EP4CGX50DF27C8 - Cyclone IV GX FPGA 49,888 LE | Altera | 672-FBGA
N.º de pieza: EP4CGX50DF27C8 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $142.5 | $142,50 |
| 10 | $128.25 | $1.282,50 |
| 100 | $114 | $11.400,00 |
| 500 | $99.75 | $49.875,00 |
| 1.000 | $85.5 | $85.500,00 |
EP4CGX50DF27C8 Descripción general
What is an FPGA? A field-programmable gate array is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect. FPGAs occupy the middle ground between fixed-function ASICs (lowest per-unit cost, highest NRE) and microcontrollers (software-defined, fixed silicon), offering hardware-level parallelism and reconfigurable I/O that can be updated after deployment. Cyclone IV GX specifically targets cost-sensitive, transceiver-rich applications such as industrial video bridging and low-cost serial connectivity.
Key features include 150 embedded 18x18 multipliers for DSP, support for external memory interfaces (DDR2, DDR3, LPDDR2, QDRII+), and eight full-duplex transceiver channels with integrated physical coding sublayer (PCS) and physical medium attachment (PMA). The device also provides 4 PLLs, 16 global clock networks, and 1.2 V core operation with on-chip voltage regulation.
The Cyclone IV GX architecture separates low-power static logic from high-speed serial transceivers, allowing designers to keep dynamic power low for the majority of glue-logic and parallel-processing fabric while still leveraging multi-gigabit serial links. The 60 nm process provides mature, high-yield silicon and predictable timing closure.
Typical applications include industrial video bridging, low-cost protocol bridging (PCIe Gen1, Gbps Ethernet, serial RapidIO), motor control and drive feedback, broadcast video processing, and point-to-point radio backhaul. The combination of transceivers and abundant logic makes it well-suited for ASIC prototyping and mid-volume production.
Design consideration: PCB layout for the FBGA-672 package requires microvia or via-in-pad technology, controlled-impedance routing for the transceiver channels, and careful power-plane stitching. Decoupling capacitor placement close to the balls is critical for switching-noise suppression.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical FPGA design guidance not found in the manufacturer datasheet alone.
Alternativas directas para EP4CGX50DF27C8 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP4CGX50DF27C8 (mismo factor de forma y huella) — difiere en Package, Speed Grade, Transceivers, Operating Temperature, Embedded Memory.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP4CGX50DF27C8N
✅ Sustitución directa✓ En stock
$49.1 / unidad
Ver hoja de datos →EP4CGX50DF27C7N
✅ Sustitución directa✓ En stock
$58.6 / unidad
Ver hoja de datos →EP4CGX50DF27C7
✅ Sustitución directa✓ En stock
$49.1 / unidad
Ver hoja de datos →EP4CGX50DF27C6N
✅ Sustitución directa✓ En stock
$155 / unidad
Ver hoja de datos →EP4CGX50DF27C6
✅ Sustitución directa✓ En stock
$45.75 / unidad
Ver hoja de datos →EP4CGX50DF27C8 Valores máximos y características eléctricas
| Family | Cyclone IV GX |
| Logic Elements (LE) | 49,888 |
| Logic Array Blocks (LABs) | 3,118 |
| Embedded Memory | 2,562,048 bits (2,502 Kbit) |
| Embedded 18x18 Multipliers | 150 |
| User I/Os | 310 |
| Transceivers | 8 channels (up to 3.125 Gbps) |
| PLLs | 4 |
| Global Clock Networks | 16 |
| Core Voltage | 1.2 V |
| Process Technology | 60 nm low-power CMOS |
| Encapsulado | 672-ball FBGA (F27, 27x27 mm) |
| Tipo de montaje | Surface Mount (BGA) |
| Speed Grade | 8 |
Guía de configuración de pines de EP4CGX50DF27C8 672-ball fbga (f27, 27x27 mm)
Configuración de pines para EP4CGX50DF27C8 (encapsulado 672-ball fbga (f27, 27x27 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP4CGX50DF27C8.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP4CGX50DF27C8 es adecuado para 6 aplicacións: Industrial Video Bridge, Protocol Bridging (PCIe, Ethernet, sRIO), Motor Control and Drive Feedback, ASIC Prototyping, Broadcast Video Processing, Point-to-Point Radio Backhaul.
Industrial Video Bridge
The EP4CGX50DF27C8 is well-suited to industrial video bridge applications because its 8 integrated transceivers (up to 3.125 Gbps) handle SDI, HDMI-over-SDI, and DisplayPort AUX channels without external PHY devices. With 49,888 logic elements and 150 18x18 multipliers, it has ample fabric for color-space conversion, scaling, and frame-buffer management. Placed between a video source and a downstream processor, the FPGA bridges proprietary camera interfaces to standard broadcast formats; the commercial temperature grade suits controlled-environment broadcast studios, while designers should switch to the industrial-grade variant for harsh factory or outdoor installations.
Recomendado
Protocol Bridging (PCIe, Ethernet, sRIO)
For low-cost protocol bridging between PCIe Gen1, Gbps Ethernet, and serial RapidIO, the EP4CGX50DF27C8's transceiver macros implement the integrated PCS/PMA hard IP, eliminating external PHY cost and latency. The 49,888 logic elements provide headroom for custom DMA engines and protocol state machines. Positioned as a root-complex or endpoint bridge, it converts one fabric protocol to another while preserving timing margins; the speed-grade 8 timing model meets PCIe Gen1 2.5 GT/s requirements comfortably and supports GbE 1000BASE-X with margin.
Recomendado
Motor Control and Drive Feedback
The EP4CGX50DF27C8 fits motor control and drive feedback loops because its 150 18x18 multipliers execute field-oriented-control (FOC) math, while the 310 user I/Os handle multi-axis encoder inputs (EnDat, BISS, SSI, incremental). The 8 transceivers support absolute serial encoder protocols like EnDat 2.2 and HIPERFACE DSL over long cable runs. In a typical servo drive, the FPGA implements the current/torque loop in hardware alongside position-loop feedback; commercial temperature rating suffices for IP54 cabinet installations, while industrial-grade variants handle directly-mounted motors.
Recomendado
ASIC Prototyping
The 49,888 logic elements and 2,562,048 bits of embedded memory in EP4CGX50DF27C8 provide sufficient capacity to prototype mid-complexity ASIC designs before mask production. External DDR2/DDR3/LPDDR2 memory interfaces with dedicated hard controllers let prototype firmware run against realistic workloads. As a prototyping vehicle, designers partition ASIC RTL across multiple Cyclone IV GX devices; speed-grade 8 timing closure matches the typical 100-150 MHz ASIC clock domain, and the commercial temperature grade is adequate for lab characterization.
Recomendado
Broadcast Video Processing
For broadcast video processing equipment, the EP4CGX50DF27C8 combines eight 3.125 Gbps transceivers (SDI rates up to 3G-SDI/1080p60) with sufficient DSP blocks for real-time de-interlacing, scaling, and overlay. The 310 user I/Os accommodate multiple SDI inputs, GPIO for tally/audio embedders, and DDR memory for frame buffering. In a typical video switcher frame, multiple Cyclone IV GX devices cooperate to switch and process SDI streams; commercial temperature rating suits climate-controlled studios but not mobile broadcast trucks.
Recomendado
Point-to-Point Radio Backhaul
The EP4CGX50DF27C8 supports point-to-point microwave backhaul radios because its transceivers connect directly to IF or baseband ADCs/DACs at gigabit rates, while the FPGA fabric implements forward error correction (FEC), encryption, and adaptive modulation. With 49,888 LEs, designers can integrate LDPC or Turbo decoders in fabric alongside packet processing. In outdoor radio units, designers must select the industrial-temperature variant; the commercial-temperature EP4CGX50DF27C8 is suited to indoor aggregation or hub equipment.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP4CGX50DF27C8 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP4CGX50DF27C8N | EP4CGX50DF27C7N | EP4CGX50DF27C7 | EP4CGX50DF27C6N | EP4CGX50DF27C6 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 672-FBGA (F27, 27x27 mm) | 672-FBGA (F27) - same | 672-FBGA (F27) - same | 672-FBGA (F27) - same | 672-FBGA (F27) - same | 672-FBGA (F27) - same |
| Logic Elements | 49,888 | 49,888 | 49,888 | 49,888 | 49,888 | 49,888 |
| Speed Grade | 8 (fastest) | 8 | 7 | 7 | 6 | 6 |
| Lead-Free | No | Yes (Pb-free) | Yes (Pb-free) | No | Yes (Pb-free) | No |
| Transceivers | 8 (up to 3.125 Gbps) | 8 (3.125 Gbps) | 8 (3.125 Gbps) | 8 (3.125 Gbps) | 8 (3.125 Gbps) | 8 (3.125 Gbps) |
| Embedded Memory (Kbits) | 2,502 | 2,502 | 2,502 | 2,502 | 2,502 | 2,502 |
| User I/Os | 310 | 310 | 310 | 310 | 310 | 310 |
Diferenciadores clave
- Highest Fmax speed grade available for 50K-LE Cyclone IV GX in F27 (frente a EP4CGX50DF27C7N)
- Lead-free compliant variant available in same package (frente a EP4CGX50DF27C8N)
- Maximum logic density in 50K-LE Cyclone IV GX family (frente a EP4CGX30CF23C8)
- 672-FBGA F27 package enables 310 user I/Os (frente a EP4CGX50CF23I7N)
Notas de diseño
The FBGA-672 (F27) package requires microvia or via-in-pad PCB technology for reliable assembly. Use 0.4 mm pitch with non-solder-mask-defined (NSMD) pads; via-in-pad with copper filling plus planarization is recommended for ground and high-speed signal balls. Run at least 6 PCB layers (4 signal + 2 power/ground planes) to provide adequate power distribution and reference planes for transceiver channels.
Transceiver channels (8 pairs) require 100-ohm differential impedance with continuous reference plane. Keep transceiver trace lengths matched within 0.13 mm for each differential pair, and avoid crossing plane splits. AC-coupling capacitors (0.1 uF) on transmit pairs must be placed within 5 mm of the FPGA ball, with controlled via count. Reference the Cyclone IV GX Device Handbook pin connection guidelines for the F27 ballout details.
The EP4CGX50DF27C8 requires multiple supply rails: VCCINT (1.2 V core), VCCA (2.5 V PLL analog), VCCD_PLL (1.2 V PLL digital), VCCIO (1.2-3.3 V I/O banks), and VCHIP_GXB (1.2-1.5 V transceiver). Estimated: total quiescent current is approximately 1-2 A for VCCINT plus 0.5-1 A per active transceiver channel. Place 0.1 uF + 10 uF decoupling caps within 5 mm of every supply pin to suppress switching noise; high-frequency decoupling must use X7R or X5R ceramics with low ESL.
For PCIe Gen1 implementation, the integrated transceivers meet the PCIe 2.5 GT/s specification but the design must follow PCIe CEM card Electromechanical Specification. AC-coupling caps on transmit pairs must be PCIe-compliant (no resistors in series). Reference Altera AN 456 (Cyclone IV GX PCIe Gen1x4 Reference Design) for the complete reference schematic, PCB stackup, and bitstream example.
Do not leave unused transceiver channels floating - tie the unused TX pins to ground through 10 kohm resistors and leave RX pins open, as specified in the Cyclone IV GX Device Handbook. Failure to properly terminate unused transceivers can cause noise coupling and power-supply noise that affect active channels. Configuration pins (MSEL[3:0]) must be set per the desired configuration scheme (AS, PS, JTAG) before power-up.
Información de cumplimiento
EP4CGX50DF27C8 (without 'N' suffix) is the non-lead-free variant per FindIC comparison data. EP4CGX50DF27C8N is the Pb-free drop-in alternative. RoHS, REACH, halogen-free, and conflict minerals compliance status not available from verified web data; consult Altera (Intel) product compliance documentation.
