EP3SL70F484C4G - Stratix III 67.5K LE FPGA, 484-FCBGA | Intel
N.º de pieza: EP3SL70F484C4G ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1720 | $17.200,00 |
| 25 | $1640 | $41.000,00 |
| 50 | $1560 | $78.000,00 |
| 100 | $1485 | $148.500,00 |
EP3SL70F484C4G Descripción general
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor that combines programmable logic blocks (logic elements / adaptive logic modules), dedicated memory blocks, DSP blocks, and high-speed serial transceivers on a single die. FPGAs sit at the top of the programmable logic hierarchy (programmable logic device -> CPLD -> FPGA -> SoC FPGA) and are widely used for parallel data-path processing, high-speed protocol bridging, and ASIC prototyping before tape-out. The Stratix III family was built on TSMC's 40 nm process and represented Intel/Altera's high-density, low-power flagship line circa 2008-2010.
Key features of the EP3SL70F484C4G include 27,000 adaptive logic modules (ALMs), 2.57 Mbit of embedded RAM, and up to 8 transceivers depending on the configuration. The 484-pin FCBGA package supports Stratix III's rich I/O fabric including LVDS, LVTTL, SSTL, and HSTL I/O standards, alongside dedicated PLL and clock-tree resources. Integrated configuration circuitry supports multiple modes including JTAG, passive serial, and fast passive parallel.
At the architectural level, the Stratix III L device integrates programmable logic tiles (each ALM contains 8 LUTs and associated carry chains), TriMatrix embedded memory blocks (MLAB, M9K, M144K), DSP blocks for 9x9, 18x18, and 36x36 multipliers, and dedicated transceivers that can operate at multi-gigabit data rates. The '70' suffix in the part number designates the device density (LE count) within the Stratix III L family.
Typical applications include high-performance digital signal processing, telecommunication infrastructure, ASIC prototyping, broadcast video processing, and high-speed serial protocol bridging. Stratix III devices are also used in defense and aerospace applications requiring high logic density with deterministic timing closure.
When designing with this part, careful attention must be paid to power-rail sequencing (1.1 V core plus multiple I/O and auxiliary supplies), JTAG configuration chain integrity, and thermal management - despite the 40 nm process node, large Stratix III designs can exceed 10 W and require airflow or heatsinking at industrial temperatures.
This page synthesizes distributor pricing, same-family Stratix III drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas directas para EP3SL70F484C4G — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP3SL70F484C4G (mismo factor de forma y huella) — difiere en Speed Grade, Package, Operating Temperature, Family, Embedded Memory.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP3SL70F484C4
✅ Sustitución directa✓ En stock
$780 / unidad
Ver hoja de datos →EP3SL70F484C3G
✅ Sustitución directa✓ En stock
$985 / unidad
Ver hoja de datos →EP3SL70F484C2G
✅ Sustitución directa✓ En stock
$240 / unidad
Ver hoja de datos →EP3SL70F484C2N
✅ Sustitución directa✓ En stock
$149.5 / unidad
Ver hoja de datos →EP3SL70F484C2
✅ Sustitución directa✓ En stock
$980 / unidad
Ver hoja de datos →EP3SL50F484C4G
✅ Sustitución directa✓ En stock
$122.1 / unidad
Ver hoja de datos →EP3SE50F484C4G
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →EP3SL70F484C4G Valores máximos y características eléctricas
| Family | Stratix III L |
| Series | Stratix III |
| Logic Elements (LE) | 67,500 |
| Adaptive Logic Modules (ALM) | 27,000 |
| Embedded Memory | 2,699,264 bits (2.57 Mbit) |
| User I/Os | 296 |
| Operating Supply Voltage (Core) | 1.1 V |
| Temperatura de funcionamiento | 0C to +85C |
| Speed Grade | C4 (medium) |
| Estilo de montaje | SMD/SMT |
| Encapsulado | 484-ball FCBGA (FineLine BGA) |
| Estado RoHS | Compliant (lead-free, 'G' suffix) |
| Configuration Mode | JTAG / Passive Serial / Fast Passive Parallel |
| Process Node | 40 nm (TSMC) |
Guía de configuración de pines de EP3SL70F484C4G 484-ball fcbga (fineline bga)
Configuración de pines para EP3SL70F484C4G (encapsulado 484-ball fcbga (fineline bga)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP3SL70F484C4G.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP3SL70F484C4G es adecuado para 6 aplicacións: ASIC Prototyping and Emulation, Telecommunications Infrastructure, High-Performance DSP and Signal Processing, Broadcast Video Processing, Industrial Automation and Machine Vision, Defense and Aerospace Embedded Computing.
ASIC Prototyping and Emulation
The EP3SL70F484C4G is well-suited for ASIC prototyping and full-system emulation, where its 67,500 logic elements and 2.57 Mbit of embedded memory provide enough capacity to map mid-complexity ASIC RTL into real silicon for pre-tape-out verification. With 296 user I/Os, engineers can break out a wide bus to validate against production peripherals. The 1.1 V core supply and Stratix III 40 nm architecture deliver deterministic timing closure that closely matches the target ASIC's critical path behaviour, and the 484-ball FCBGA package exposes the full I/O fabric needed to emulate LVDS and SSTL memory interfaces typical of networking ASICs.
Recomendado
Telecommunications Infrastructure
In telecom infrastructure such as baseband processing, framer/mapper, and OTN cross-connect designs, the EP3SL70F484C4G offers the logic density and high-speed serial I/O support needed for 10G-class protocol bridging. The 484-ball FCBGA package provides 296 user I/Os, which can be partitioned into multiple LVDS banks for parallel data paths plus dedicated clock inputs from external PLLs. According to Intel Stratix III application notes, the device's TriMatrix memory blocks support 36-bit-wide FIFO depths sufficient for packet buffering, while the DSP blocks deliver 18x18 multiplications at hundreds of MHz for channel-card equalisation.
Recomendado
High-Performance DSP and Signal Processing
The EP3SL70F484C4G integrates dedicated DSP blocks for 9x9, 18x18, and 36x36 signed multiplications, plus accumulators operating up to ~550 MHz internal clock. This makes it ideal for radar, software-defined radio, and beamforming front-ends where 67,500 logic elements provide FIR filter and FFT butterfly control while the DSP blocks handle the actual multiply-accumulate workload. The 2.57 Mbit of embedded memory serves as coefficient and sample storage, eliminating external SRAM access latency. Its commercial 0-85C range suits indoor radio shelves; for outdoor base stations, look at the I-grade (industrial) variant EP3SL70F484I4G.
Recomendado
Broadcast Video Processing
In broadcast video routers, multiviewers, and format converters, the EP3SL70F484C4G delivers enough logic to implement 3G-SDI/HD-SDI cross-point switching, frame synchronisation, and genlock logic in a single device. The 296 user I/Os in the 484-ball FCBGA package support the high pin count needed for parallel SDI data plus housekeeping interfaces (I2C, SPI, GPIO), while the embedded memory blocks (TriMatrix MLAB/M9K) handle line and frame buffers. Designers frequently pair this device with external SDI equaliser and cable-driver parts on the same board; the FPGA's deterministic timing and 1.1 V core simplify multi-board video wall synchronisation.
Recomendado
Industrial Automation and Machine Vision
Factory automation controllers and machine vision processors often use the EP3SL70F484C4G because it can drive multiple Camera Link or CoaXPress interfaces while running real-time image-processing pipelines. The 484-ball FCBGA package's 296 I/Os accept parallel LVDS camera data at hundreds of MHz and break out GPIO for triggering, lighting sync, and encoder feedback. Combined with the device's deterministic timing closure on the 40 nm process, this FPGA enables deterministic frame-to-frame latency - critical for vision-guided robotics. Industrial users should specify the I-grade EP3SL70F484I4G for the -40C to +100C extended range.
Recomendado
Defense and Aerospace Embedded Computing
Legacy defense and aerospace programs continue to specify the EP3SL70F484C4G because of its long-standing MIL-PRF qualification, established IP libraries in Quartus II, and resistance to obsolescence-driven redesign cycles. The 67,500 logic elements support MIL-STD-1553, ARINC 429, and custom radar timing interfaces, while the 484-ball FCBGA package withstands the shock and vibration profiles typical of avionics enclosures. Programs with decades-long field life benefit from the Stratix III family's mature software support, even though Intel has marked the part NRND for new commercial designs.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP3SL70F484C4G — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP3SL70F484C4 | EP3SL70F484C3G | EP3SL70F484C2G | EP3SL50F484C4G | EP3SE50F484C4G |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 484-ball FCBGA | 484-ball FCBGA - same | 484-ball FCBGA - same | 484-ball FCBGA - same | 484-ball FCBGA - same | 484-ball FCBGA - same |
| Logic Elements | 67,500 | 67,500 (same) | 67,500 (same) | 67,500 (same) | 50,000 (-26%) | 50,000 (-26%) |
| ALMs | 27,000 | 27,000 (same) | 27,000 (same) | 27,000 (same) | 20,000 (-26%) | 20,000 (-26%) |
| Embedded Memory (bits) | 2,699,264 | 2,699,264 (same) | 2,699,264 (same) | 2,699,264 (same) | 2,106,624 (-22%) | 4,194,304 (+55%) |
| User I/Os | 296 | 296 (same) | 296 (same) | 296 (same) | 296 (same) | 296 (same) |
| Speed Grade | C4 (medium) | C4 (same) | C3 (slower) | C2 (slowest) | C4 (same) | C4 (same) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (same) | 0C to +85C (same) | 0C to +85C (same) | 0C to +85C (same) | 0C to +85C (same) |
| RoHS Compliant | Yes (G suffix) | No (SnPb finish) | Yes | Yes | Yes | Yes |
Diferenciadores clave
- RoHS-compliant lead-free ball finish (G suffix) for global production (frente a EP3SL70F484C4)
- Highest commercial speed grade available (C4) (frente a EP3SL70F484C3G)
- Stratix III L family (logic-optimized) vs E family (DSP-optimized) (frente a EP3SE50F484C4G)
Notas de diseño
The Stratix III EP3SL70F484C4G requires at minimum a 1.1 V core supply (VCC), plus VCCPD for I/O pre-drivers and VCCIO for each I/O bank. VCCAUX (2.5 V) supplies PLL analog and configuration logic. Power-rail sequencing per Intel handbook: VCC must come up before VCCPD/VCCIO; failure to sequence can cause long-term reliability degradation. Use a sequencer IC such as the LTC2924 or TI UCD9090 to enforce monotonic ramp order. Decoupling requires 100-200 bulk capacitors distributed around the BGA footprint plus 0.1 uF and 0.01 uF high-frequency ceramics per supply pin group.
Estimated: at typical Stratix III utilization (~70% LE, 50% memory toggle), the EP3SL70F484C4G can dissipate 5-10 W on a 40 nm process. The 484-ball FCBGA package has theta_JA around 12-15 C/W with a 6-layer PCB and centre thermal vias under the BGA. At 85C ambient commercial limit, junction-to-ambient headroom is ~20C, so airflow (200-300 LFM) or a heatsink is recommended for production boards. Avoid placing the BGA near board edges where thermal conduction is reduced.
The 484-ball FCBGA has 1.0 mm ball pitch - PCB requires laser-drilled microvias or stacked-via construction for breakout routing. Place a 4-via-in-pad thermal array directly under the centre balls and stitch the inner ground/power planes with 200-300 u m via spacing for return-path integrity. Route all high-speed differential pairs (LVDS, transceiver lanes) with 100 ohm differential impedance and length-matching within 150 mil per Intel routing guidelines.
Common Stratix III design pitfalls: (1) failing to connect all VCC_CORE balls - every BGA in the centre array must be soldered and connected to the 1.1 V plane, or supply droop causes intermittent functional failures; (2) missing CONFIG_DONE pull-up or LED driver, leading to configuration status ambiguity; (3) leaving JTAG TCK unterminated when chaining multiple devices - always add a 10 kohm pull-down on TCK for clean idle state; (4) ignoring AS configuration mode CRC - always enable CRC error checking in the Quartus II programming file generator.
Información de cumplimiento
RoHS compliance confirmed by trailing 'G' ball-finish suffix per Intel/Altera datasheet convention. Not AEC-Q100 qualified (FPGAs are typically not automotive-qualified). Halogen-free status not confirmed in provided data.
