EP4CE22F1717N - Cyclone IV E FPGA 22K LE, 256-FBGA | Altera
N.º de pieza: EP4CE22F1717N ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $78.2 | $78,20 |
| 10 | $71.5 | $715,00 |
| 100 | $64.85 | $6.485,00 |
| 500 | $58.1 | $29.050,00 |
| 1.000 | $52.4 | $52.400,00 |
EP4CE22F1717N Descripción general
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP blocks, and PLLs. FPGAs occupy a unique place in the IC hierarchy: above fixed-function ASICs and below microcontrollers for parallel processing tasks, they are reprogrammable silicon that bridges software flexibility with hardware speed.
Key features of the EP4CE22F1717N include 4 PLLs, 66 9-Kbit M9K block RAM blocks (total 608 Kbits), 66 18x18 hardware multipliers, and 8 dedicated clock networks per quadrant. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards with up to 343 user I/O pins (package-dependent), making it suitable for parallel data paths, video bridging, and industrial control interfaces.
Architecturally, the Cyclone IV E family uses a logic-element-based fabric with 4-input look-up tables (LUTs), distributed carry chains, and dedicated memory/DSP columns. The 60nm process delivers static power as low as sub-100 mW in standby, while the device is rated for industrial operating temperatures (junction -40C to +100C in commercial/industrial speed grades).
Typical applications include industrial automation and motor control, video processing and image sensor bridging, software-defined radio front-ends, and low-cost ASIC prototyping. Designers frequently pair the Cyclone IV E with external DDR/DDR2 memory controllers and PHY IP for embedded processing subsystems.
Design considerations include thermal management for the 256-pin FBGA (theta-JA approximately 12-15 C/W on a 4-layer JEDEC board), I/O bank voltage grouping to avoid mixing incompatible standards, and configuration via JTAG, AS, or PS modes depending on production needs.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives across the EP4CE22 family, and practical PCB layout notes not collected in any single datasheet, going beyond what DigiKey, Mouser, or the manufacturer catalog offer separately.
Alternativas directas para EP4CE22F1717N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP4CE22F1717N (mismo factor de forma y huella) — difiere en Package, Process Technology.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP4CE22F17I7N
✅ Sustitución directa✓ En stock
$43.4 / unidad
Ver hoja de datos →EP4CE22F17C6N
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP4CE22F17C7N
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP4CE22F17C8N
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP4CE22F23I7N
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP4CE22F1717N Valores máximos y características eléctricas
| Family | Cyclone IV E |
| Logic Elements (LE) | 22,320 |
| Embedded Memory (bits) | 608,256 |
| Embedded Multipliers (18x18) | 153 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Process Technology | 60 nm low-power |
| Core Voltage | 1.2 V |
| Encapsulado | 256-pin FBGA (F17) |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
| Nivel MSL | 3 (per JEDEC J-STD-020) |
Guía de configuración de pines de EP4CE22F1717N 256-pin fbga (f17)
Configuración de pines para EP4CE22F1717N (encapsulado 256-pin fbga (f17)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP4CE22F1717N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP4CE22F1717N es adecuado para 7 aplicacións: Industrial Motor Control, Video Processing and Image Sensor Bridging, Software Defined Radio Front-End, Low-Cost ASIC Prototyping, Automotive Telematics and Body Electronics, Embedded Sensor Aggregation Gateway, Medical Monitoring and Diagnostic Equipment.
Industrial Motor Control
The EP4CE22F1717N's 22,320 logic elements, 153 dedicated 18x18 multipliers, and 4 PLLs provide deterministic cycle-accurate control for multi-axis industrial drives. The 256-pin FBGA package exposes enough user I/O for simultaneous encoder feedback, PWM generation, and fieldbus integration. Industrial temperature grade (-40C to +100C junction) ensures reliable operation in factory-floor enclosures. Cyclone IV E static power under 100 mW reduces thermal load in sealed cabinets.
Recomendado
Video Processing and Image Sensor Bridging
The 153 hardware 18x18 multipliers accelerate pixel-level image processing pipelines at rates up to hundreds of MHz. The 608 Kbits of M9K block RAM serve as line-store buffers for video scalers, deinterlacers, and color-space converters. LVDS I/O support enables direct connection to image sensors and display panels. The 4 PLLs generate the multiple clock domains typical of video bridging designs (pixel clock, memory clock, output clock).
Recomendado
Software Defined Radio Front-End
Cyclone IV E 18x18 multipliers enable baseband signal processing such as FIR filtering, quadrature demodulation, and channelization. The 4 PLLs generate the LO and sample clocks needed for SDR architectures. LVDS I/O simplifies interface to high-speed ADCs and DACs. Static power under 100 mW keeps thermal envelope small for portable SDR platforms. Industrial temp grade supports outdoor or vehicle-mounted deployments.
Recomendado
Low-Cost ASIC Prototyping
The EP4CE22F1717N's 22,320 LEs and 153 multipliers provide adequate capacity to prototype many mid-complexity ASIC designs at real-world clock rates. The 256-pin FBGA exposes 200+ user I/O for ASIC signal mapping. JTAG and Active Serial configuration support fast design iteration. Same-package accessibility for IP-rated members of the Cyclone IV family enables straightforward ASIC-to-Rem validation.
Recomendado
Automotive Telematics and Body Electronics
Industrial temperature grade, robust 60nm process, and multi-decade lifecycle support make the EP4CE22F1717N viable for non-safety automotive electronics such as telematics modules, gateway controllers, and body control units. The 153 multipliers accelerate CAN/LIN message processing pipelines, while 4 PLLs generate the multiple bus clock domains. Altera's automotive-grade part variants follow the same silicon.
Recomendado
Embedded Sensor Aggregation Gateway
Industrial-grade Cyclone IV E with rich I/O capacity suits IoT edge gateways that aggregate multiple sensor streams (SPI, I2C, GPIO, LVDS) and forward to Ethernet or cellular uplinks. The 608 Kbits of block RAM buffer sensor data bursts, and the 4 PLLs synchronize to external sensor clocks. Low static power extends battery life in solar-powered field deployments.
Recomendado
Medical Monitoring and Diagnostic Equipment
Long lifecycle commitment through 2040, industrial temperature grade, and deterministic hardware processing make the EP4CE22F1717N a strong fit for regulated medical devices requiring multi-decade component support. The 153 hardware multipliers enable real-time DSP for patient monitors (ECG, pulse oximetry signal chains). Static predictability aids IEC 62304 / IEC 60601 design verification workflows.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP4CE22F1717N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP4CE22F17I7N | EP4CE22F17C6N | EP4CE22F17C7N | EP4CE22F17C8N | EP4CE22F23I7N |
|---|---|---|---|---|---|---|
| Package | 256-pin FBGA (F17) | 256-pin FBGA (F17) - same | 256-pin FBGA (F17) - same | 256-pin FBGA (F17) - same | 256-pin FBGA (F17) - same | 256-pin FBGA (F17) - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 22,320 | 22,320 | 22,320 | 22,320 | 22,320 | 22,320 |
| Embedded Memory (bits) | 608,256 | 608,256 | 608,256 | 608,256 | 608,256 | 608,256 |
| Embedded Multipliers (18x18) | 153 | 153 | 153 | 153 | 153 | 153 |
| Speed Grade | 7 | 7 | 6 (slower) | 7 | 8 (slower) | 7 |
| Operating Temperature | Industrial | Industrial | Commercial | Commercial | Commercial | Industrial |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Diferenciadores clave
- Long-term lifecycle support through 2040 (frente a Xilinx Spartan-6 LX45)
- Industrial temperature grade in the F17 OPN suffix (frente a EP4CE22F17C6N)
- Rich DSP resources for parallel arithmetic (frente a CPLD alternatives such as MAX V)
- Low static power relative to competing 60nm FPGAs (frente a Xilinx Spartan-6 LX45 (45nm))
Notas de diseño
The 256-pin FBGA package has a theta-JA of approximately 12-15 C/W on a 4-layer JEDEC board (per package thermal model). For a typical 1 W dissipation, junction rise over ambient is 12-15 C; designers should provide adequate copper pour and thermal vias under the exposed die pad. Industrial temp grade requires junction less than 100 C, so at 70 C ambient max ambient environment, power dissipation must stay below approximately 2 W without airflow. Place thermal vias in a 4x4 grid under the package center with 0.3 mm drill and 0.5 mm pitch.
Cyclone IV E requires four separate power rails: 1.2 V core, 2.5 V analog PLL, 1.2 V/1.5 V/1.8 V/2.5 V/3.0 V/3.3 V I/O banks, and configuration-related auxiliary. Decoupling: place 0.1 uF X5R ceramics at every VCC pin within 50 mils of the pad, plus 10 uF bulk capacitors per rail. Power sequencing: assert VCCINT before VCCAUX and VCCIO. Use Ferrite beads on analog PLL supply to isolate from digital noise; place 10 uF and 0.1 uF on each side of the ferrite. Use Altera PowerPlay Early Power Estimator (EPE) spreadsheet for accurate power budgeting before PCB layout.
The 256-ball FBGA F17 package uses 1.0 mm ball pitch. Use NSMD (non-solder-mask defined) pads with 0.45 mm diameter and microvia-in-pad for high-density escape routing. Maintain 50 ohm controlled impedance for LVDS pairs using 4-mil/4-mil trace geometry on a 4-layer stackup with 4 mil dielectric. Route all high-speed clocks on inner layers with ground reference above and below. Decoupling capacitors must be placed as close as possible to their respective VCC balls; long traces defeat decoupling effectiveness. Keep JTAG and configuration signal traces short to avoid signal reflection.
Common pitfalls: (1) Mixing LVDS and LVTTL I/O standards in the same bank causes contention - group I/O standards by bank; (2) Forgetting MSL3 handling for FBGA packages - bake 24 hours at 125 C before assembly if exposure exceeded 168 hours; (3) Selecting the wrong configuration mode - JTAG for prototyping, Active Serial (AS) with EPCS flash for production; (4) Leaving unused I/O banks unpowered causes floating inputs and excess power - tie unused banks to a valid rail; (5) Failing to lock the PLL reference clock before user mode release causes startup failures.
Route clock signals on inner layers with continuous ground reference. Use differential pair routing for LVDS with matched length within 0.13 mm (5 mil) and 100 ohm differential impedance. Place series AC-coupling capacitors for LVDS at the receiver side. Add ground stitching vias every 1/10 wavelength of the highest clock harmonic. Place the AS configuration flash within 100 mm of the FPGA to avoid signal degradation on the AS data and clock lines. Reference Altera Cyclone IV Handbook Chapter 7 for recommended escape routing patterns for the F17 BGA.
Información de cumplimiento
RoHS and REACH compliant per Altera product page. Standard variant is not AEC-Q100; refer to Altera automotive-grade SiC part variants for AEC-Q100 qualified equivalents. Lead-free and halogen-free assembly processes are supported.
