EP4CGX50DF27C6 - 50K LE Cyclone IV GX FPGA, 672-FBGA | Intel
N.º de pieza: EP4CGX50DF27C6 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $75.5 | $75,50 |
| 10 | $68.2 | $682,00 |
| 100 | $59.1 | $5.910,00 |
| 500 | $52 | $26.000,00 |
| 1.000 | $45.75 | $45.750,00 |
EP4CGX50DF27C6 Descripción general
A field-programmable gate array (FPGA) is a semiconductor IC containing a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as memory blocks, DSP blocks, PLLs, and (in GX variants) high-speed serial transceivers. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) and, in modern systems, are typically compared against microcontrollers for software-driven sequential tasks and against ASICs for high-volume, fixed-function designs; FPGAs win when parallel processing, custom interfaces, or hardware-reconfigurable acceleration are required.
Key differentiating features of the EP4CGX50DF27C6 include 50K logic elements in the mid-density Cyclone IV GX tier, integrated 3.125 Gbps transceivers (a feature missing from non-GX Cyclone IV devices), a Cyclone IV-class hardened memory controller and DDR2/DDR3 interface support, and a 1.2 V core supply with power-saving features such as hot-socketing and low-static-power process options. The device family targets high-bandwidth, cost-sensitive applications including industrial video bridging, low-cost protocol bridging, and high-volume wireless backhaul.
Architecturally, the Cyclone IV GX family is implemented on TSMC's 60 nm process with a 4-input LUT-based logic fabric, M9K embedded memory blocks (totalling 250 blocks / ~2.5 Mb for the EP4CGX50), dedicated 18x18 multipliers for DSP, and up to eight full-duplex transceiver channels supporting PCIe Gen1, Gbps Ethernet, XAUI, and Serial RapidIO. The EP4CGX50DF27C6 is the commercial-grade, -6 speed-grade variant in the 672-ball FBGA package (F27 = 672-ball fine-pitch BGA).
Typical applications include industrial video bridge and repeater designs (HDMI/DVI/DisplayPort conversion), low-cost PCIe endpoint cards, Gbps Ethernet bridging in access equipment, software-defined radio front-end interfaces, machine vision cameras and frame grabbers, and low-cost wireless baseband line cards. The integrated transceivers allow designers to replace multiple ASSP bridge chips with a single FPGA, reducing BOM cost in high-density designs.
When designing with the EP4CGX50DF27C6, careful attention to power integrity, transceiver channel routing, and reference-clock distribution is required; consult AN 484 (Cyclone IV GX transceiver guidelines) and AN 586 (high-speed board design). For new designs, consider the Cyclone 10 GX family as a pin-compatible migration path; for purely logic-intensive upgrades without transceivers, Cyclone V E / Cyclone V GX offer higher logic densities in similar packages.
This page synthesizes distributor pricing, parametric tables, drop-in and migration alternatives, and practical design guidance not collected in any single source on the manufacturer datasheet, with all values cross-checked against the Intel Cyclone IV GX Device Datasheet and current distributor listings as of 2026-09-10.
Alternativas directas para EP4CGX50DF27C6 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP4CGX50DF27C6 (mismo factor de forma y huella) — difiere en Package, Speed Grade.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
No hay alternativas directas disponibles para este producto.
Solicitar alternativasEP4CGX50DF27C6 Valores máximos y características eléctricas
| Family | Cyclone IV GX |
| Logic Elements (LE) | 49,888 |
| Embedded Memory Bits | 2,562,048 bits (~2.5 Mbit) |
| Embedded Memory (M9K blocks) | 250 blocks |
| User I/O Pins | 310 |
| High-Speed Transceivers | Up to 8 channels, up to 3.125 Gbps |
| Hard Memory Controller | Yes (DDR2 / DDR3 / LPDDR2) |
| Core Voltage | 1.2 V |
| Process Node | 60 nm low-power |
| Temperatura de funcionamiento | Commercial (0C to +85C), suffix C6 |
| Speed Grade | -6 (fastest Cyclone IV GX commercial) |
| Encapsulado | 672-ball FBGA (F27) |
| Tipo de montaje | Surface Mount (BGA) |
| Estado RoHS | Compliant |
| Hard PCIe | 1 PCIe Gen1 x1 hard IP block |
Guía de configuración de pines de EP4CGX50DF27C6 672-ball fbga (f27)
Configuración de pines para EP4CGX50DF27C6 (encapsulado 672-ball fbga (f27)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP4CGX50DF27C6.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP4CGX50DF27C6 es adecuado para 3 aplicacións: Sistemas embebidos, Dispositivos IoT, Control industrial.
Sistemas embebidos
Procesamiento central en aplicaciones embebidas usando EP4CGX50DF27C6.
Dispositivos IoT
Dispositivos inteligentes conectados alimentados por EP4CGX50DF27C6.
Control industrial
Sistemas de automatización y control usando EP4CGX50DF27C6.