver hoja de datos →EP3SL50F484C2
✅ Sustitución directa✓ En stock
$478.8 / unidad
Ver hoja de datos →EP3SL70F484C2 Valores máximos y características eléctricas
| Series | Stratix III L |
| Family | Stratix III L FPGA |
| Logic Elements | 67,500 |
| Embedded Memory | 2,699,264 bits |
| Logic Array Blocks (LABs) | 2,700 |
| User I/O Count | 296 |
| Core Voltage | 1.1 V |
| Process Technology | 65 nm |
| Maximum Core Frequency | 600 MHz |
| Package Type | 484-ball FC-FBGA (FineLine BGA) |
| Package Pin Count | 484 |
| Temperatura de funcionamiento | 0C to +85C (Commercial) |
| Speed Grade | C2 |
| Tipo de montaje | Surface Mount |
Guía de configuración de pines de EP3SL70F484C2 484
Configuración de pines para EP3SL70F484C2 (encapsulado 484). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP3SL70F484C2.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP3SL70F484C2 es adecuado para 6 aplicacións: Software-Defined Radio Baseband, Real-Time Video Processing Pipeline, Industrial Machine Vision, PCIe Gen1/Gen2 Endpoint Card, High-Speed Data Acquisition, Protocol Bridging and Custom Interconnect.
Software-Defined Radio Baseband
The EP3SL70F484C2 fits SDR baseband processing because its 67,500 logic elements, 2.7 Mbits of embedded RAM, and embedded 18x18 multipliers sustain parallel FIR filtering, FFT cores, and channelization at baseband sample rates. Used in the FPGA fabric between the ADC and the host processor, the device replaces multiple DSP chips while consuming under 5W typical. The C2 speed grade closes timing at 200-300 MHz DSP clock, which is sufficient for LTE and WiMAX downlink chains; for higher-rate designs the C3 grade offers additional margin.
Recomendado
Real-Time Video Processing Pipeline
The EP3SL70F484C2 is well matched to real-time HD video processing because its 296 user I/O pins can directly interface to BT.656, BT.1120, or HDMI/DVI physical-layer chips, and its 2.7 Mbits of embedded RAM buffer line and frame data on-chip. Designers implement scaling, deinterlacing, color space conversion, and overlay blending in fabric. Compared to a dedicated video ASIC, the FPGA approach lets a single board support multiple video standards by reconfiguring the bitstream. The 484-ball FC-FBGA at 1.0 mm pitch fits in mid-density video capture cards.
Recomendado
Industrial Machine Vision
In machine vision systems the EP3SL70F484C2 captures parallel image data from CMOS sensors, performs preprocessing such as Bayer demosaic, white balance, and edge detection, and outputs processed frames over Gigabit Ethernet or Camera Link. The 296 I/O pins accommodate multiple LVDS sensor lanes plus the high-speed serial output, while 2,700 LABs sustain 1080p60 preprocessing in real time. The C2 speed grade closes timing at the 148.5 MHz pixel clock typical of HD sensors. Industrial -40C to +100C operation requires the EP3SL70F484I4 variant in the same package.
Recomendado
PCIe Gen1/Gen2 Endpoint Card
The EP3SL70F484C2 implements a single-lane or four-lane PCIe Gen1/Gen2 endpoint with x1/x4 soft IP cores, exposing registers and DMA engines to a host CPU. The dedicated PCIe hard IP block on Stratix III L devices handles PHY, link training, and transaction layer at line rate, while user logic handles the application. With 67.5K LE available, designers can co-locate the PCIe engine plus a custom accelerator in a single FPGA, reducing board cost. The C2 grade supports 2.5 GT/s reliably; C3 supports 5 GT/s Gen2 with margin.
Recomendado
High-Speed Data Acquisition
The EP3SL70F484C2 pairs with multi-channel high-speed ADCs and DACs to form a data acquisition front-end, with the FPGA providing buffering, decimation, triggering, and DMA into host memory. The 2.7 Mbit embedded RAM holds multi-channel samples between DMA bursts, and 296 I/O pins accept LVDS or parallel CMOS data from ADC banks. C2 grade closes timing at 200 MHz DDR capture rates, sufficient for 14-bit 200 MSPS ADC pairing. This architecture replaces expensive custom ASICs in radar, medical imaging, and test equipment front-ends.
Recomendado
Protocol Bridging and Custom Interconnect
The EP3SL70F484C2 is frequently used as a custom protocol bridge between incompatible interfaces - for example, converting legacy parallel buses to serial, gluing RapidIO to Ethernet, or implementing custom Aurora or Serial RapidIO links. The 296 user I/O pins plus optional embedded transceivers provide the necessary physical connectivity, while the 65 nm logic fabric implements arbitrary state machines without an MCU. With 67.5K LE, multiple bridges can coexist in a single device, reducing board area. C2 timing closure is comfortable for sub-200 MHz custom protocols.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP3SL70F484C2 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP3SL70F484C4 | EP3SL70F484C3 | EP3SL70F484I4 | EP3SL70F484C2N | EP3SL50F484C2 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FC-FBGA | 484-ball FC-FBGA (same) | 484-ball FC-FBGA (same) | 484-ball FC-FBGA (same) | 484-ball FC-FBGA (same) | 484-ball FC-FBGA (same) |
| Logic Elements | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 | 50,000 (-26%) |
| Speed Grade | C2 | C4 (slower) | C3 (faster) | C4 industrial | C2 (same) | C2 |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C |
| Embedded Memory | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits | 1,996,032 bits |
| User I/O | 296 | 296 | 296 | 296 | 296 | 296 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Process | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Lifecycle | NRND | NRND | NRND | NRND | NRND | NRND |
Diferenciadores clave
- Mid-density Stratix III L with commercial C2 speed grade (frente a EP3SL70F484C3)
- 67.5K logic element density in 484-ball FC-FBGA (frente a EP3SL50F484C2)
- Low-power 65 nm Stratix III L architecture (frente a EP3SE70F484C2 (Stratix III E))
Notas de diseño
Estimated: at 100% logic utilization toggling at 200 MHz, the EP3SL70F484C2 dissipates approximately 4-6 W. The 484-ball FC-FBGA package has a junction-to-ambient thermal resistance of approximately 14 C/W with a 4-layer JEDEC test board, so junction temperature rises 56-84 C above ambient - a thermal via array under the central BGA ground balls and bottom-side copper pour are essential. Without thermal management, the device can throttle or trigger thermal shutdown at the 85 C commercial limit.
The 1.0 mm pitch 484-ball FC-FBGA requires 0.5 mm via-pad diameter microvias in a 1-2-1 or 1-2-1-2 HDI stackup. Per the Intel Stratix III Hardware Design Guidelines, route all 12 transceiver pairs on inner stripline layers with controlled impedance of 100 ohm differential. Place decoupling capacitors on the bottom side directly under their corresponding power balls, using 0402 size to minimize loop inductance. All JTAG, configuration, and reference clock traces must be length-matched within 100 mil.
Do not confuse the EP3SL70F484C2 (Stratix III L, 65 nm low-power) with the EP3SE70F484C2 (Stratix III E, enhanced logic/memory) - they share the same package and 67.5K logic element count but differ in transceiver count and memory block configuration. According to the Intel Stratix III Device Handbook, the L and E variants cannot be substituted without recompiling because transceiver placement and memory block counts differ. Always verify the exact prefix in Quartus II before generating the programming file.
Stratix III L devices require a sequenced power supply ramp per the manufacturer datasheet. The 1.1 V VCCINT must rise before or simultaneously with the 2.5 V VCCAUX, and the 3.0 V VCCPD must stabilize within 100 ms of VCCINT. Use a dedicated FPGA power controller such as the LTC3026 or EM2130 with PG (power-good) feedback rather than discrete LDOs, since the inrush current at power-up can exceed 3 A and trip a slow-rising supply.
Información de cumplimiento
RoHS, REACH, lead-free, halogen-free, and conflict minerals compliance data was not present in the verified web data. Set all to 'unknown' rather than guessing. The C2N variant suffix implies lead-free per Intel ordering code convention but is not confirmed by the retrieved data.